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Equilibrium Carrier Transport

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(1)

Equilibrium Carrier Transport

Equilibrium Carrier Flows

Electron : diffusion flow np, drift flow p n

At equilibrium,

diffusion flux = drift flux for electrons & holes

Band diagram explanation

Carrier distribution at equilibrium : Boltzmann distribution

Electrons of energy E-Ec < qVb cannot overcome the barrier

energy, only the els E-Ec > qVb can diffuse to p-side

While small concentration of n in p- side drift to n-side

Similar explanation for holes flow

qVb Ec

EF

Ev

E

n drift n diffusion

p drift p diffusion

(2)

Applied bias

By convention : apply voltage (Va) on p-side with respect to n-side

Positive (Forward, Vf) or negative (Reverse, Vr) bias

Built-in potential

– Vb increases for reverse bias and decreases for forward bias

pn Junction with Bias

Depletion width

Since

w increases for reverse bias and decreases for forward bias

p n

+ _

V

x

V

b

   V

b

V

a

Forward bias : Reverse bias :

V V V V

V V V V

b a b f

b a b r

  

  

V V q N N

N N w

b a

s

D A

D A

 

 1

2

2

 

x V V

q

N

N N N

n

s o b a A

D D A

 

 

 2

 

( )

 

x V V

q

N

N N N

p

s o b a D

A D A

 

 

 2

 

( )

(3)

qNA

pn Junction with Bias

Band diagram

p-side goes up for reverse bias and goes down for forward bias

Electric field

-xpo xno

r

qND

x

E

Ec

Ev

E

x

E o

o s

n D o

x qN

 

E

(4)

Transport with Bias

Biased Junctions

Steady state response of pn junction

Bias = external applied voltage. By convention the bias is applied on p- side of the junction.

Most of the bias voltage drops (is consumed) accross the space charge region (Neutral regions have a lot of free carriers thus voltage drop is small)

Forward bias = (+) voltage on p- side barrier energy Vb reduce to Vb-Vf

Reverse bias = (-) voltage on p- side barrier energy Vb increase to Vb+Vr

Bias voltages control the diffusion barrier hill height and thus control the diffusion fluxes

p n

+

V

a _

q(Vb-Va) qVa

Ev n drift n diffusion

(5)

Transport with Bias

Diffusion current

Drift current?

Drift current is not limited by how fast, but is limited by how often

In any bias condition, the elect field is strong enough for free carriers in the space charge region to sweep down

Only the carriers within diffusion length Ln or Lp from the edge of the space charge region contribute

These carriers are thermally

generated minority carriers within Ln or Lp, thus small number : call GENERATION CURRENT

Therefore drift current in junction is small and practically independent of the bias condition constant At equilibrium

n n qV

diff o

kT

  a

  exp 

e drift p

n Ln

G

I I qV

n

kT

diff

o

n a

 

  exp 

I

n

I

ndiff

I

ndrift

 0

I V I V

I I

n diff

a n

drift a n

gen

o n

(  )  (  )

 

0 0

(6)

Diode Equation

Total current equation

with

: ideal diode equation

Assymetric I-V curve enables the rectifying function of diodes

Diffusion current is important near the pn junction

I I qV

tot o

kT

 

a

 

 



exp 1  I

V

a

0

0

-I

o

exponential diffusion current

constant generation current

forward reverse bias

E  0 E ~0 bias E ~0

diffusion

drift drift

p n

I

o

I

on

I

op

(7)

Diode Currents

Assumptions

Steady state One dimensional Low-level injection

Processes of diffusion, drift, and thermal G-R only

Currents

Total current density is constant throughout the diode

Quasi-neutral region

E ~ 0 and dn=dDn, thus

Steady state continuity eq. applies

Injected carrier distributin

Above solution for x>xn or x<-xpdo not know about Jtot

dx qD dp p

q J

dx qD dn n

q J

x J x J J

AJ I

p p

p

n n

n

p n

E E

) ( )

(

0 0

2 2

2 2

   

  

D n

x

n x x

D p

x

p x x

n

p p

n

p

p

n n

p

n

 

