Equilibrium Carrier Transport
Equilibrium Carrier Flows
Electron : diffusion flow n p, drift flow p n
At equilibrium,
diffusion flux = drift flux for electrons & holes
Band diagram explanation
Carrier distribution at equilibrium : Boltzmann distribution
Electrons of energy E-Ec < qVb cannot overcome the barrier
energy, only the els E-Ec > qVb can diffuse to p-side
While small concentration of n in p- side drift to n-side
Similar explanation for holes flow
qVb Ec
EF
Ev
E
n drift n diffusion
p drift p diffusion
Applied bias
By convention : apply voltage (Va) on p-side with respect to n-side
Positive (Forward, Vf) or negative (Reverse, Vr) bias
Built-in potential
– Vb increases for reverse bias and decreases for forward bias
pn Junction with Bias
Depletion width
Since
w increases for reverse bias and decreases for forward bias
p n
+ _
V
xV
b V
b V
aForward bias : Reverse bias :
V V V V
V V V V
b a b f
b a b r
V V q N N
N N w
b a
s
D A
D A
1
2
2
x V V
q
N
N N N
n
s o b a A
D D A
2
( )
x V V
q
N
N N N
p
s o b a D
A D A
2
( )
qNA
pn Junction with Bias
Band diagram
p-side goes up for reverse bias and goes down for forward bias
Electric field
-xpo xno
r
qND
x
E
Ec
Ev
E
x
E o
o s
n D o
x qN
E
Transport with Bias
Biased Junctions
Steady state response of pn junction
Bias = external applied voltage. By convention the bias is applied on p- side of the junction.
Most of the bias voltage drops (is consumed) accross the space charge region (Neutral regions have a lot of free carriers thus voltage drop is small)
Forward bias = (+) voltage on p- side barrier energy Vb reduce to Vb-Vf
Reverse bias = (-) voltage on p- side barrier energy Vb increase to Vb+Vr
Bias voltages control the diffusion barrier hill height and thus control the diffusion fluxes
p n
+
V
a _q(Vb-Va) qVa
Ev n drift n diffusion
Transport with Bias
Diffusion current
Drift current?
Drift current is not limited by how fast, but is limited by how often
In any bias condition, the elect field is strong enough for free carriers in the space charge region to sweep down
Only the carriers within diffusion length Ln or Lp from the edge of the space charge region contribute
These carriers are thermally
generated minority carriers within Ln or Lp, thus small number : call GENERATION CURRENT
Therefore drift current in junction is small and practically independent of the bias condition constant At equilibrium
n n qV
diff o
kT
a
exp
e drift p
n Ln
G
I I qV
n
kT
diff
o
n a
exp
I
n I
ndiff I
ndrift 0
I V I V
I I
n diff
a n
drift a n
gen
o n
( ) ( )
0 0
Diode Equation
Total current equation
with
: ideal diode equation
Assymetric I-V curve enables the rectifying function of diodes
Diffusion current is important near the pn junction
I I qV
tot o
kT
a
exp 1 I
V
a0
0
-I
oexponential diffusion current
constant generation current
forward reverse bias
E 0 E ~0 bias E ~0
diffusion
drift drift
p n
I
o I
on I
opDiode Currents
Assumptions
Steady state One dimensional Low-level injection
Processes of diffusion, drift, and thermal G-R only
Currents
Total current density is constant throughout the diode
Quasi-neutral region
E ~ 0 and dn=dDn, thus
Steady state continuity eq. applies
Injected carrier distributin
Above solution for x>xn or x<-xp do not know about Jtot
dx qD dp p
q J
dx qD dn n
q J
x J x J J
AJ I
p p
p
n n
n
p n
E E
) ( )
(
0 0
2 2
2 2
D n
x
n x x
D p
x
p x x
n
p p
n
p
p
n n
p
n
D D
D D
J qD d n
dx x x
J qD d p
dx x x
n n p
p p n
D D
D D
D D
n x n e x x
p x p e x x
p p
x L
p
n n
x L
n n
p
( ) ( )
/ /
Diode Currents
Depletion region
In the depletion region
If thermal G-R is negligible, dJn/dx=0 and Jn=constant
Therefore From
Since
Therefore for the injected holes
Similarly for the injected electrons
* Refer the book derivation
p x
p x
qV kT
po p
no n
( ) b
( ) exp
p x p x
q V V kT
p x
p x
qV kT
p p
n n
b a
po p
no n
a
( )
( ) exp
( )
( ) exp
pp(xp) ppo(xp)Dpp(xp) ppo(xp) p x
p x
p x
p x
qV kT p x
p x
qV kT
p p
n n
po p
no n
a
p p
no n
a
( )
( )
( )
( ) exp
( )
( ) exp
p x p x qV
n n no n kT
( ) ( ) exp a
Dp x
p x p x
p x qV
kT
n n n n no n
no n
a
( ) ( ) ( )
( ) exp
1
n
t q
dJ dx
n t
p n p
G R
1 0
J x x x J x
J x x x J x
n p n n p
p p n p n
( ) ( )
( ) ( )
J
J
n(x
p) J
p(x
n)Dn n x qV
p po p
kT
a
( ) exp 1
Diode Currents
Injected carriers behavior
Redefine the x coordinate for p and n x' = x-xn and x" = -(x+xp)
with boundary conditions of
Therefore
and
With similar expressions for els, the total current density
J x qD d p x dx
qD
L p x qD
L p e e
p p
n p
p n
p p
no
qVa kT x Lp
( ) ( )
( )
/ /
D D
1
D p
n( x ) D p
no( ) 0 e
x /LpDp
n( x ) 0
D D
D
p x p e e
p e
n no
qV kT x L
n
x L
a p
p
( )
( )
/ /
/
1 0
xn -xp
x' x''
p n
I A J x J x
qA D
L p D
L n e
I qA D
L p D
L n
n p
p p
no
n n
po
qV kT
o
p p
no
n n
po
a
( ) ( )
/
0 0
