Chp14. MS Contacts and Schottky Diodes
184
14. MS Contacts and Schottky Diodes
M / S junction
① Connection between semiconductor and outer circuit
② Interconnection between devices within ICs M / S junction types
① Rectifying contacts , blocking contacts , Schottky barrier contacts.
② Ohmic contacts , non – rectifying contacts, electrodes I
V
AV
AI
Assume ① no layers between M / S
② no interdiffusion between M / S
③ no impurities at interface 14. 1. IDEAL MS CONTACTS
186
Energy band diagram under equil. conditions
Figure 14. 1 Surface-included energy band diagrams for a metal (left) and n-type semiconductor (right).
E
0: vacuum level
: work function
s= + (E
C– E
Fs)
Metal Semiconductor
ME
FME
cE
FSE
V
SE
0E
0
Figure reference: “Semiconductor Device Fundamentals”
Robert F. Pierret, Addison-Wesley Publiching Company
At equil. , E
Fconstant throughout the system.
B
=
M-
Figure 14.2 energy band diagrams for ideal MS contacts between a metal and an n-type semiconductor : M> S system (a) an instant after contact formation and (b) under equilibrium conditions ; M< S system (c) an instant after contact formation and (d) under equilibrium conditions.
M> S M< S
Metal n-type
semiconductor Metal n-type
semiconductor Ec
EFS EV
E0 E0
Ec EFS EV EFM
EFM
M M S
(a) (c)
B
(b) (d)
EV EV
Ec
EF Ec EF
188
Effect of biasing the M / S junctions
Figure 14.3 Response of the M > S (n-type) MS contact to an applied d.c.
bias. (a) Definition of current and voltage polarities. (b) Energy band diagram and carrier activity when VA > 0. (c) Energy band diagram and carrier activity when VA < 0. (d) Deduced general form of the I - V characteristics.
Metal n-type
semiconductor
I
(a) (b)
Ec EFS EV
I
I
(c)
Ec EFS
EV (d)
I
V
AFigure reference: “Semiconductor Device Fundamentals”
Robert F. Pierret, Addison-Wesley Publiching Company
Figure 9-12 Ideal energy-band diagram of a metal - n - semiconductor ohmic contact (a) with a positive voltage applied to the metal and (b) with a positive voltage applied to the semiconductor
.
Table 14.1 Electrical Nature of Ideal MS Contacts.
M
S
M
Sn-type
semiconductor n-type
semiconductor
Rectifying Ohmic
Ohmic Rectifying EF
(a) (b)
Ec
EV
EV Ec EF
190
14. 2. SCHOTTKY DIODE 14. 2. 1 Electrostatics
Built – in Voltage V
biqV
bi=
B– (E
C– E
F) =
M-
S
, ε , V
qN
D0 x W 0 x W
x
n W
For metal side, ε
0 , V = constant
Figure 14.4 Electrostatic variables in an MS (n-type) diode under equilibrium conditions. (a) Equilibrium energy band diagram. (b) - (d) Charge density, electric field, and electrostatic potential as a function of position.
B qVbi EEcF
Ev
(Ec-EF)FB
(a)
x
qND
(b)
xn = W
0 xn
-function of negative
charge
(c) 0 W E
x
(d) 0 W V
x
-Vbi
192
Using the Poisson’s eq.,
same as p
+n diode!
Under equil. , V = -V
biat x = 0 When V
A≠ 0 , V
bi→ V
bi- V
ADepletion width
0 x W
2
W x
0
2 0
0
x K W
x qN V
x K W
x qN
S D S
D
1/22
0A bi
D
S
V V
qN
W K
14. 2. 2 1 - V Characteristics
Similar to pn diode.
MS diode electrostatics
shape of I – V characteristics
- Difference ? minority – carrier device majority – carrier device Ec
EFn ET
Ev
(a) p+n junction diode
EFP
IDIFF Negligible
IR-G
Ec EFS ET
Ev
(b) MS diode
0 W x
B
Dominant q(Vbi – VA)
Figure 14.5 Negligible and dominant current components in a forward-biased (a) p+-n junction diode and (b) MS diode.