 

D D

D D

J qD d n

dx x x

J qD d p

dx x x

n n p

p p n

  

  

D D

D D

D D

n x n e x x

p x p e x x

p p

x L

p

n n

x L

n n

p

( ) ( )

/ /

  

(8)

Diode Currents

Depletion region

In the depletion region

If thermal G-R is negligible, dJn/dx=0 and Jn=constant

Therefore From

Since

Therefore for the injected holes

Similarly for the injected electrons

* Refer the book derivation

p x

p x

qV kT

po p

no n

( ) b

( ) exp

 

 



 

p x p x

q V V kT

p x

p x

qV kT

p p

n n

b a

po p

no n

a

( )

( ) exp

( )

( ) exp

   

 



 



 



pp(xp) ppo(xp)Dpp(xp) ppo(xp) p x

p x

p x

p x

qV kT p x

p x

qV kT

p p

n n

po p

no n

a

p p

no n

a

( )

( )

( )

( ) exp

( )

( ) exp

  



 



 



 



p x p x qV

n n no n kT

( )  ( ) exp a

 



Dp x

p x p x

p x qV

kT

n n n n no n

no n

a

( ) ( ) ( )

( ) exp

 

 

 

 



 1

n

t q

dJ dx

n t

p n p

G R

  

1 0

J x x x J x

J x x x J x

n p n n p

p p n p n

( ) ( )

( ) ( )

    

   

J

J

n(

x

p) 

J

p(

x

n)

Dn n x qV

p po p

kT

  

a

 

 



( ) exp 1 

(9)

Diode Currents

Injected carriers behavior

Redefine the x coordinate for p and n x' = x-xn and x" = -(x+xp)

with boundary conditions of

Therefore

and

With similar expressions for els, the total current density

 

J x qD d p x dx

qD

L p x qD

L p e e

p p

n p

p n

p p

no

qVa kT x Lp

( ) ( )

( )

/ /

   

  

   

D D

1

D p

n

( x   ) D p

no

( ) 0 e

 x /Lp

Dp

n

( x     ) 0

 

D D

D

p x p e e

p e

n no

qV kT x L

n

x L

a p

p

( )

( )

/ /

/

  

 

 

1 0

xn -xp

x' x''

p n

 

 

I A J x J x

qA D

L p D

L n e

I qA D

L p D

L n

n p

p p

no

n n

po

qV kT

o

p p

no

n n

po

a

     

  

 

 

  

 



( ) ( )

/

0 0

1

with

(10)

Diode Currents

Ideal I-V curve

for Va > few kT/q

Saturation current I

o

Since pno=ni2/ND, etc, different

semiconductors show different Io 

smaller gap shows larger saturation current for the same doping

For high-low junctions, highly doped side term is negligible for p+n diode

In general, heavily doped side can be ignored in the electrical characteristics of the junction (as in most real diodes)

I

V

a

0

0

-I

o

Ioexp(qVa/kT)

ln( ) I ln( I ) q kT V

o a

 

V

a

0

0

slope=q/kT ln(Io)

ln(I)

I qA D

L p D L n

o

p p

no n n

   po

 



I qA D L p

o

p p

no

(11)

Figure assumed NA > ND

Total current density constant everywhere in the diode

The injected minority carrier current decays by recombining with the majority carriers

Thus the same amount of majority carrier current decreases making overall current becomes Itot

In the depletion region the currents Jn and Jp are constant

In the neutral region far from the junction, only the majority carriers make the current by drift

Even we approximated that E ~ 0 in the neutral region, there are small E with large carrier concentration

drift current of Itot

Carrier Currents

x

Jn

xn

J

Jp

-xp

p n

majority

minority

J

tot

(12)

Carriers Concentration

Forward bias

Note that the log scale, Dp > Dn If NA >> ND , Dp >> Dn  Hole injection only J Jp

Reverse bias

Zero minority carriers at xn=0 and xp=0. Minority Carrier Extraction

lo g(n ,p )

x

xn ND

-xp

p n

NA

pno npo

nno ppo

Dp p qV

kT p

n no

r

  no

 

