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Development of 2.32-inch 320×350 LTPS TFT-LCD for Advanced Mobile Phones Using SLS Technology

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34.4 / L. Zhang

IMID ’05 DIGEST • 1035

Development of 2.32-inch 320×350 LTPS TFT-LCD for Advanced Mobile Phones Using SLS Technology

Lintao Zhang

LTPS Team, AMLCD Business, Samsung Electronics, Nong-seo Ri, Ki-Heung Up, Yong-In City, South Korea.

Myung-Koo Kang, Joong Sun Lee, Jong Hwa Park, , Seung Yong Joo, Kuk Chul Moon, il Kon Kim, Sung Ho Kim, Kyung Soon Park, Chun Ki Yoo and Chi Woo Kim

Abstract

2.32-inch 320×350 TFT-LCD with high resolution (206PPI) for advanced mobile phones could be successfully developed. The compact pixel design based on PMOS SLS technique is used to achieve this high resolution. Gate driver and part of data driver are integrated onto the glass substrate. High brightness (170cd) and contrast ratio (400:1) were obtained with very low flickering and crosstalk levels.

1. Introduction

Recently, as the development of the mobile applications, resolution of the display panel becomes more and more important, especially after the appearance of DMB (Digital Multimedia Broadcast), which can provide the services to watch video clips and listen to radio programs transmitted via satellite to mobile phones. For DMB phones, the resolution of qVGA (240×RGB×320) is the least configuration of the main display panel because the DMB video image is landscape qVGA.

Two mainstream processes in AMLCD for mobile display are a-Si and LTPS (low temperature poly silicon).[1] The mainstream resolution of a-Si product of a-si is under qVGA. The obstacle is that standard a-Si TFT-LCD panel has more than 1000 external connections when the resolution increases to qVGA. While for LTPS TFT-LCD, high mobility of

the carriers is the prerequisite of the realization of high performance TFT and integration of driver circuit onto glass substrates. Thus the number of connections can be reduced drastically and resolution of LCD panel can be higher than qVGA.

The essence of LTPS process is the silicon crystallization. For the time being a lot of crystallization techniques have been developed including SLS (Sequential Lateral Solidification), ELA (Excimer Laser Annealing), MILC (Metal Induced Lateral Crystallization), et al. Among these, SLS technique shows the obvious advantages on efficiency, film uniformity and performance.[2,3] In SEC, SLS technique has been the dominant technique in LTPS mass production line.

In this paper, we present a novel 2.32-inch LCD panel with the resolution of CIF+ based on our specific SLS technique. Adoption of compact pixel design and integration of gate and source driver circuits onto panel are the essential to achieve such high resolution (206PPI, pixel per inch).

2. Panel design

The panel for DMB phone is designed based on PMOS SLS process. Figure 1 shows the I-V characteristics of SLS-based PMOS TFT. Small size of pixel TFT can reach relatively high driving ability due to the high on current. Usually the leakage current

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34.4 / L. Zhang

1036 • IMID ’05 DIGEST

of LTPS TFT is higher than a-Si TFT. In this panel, dual gate TFT is designed to restrain the leakage current. The circuit diagram and cross section are shown in Figure 2.

To reach high resolution, the distance between two pixels is also decreased as much as possible. The design is shown in Figure 3. The pixel parameters are listed in Table 1.

Table1 Compact Design of panel parameters

Parameter 2.32-inch panel

Panel size (mm2) 44.85(H)×52.37(V) Display area (mm2) 39.85(H)×43.54(V)

Aperture ratio 41%

Pixel size (µm2) 41(H)×123(V) ITO-ITO (µm) 7 (H) 13.5 (V)

Black matrix (µm) 1 0 ( V) 2 7 ( H) Dead space (mm) 2.5(each side)

Gate driver blocks and parts of the source driver are integrated onto the panel to reduce the number of connections and then increase the panel resolution. All other components to drive TFT-LCD panel such as power circuits, timing controller and level shifter are integrated in a single driver IC (Figure4).

Black matrix

Glass Substrate Gate

Gate Active Data Metal

G D S

TFT area Cst

Figure 2 Circuit diagram and cross section of pixel TFT

Figure 3 Detail parameters of i l di i

1.00E-13 1.00E-12 1.00E-11 1.00E-10 1.00E-09 1.00E-08 1.00E-07 1.00E-06 1.00E-05 1.00E-04 1.00E-03

-20 -15 -10 -5 0 5 10

Gate Voltage (V)

Current (A)

Figure 1 I-V characteristics of SLS-based PMOS TFT

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34.4 / L. Zhang

IMID ’05 DIGEST • 1037

3. Results

The specifications are listed in Table2. 206PPI is one of the highest panel resolutions to be mass produced.

Parameter Spec Diagonal size (inch) 2.32

Number of pixels 320×RGB×350

PPI 206 Optical Mode Transmissive

Brightness 170 cd

Contrast ratio 400:1 Number of Color 65k/262k Color Reproducibility 50

Interface RGB

Figure 5 shows the display quality of this 2.32”

LTPS LCD panel. During our test, the panel shows stable characteristics with very low flickering and

crosstalk level.

4. Conclusions

This panel was adopted for mass production of DMB application. Test results showed that the overlap due to compact pixel design does not affect the display quality much. And adopting this panel can also reduce DMB phone set’s complexity because it does not need to be rotated when display a qVGA landscape (320×RGB×240) video image.

5. References

[1] J. Jeon, W. K. Lee, J.H. Song, and H. G. Kim, Journal of Information Display, 5, 1 (2004)

[2] T. J. King, M. G. Hack, and I. W. Wu, J. Appl.

Phys., 75, 908 (1994)

[3] S. Lim, O. K. Kwon, and I. Lee, J. Korean Phys.

Soc., 40[4], 562 (2002) Table 2 Panel specifications

Gate circuit Gate circuit

Display area 320*350 2.32” diagonal

Source circuit Driver IC Flex Cable

Figure 4 Panel blocks

Figure 5 Display photograph

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