194
• thermionic emission current
• A
*Richardson’s Constant
Schottky barrier lowering (in reverse bias)
B0
: barrier height at ε = 0 at the MS interface ε : electric field at the semiconductor surface
B
=
B0-
B
195kT S
kT qV S
B A
e T AA I
e I I
2 /
*
/
1
2 / 1
4
0
S s
B
K
q q
Figure 14.6 Measured I-V characteristics derived from a MBR040 MS diode : (a) forward bias ; (b) reverse bias. The dashed lines in (a) are theoretical
estimates of the diffusion (IDIFF) and recombination-generation (IR-G) currents flowing in the diode. The experimental data were obtained employing an
HP4145B Semiconductor Parameter Analyzer.
VA(volts) 10-1
10-3 10-5 10-7 10-9 10-11 I (A)
VA(volts)
-50 -40 -30 -20 -10 0
0 0.2 0.4 0.6 0.8 1.0
(a) (b)
-1.0 -0.8 -0.6 -0.4 -0.2 0
q/kT
IR-G
IDIFF
I (
㎂
)196
14. 2. 3 a. c. Response
Small a.c. bias (~mV) super imposed on a d.c. bias (V
A)
→ change fluctuation inside the diode
→ small a. c. current
→ capacitance measurement
Figure 14.7 Charge fluctuations inside an MS (n-type) diode in response to an applied a.c. signal. |va| ≪ Vbi – VA.
n-type +va- +VA-
W
x
Figure reference: “Semiconductor Device Fundamentals”
Robert F. Pierret, Addison-Wesley Publiching Company
A : 극판면적
From the slope of vs. V
AFrom the intercept at
→ N
D→ V
bi(and
B)
198
1/20
0 0
0
2
A bi
D S
S S
S
V qN V
K
A K
W A K
d A C K
bi A
S
D
K A V V
qN
C
2 0 2
2 1
2
1 C
1 0
2
C
14. 3. PRACTICAL CONTACT CONSIDERATIONS 14. 3. 1 Rectifying Contacts
MS contacts deviate from the ideal case,
• native oxide (5Å ~ 25Å)
• “ surface states ”
→
B≠
M-
E
cE
vRelative density of surface states →
Figure 3.16 Approximate
distribution of Tamm-Schottkley states in the diamond lattice.
8The distribution appears to peak
sharply at an energy roughly one- third of the bandgap above E
v200
14. 3. 2. Ohmic Contacts
→ Ohmic contacts
Practically, all MS contacts are Schottky barriers in nature.
Ideally ,
M S(n – type)
M S
(p – type)
Figure 14.10 Ohmic contact formation. (a) Heavy doping of the semiconductor beneath the MS contact to facilitate ohmic contact formation. (b) Emission currents across a barrier-type contact as a function of doping. The emission is shown varying from solely thermionic emission at low semiconductor dopings to predominantly field emission (tunneling through the barrier) at high semiconductor dopings.
SiO2
Metal
N+ N - Si
(a)
Low doping
(b) Moderate doping
High doping
202
Figure 3.22 diagrams for ideal metal-semiconductor Schottky diodes.
Thermal- Equilibrium Band Diagram
Thermal- Equilibrium
Charge Distribution
Electric Field
Band Diagram (Forward bias)
Band Diagram (Reverse Bias)
n - type semiconductor p - type semiconductor
Figure reference: “Semiconductor Device Fundamentals”
Robert F. Pierret, Addison-Wesley Publiching Company
Schottky Barrier Lowering
Electron energy
Figure 3.9 Classical energy diagram for a free electron near a plane metal surface at the thermal equilibrium [E1(x)]. and with an applied field – Ex[E2(x)].
Metal
x Semiconductor
q
qB qB0
E1(x) for zero field
E2(x) for constant applied field - Ex
0 xm
204