 



  

exp 1

Dnp  

n

po

lo g(n ,p )

x

xn ND

-xp

p n

NA

pno npo

nno ppo

Dp Dn

(13)

Non-equilibrium carrier concentrations

in the depletion region : Law of the Junction

In the far neutral region Fn and Fp is for the equilibrium state

The variation in the depletion region would be monotonic though exact level cannot be determined point-by- point

From the law of the junction flat Fermi energies are generally assumed

Fermi Levels of Biased Junction

qVf Ev

Fn Ec

Fp Injection

region

n n F E

kT

p n E F

kT

i

n i

i

i p

  

 



  

 

 exp

exp

np n F F

kT n qV

i i kT

n p a

  

 

  

 

2 2 

exp exp

qVr Ev

Fn Ec

Fp

(14)

Deviation from Ideal

Experimental I-V

Breakdown at high reverse bias Slope over at high forward bias (Va

> ~0.7 V)

Slope of q/2kT for Va < ~0.35 V Large reverse biasing of pn junction causes sudden large increase of reverse current : breakdown

lo g(I )

V

a

0

0

q/kT

q/2kT reverse bias

breakdown

G-R current in the depletion region

diffusion term

slope-over region

(15)

Breakdown

Breakdown voltage (VBR) depends on the doping concentrations

For high-low junctions

with NB = doping conc of lightly doped side

Junction Breakdown is recoverable process, not permanent

Breakdown processes are Avalanche and Zener BD

Reverse Bias Breakdown

V

BR

 1 / N

B0.75

V

BR

N

D or

N

A

1000

Avalanche region 100

1 10

1014 1015 1016 1017 1018 slope=-0.75

GaAs Si

Ge

(16)

Reverse Bias Breakdown

Avalanche BD

Lightly doped pn jct

For small reverse bias, electron mean free path (~10-6 cm)<< depletion width (~

10-4 cm)

Carriers lose energy by collision with atoms and it is dissipated by heat

At large reverse bias, the energy transfer is sufficient to ionize atoms and create EHPs : Impact Ionization

The generated carriers make additional impact ionization resulting in carrier multiplication  avalanche process

VBD > ~6.7 V for Si

Sloping rather than sharp BD

Larger VBD with T increase due to smaller collision distance

Ev Ec

E

Lattice collision &

heat dissipation

V N N

N N E q

BR

A D

A D

   6 g /

Ev Ec

carrier

multiplication

(17)

Zener BD

Highly doped pn jct with small depletion width w

E is large due to small w, ~ 106 V/cm

w increases with reverse bias, but the thickness of the potential

energy barrier d decreases

Tunneling through d (d < ~10-6 cm for tunneling) : require > ~1017 cm-3 doping for Si

VBD > ~4.5 V for Si

Smaller VBD with T increase

Reverse Bias Breakdown

Ev Ec

tunneling

filled states

empty states w

d

V

BR 4

E

g /

q

(18)

G-R Current

In ideal diode, G-R term is neglected in the depletion region

For rev bias where carrier conc

decrease below equil value thermal G-R component is important

I increases with bias since w increases with rev bias

For forw bias, large carriers recombine in the depletion region

IG-R at forward bias

with

h

~2

G-R term is dominant at small forward

bias Ev

Ec

G-R current

Ev Ec

ideal diode current

R-current

I qAn

G R w

i o

  2

 

IG R exp qVA /hkT

(19)

High Current Phenomena

High Level Injection

As Va > Vb (negligible barrier height), Dp > nno ~ND (minority carrier conc approaches to doping conc in the lightly doped side)

Accordingly increased majority carrier conc for charge neutrality

Slope-over region exists

Junction resistance reduces, thus jct voltage drop (VJ) becomes smaller

The voltage drop in the neutral regions is now comparatively large (Series resistance)

lo g(n ,p )

x

xn

ND

-xp

p n

NA

pno npo

nno ppo

Dp Dn

 

I

Hi inj exp

qV

A / 2

kT

VaVJIRs

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