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Chp14. MS Contacts and Schottky Diodes

184

(2)

14. MS Contacts and Schottky Diodes

M / S junction

① Connection between semiconductor and outer circuit

② Interconnection between devices within ICs M / S junction types

① Rectifying contacts , blocking contacts , Schottky barrier contacts.

② Ohmic contacts , non – rectifying contacts, electrodes I

V

A

V

A

I

(3)

Assume ① no layers between M / S

② no interdiffusion between M / S

③ no impurities at interface 14. 1. IDEAL MS CONTACTS

186

(4)

Energy band diagram under equil. conditions

Figure 14. 1 Surface-included energy band diagrams for a metal (left) and n-type semiconductor (right).

E

0

: vacuum level

 : work function 

s

=  + (E

C

– E

Fs

)

Metal Semiconductor

M

E

FM

E

c

E

FS

E

V

S

E

0

E

0

Figure reference: “Semiconductor Device Fundamentals”

Robert F. Pierret, Addison-Wesley Publiching Company

(5)

At equil. , E

F

constant throughout the system.

B

= 

M

-

Figure 14.2 energy band diagrams for ideal MS contacts between a metal and an n-type semiconductor : M> S system (a) an instant after contact formation and (b) under equilibrium conditions ; M< S system (c) an instant after contact formation and (d) under equilibrium conditions.

M> S M< S

Metal n-type

semiconductor Metal n-type

semiconductor Ec

EFS EV

E0 E0

Ec EFS EV EFM

EFM

M M S

(a) (c)

B

(b) (d)

EV EV

Ec

EF Ec EF

188

(6)

Effect of biasing the M / S junctions

Figure 14.3 Response of the M > S (n-type) MS contact to an applied d.c.

bias. (a) Definition of current and voltage polarities. (b) Energy band diagram and carrier activity when VA > 0. (c) Energy band diagram and carrier activity when VA < 0. (d) Deduced general form of the I - V characteristics.

Metal n-type

semiconductor

I

(a) (b)

Ec EFS EV

I

I

(c)

Ec EFS

EV (d)

I

V

A

Figure reference: “Semiconductor Device Fundamentals”

Robert F. Pierret, Addison-Wesley Publiching Company

(7)

Figure 9-12 Ideal energy-band diagram of a metal - n - semiconductor ohmic contact (a) with a positive voltage applied to the metal and (b) with a positive voltage applied to the semiconductor

.

Table 14.1 Electrical Nature of Ideal MS Contacts.

M

 

S

M

 

S

n-type

semiconductor n-type

semiconductor

Rectifying Ohmic

Ohmic Rectifying EF

(a) (b)

Ec

EV

EV Ec EF

190

(8)

14. 2. SCHOTTKY DIODE 14. 2. 1 Electrostatics

Built – in Voltage V

bi

qV

bi

= 

B

– (E

C

– E

F

) = 

M

-

S

, ε , V

 

qN

D

0  x  W 0 x  W

x

n

W

For metal side, ε

0 , V = constant

(9)

Figure 14.4 Electrostatic variables in an MS (n-type) diode under equilibrium conditions. (a) Equilibrium energy band diagram. (b) - (d) Charge density, electric field, and electrostatic potential as a function of position.

B qVbi E

EcF

Ev

(Ec-EF)FB

(a)

x

 qND

(b)

xn = W

0 xn

-function of negative

charge

(c) 0 W E

x

(d) 0 W V

x

-Vbi

192

(10)

Using the Poisson’s eq.,

same as p

+

n diode!

Under equil. , V = -V

bi

at x = 0 When V

A

≠ 0 , V

bi

→ V

bi

- V

A

Depletion width

   

    0 x W

2

W x

0

2 0

0

x K W

x qN V

x K W

x qN

S D S

D

 

 

1/2

2

0

A bi

D

S

V V

qN

W   K  

(11)

14. 2. 2 1 - V Characteristics

Similar to pn diode.

MS diode electrostatics

shape of I – V characteristics

- Difference ? minority – carrier device majority – carrier device Ec

EFn ET

Ev

(a) p+n junction diode

EFP

IDIFF Negligible

IR-G

Ec EFS ET

Ev

(b) MS diode

0 W x

B

Dominant q(Vbi – VA)

Figure 14.5 Negligible and dominant current components in a forward-biased (a) p+-n junction diode and (b) MS diode.

