Cu Line Fabricated with Inkjet Printing Technology for Printed Circuit Board

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Cu Line Fabricated with Inkjet Printing Technology for Printed Circuit Board Shanghoon Seo, Ro-Woon Lee, Kwansoo Yun, Jaewoo Joung, Hee-Jo Lee, Jong-Gwan

Yook

Key Words : Micro patterning ( ), Printed circuit board ( ), Conductive nano ink (^!"# $%'& ), Conductive line (^!"# ⁽⁾ )

Abstract

Study that form micro pattern by direct ink jet printing method is getting attention recently. Direct ink jet printing spout fine droplet including nano metal particle by force or air pressure. There is reason which ink jet printing method is profitable especially in a various micro-patterning technology. It can embody patterns directly without complex process such as mask manufacture or screen-printing for existent lithography. In this study, research of a technology that ejects fine droplet form of Pico liter and forms metal micro pattern was carried with inkjet head of piezoelectricity drive system. Droplet established pattern while ejecting consecutively and move on the surface at the fixed speed. Patterns formed in ink are mixed with organic solvent and polymer that act as binder. So added thermal hardening process after evaporate organic solvent at isothermal after printing. I executed high frequency special quality estimation of CPW transmission line to confirm electrical property of manufactured circuit board. We tried a large area printing to confirm application possibility of an ink jet technology.

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