1
with
Diode Currents
Ideal I-V curve
for Va > few kT/q
Saturation current I
oSince pno=ni2/ND, etc, different
semiconductors show different Io
smaller gap shows larger saturation current for the same doping
For high-low junctions, highly doped side term is negligible for p+n diode
In general, heavily doped side can be ignored in the electrical characteristics of the junction (as in most real diodes)
I
V
a0
0
-I
oIoexp(qVa/kT)
ln( ) I ln( I ) q kT V
o a
V
a0
0
slope=q/kT ln(Io)
ln(I)
I qA D
L p D L n
o
p p
no n n
po
I qA D L p
o
p p
noFigure assumed NA > ND
Total current density constant everywhere in the diode
The injected minority carrier current decays by recombining with the majority carriers
Thus the same amount of majority carrier current decreases making overall current becomes Itot
In the depletion region the currents Jn and Jp are constant
In the neutral region far from the junction, only the majority carriers make the current by drift
Even we approximated that E ~ 0 in the neutral region, there are small E with large carrier concentration
drift current of Itot
Carrier Currents
x
Jn
xn
J
Jp
-xp
p n
majority
minority
J
totCarriers Concentration
Forward bias
Note that the log scale, Dp > Dn If NA >> ND , Dp >> Dn Hole injection only J Jp
Reverse bias
Zero minority carriers at xn=0 and xp=0. Minority Carrier Extraction
lo g(n ,p )
x
xn ND
-xp
p n
NA
pno npo
nno ppo
Dp p qV
kT p
n no
r
no
exp 1
Dnp
n
polo g(n ,p )
x
xn ND
-xp
p n
NA
pno npo
nno ppo
Dp Dn
Non-equilibrium carrier concentrations
in the depletion region : Law of the Junction
In the far neutral region Fn and Fp is for the equilibrium state
The variation in the depletion region would be monotonic though exact level cannot be determined point-by- point
From the law of the junction flat Fermi energies are generally assumed
Fermi Levels of Biased Junction
qVf Ev
Fn Ec
Fp Injection
region
n n F E
kT
p n E F
kT
i
n i
i
i p
exp
exp
np n F F
kT n qV
i i kT
n p a
2 2
exp exp
qVr Ev
Fn Ec
Fp
Deviation from Ideal
Experimental I-V
Breakdown at high reverse bias Slope over at high forward bias (Va
> ~0.7 V)
Slope of q/2kT for Va < ~0.35 V Large reverse biasing of pn junction causes sudden large increase of reverse current : breakdown
lo g(I )
V
a0
0
q/kT
q/2kT reverse bias
breakdown
G-R current in the depletion region
diffusion term
slope-over region
Breakdown
Breakdown voltage (VBR) depends on the doping concentrations
For high-low junctions
with NB = doping conc of lightly doped side
Junction Breakdown is recoverable process, not permanent
Breakdown processes are Avalanche and Zener BD
Reverse Bias Breakdown
V
BR 1 / N
B0.75V
BRN
D orN
A1000
Avalanche region 100
1 10
1014 1015 1016 1017 1018 slope=-0.75
GaAs Si
Ge
Reverse Bias Breakdown
Avalanche BD
Lightly doped pn jct
For small reverse bias, electron mean free path (~10-6 cm)<< depletion width (~
10-4 cm)
Carriers lose energy by collision with atoms and it is dissipated by heat
At large reverse bias, the energy transfer is sufficient to ionize atoms and create EHPs : Impact Ionization
The generated carriers make additional impact ionization resulting in carrier multiplication avalanche process
VBD > ~6.7 V for Si
Sloping rather than sharp BD
Larger VBD with T increase due to smaller collision distance
Ev Ec
E
Lattice collision &
heat dissipation
V N N
N N E q
BR
A D
A D
6 g /
Ev Ec
carrier
multiplication
Zener BD
Highly doped pn jct with small depletion width w
E is large due to small w, ~ 106 V/cm
w increases with reverse bias, but the thickness of the potential
energy barrier d decreases
Tunneling through d (d < ~10-6 cm for tunneling) : require > ~1017 cm-3 doping for Si
VBD > ~4.5 V for Si
Smaller VBD with T increase
Reverse Bias Breakdown
Ev Ec
tunneling
filled states
empty states w
d
V
BR 4E
g /q
G-R Current
In ideal diode, G-R term is neglected in the depletion region
For rev bias where carrier conc
decrease below equil value thermal G-R component is important
I increases with bias since w increases with rev bias
For forw bias, large carriers recombine in the depletion region
IG-R at forward bias
with
h
~2G-R term is dominant at small forward
bias Ev
Ec
G-R current
Ev Ec
ideal diode current
R-current
I qAn
G R w
i o
2
IG R exp qVA /hkT
High Current Phenomena
High Level Injection
As Va > Vb (negligible barrier height), Dp > nno ~ND (minority carrier conc approaches to doping conc in the lightly doped side)
Accordingly increased majority carrier conc for charge neutrality
Slope-over region exists
Junction resistance reduces, thus jct voltage drop (VJ) becomes smaller
The voltage drop in the neutral regions is now comparatively large (Series resistance)
lo g(n ,p )
x
xn
ND
-xp
p n
NA
pno npo
nno ppo
Dp Dn
I
Hi inj expqV
A / 2kT
Va VJ IRs