194

(12)

• thermionic emission current

• A

*

Richardson’s Constant

Schottky barrier lowering (in reverse bias)

B0

: barrier height at ε = 0 at the MS interface ε : electric field at the semiconductor surface

B

= 

B0

-

B

 

195

kT S

kT qV S

B A

e T AA I

e I I

2 /

*

/

1

2 / 1

4

0

 

 

 

  

S s

B

K

q q

(13)

Figure 14.6 Measured I-V characteristics derived from a MBR040 MS diode : (a) forward bias ; (b) reverse bias. The dashed lines in (a) are theoretical

estimates of the diffusion (IDIFF) and recombination-generation (IR-G) currents flowing in the diode. The experimental data were obtained employing an

HP4145B Semiconductor Parameter Analyzer.

VA(volts) 10-1

10-3 10-5 10-7 10-9 10-11 I (A)

VA(volts)

-50 -40 -30 -20 -10 0

0 0.2 0.4 0.6 0.8 1.0

(a) (b)

-1.0 -0.8 -0.6 -0.4 -0.2 0

q/kT

IR-G

IDIFF

I (

)

196

(14)

14. 2. 3 a. c. Response

Small a.c. bias (~mV) super imposed on a d.c. bias (V

A

)

→ change fluctuation inside the diode

→ small a. c. current

→ capacitance measurement

Figure 14.7 Charge fluctuations inside an MS (n-type) diode in response to an applied a.c. signal. |va| ≪ Vbi – VA.

n-type +va- +VA-

W

x

Figure reference: “Semiconductor Device Fundamentals”

Robert F. Pierret, Addison-Wesley Publiching Company

(15)

A : 극판면적

From the slope of vs. V

A

From the intercept at

→ N

D

→ V

bi

(and 

B

)

198

 

1/2

0

0 0

0

2 

 

 

A bi

D S

S S

S

V qN V

K

A K

W A K

d A C K

bi A

S

D

K A V V

qN

C  

2 0 2

2 1

2

1 C

1 0

2

C

(16)

14. 3. PRACTICAL CONTACT CONSIDERATIONS 14. 3. 1 Rectifying Contacts

MS contacts deviate from the ideal case,

• native oxide (5Å ~ 25Å)

• “ surface states ”

B

≠ 

M

-

(17)

E

c

E

v

Relative density of surface states →

Figure 3.16 Approximate

distribution of Tamm-Schottkley states in the diamond lattice.

8

The distribution appears to peak

sharply at an energy roughly one- third of the bandgap above E

v

200

(18)

14. 3. 2. Ohmic Contacts

→ Ohmic contacts

Practically, all MS contacts are Schottky barriers in nature.

Ideally , 

M  S

(n – type)

M  S

(p – type)

(19)

Figure 14.10 Ohmic contact formation. (a) Heavy doping of the semiconductor beneath the MS contact to facilitate ohmic contact formation. (b) Emission currents across a barrier-type contact as a function of doping. The emission is shown varying from solely thermionic emission at low semiconductor dopings to predominantly field emission (tunneling through the barrier) at high semiconductor dopings.

SiO2

Metal

N+ N - Si

(a)

Low doping

(b) Moderate doping

High doping

202

(20)

Figure 3.22 diagrams for ideal metal-semiconductor Schottky diodes.

Thermal- Equilibrium Band Diagram

Thermal- Equilibrium

Charge Distribution

Electric Field

Band Diagram (Forward bias)

Band Diagram (Reverse Bias)

n - type semiconductor p - type semiconductor

Figure reference: “Semiconductor Device Fundamentals”

Robert F. Pierret, Addison-Wesley Publiching Company

(21)

Schottky Barrier Lowering

Electron energy

Figure 3.9 Classical energy diagram for a free electron near a plane metal surface at the thermal equilibrium [E1(x)]. and with an applied field – Ex[E2(x)].

Metal

x Semiconductor

q

qB qB0

E1(x) for zero field

E2(x) for constant applied field - Ex

0 xm

204

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