લणணಅԳ࣑ଡଲඍ1$#ॸंଭׁুনंंࠤ
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 ଲ୍వ
 ੲஂւ
 ଲ୍ߡ
Separation of Metal Components from Abrasion Powder by Using Reverse of Gravity Sedimentation Method
Youngjin Kim, Junghoon Lee, Jinho Lim, Jae-chun Lee, Jong-gwan Ahn and Jaeryeong Lee
Abstract : In previous research, our research group has studied about disassembly of electric/electronic components from wasted printed circuit boards (WPCBs) by using surface grinding method. During this procedure, 13.9 wt%
of WPCBs was occurred to abrasion powders, which contained a mess of metals about 29.8 wt%. As a subsequent research, the authors have tested for elutriation method (reverse of gravity sedimentation) to separation of metal phase components from the abrasion powder. As for the range of +100 mesh size in abrasion powder, 97.5 wt%
of metals could be recovered at a 7 mm/s of upward-velocity in liquid-phase medium, the tube height of 100 mm.
whereas, in the case of +100 mesh size in powder, metal recovery decreases with a decrease of powder sizes.
This implies the settling velocity and its gap between metal and non-metal components decrease in proportion to their sizes.
Key words : Wasted printed circuit board, Abrasion powder, Elutriation method(reverse of gravity sedimentation), Grade, Recovery
څ أ WPCBقप॥ʽܳڅŚ՚(Cu, Fe), ŊŚ՚(Au, Ag)Ӽχ؉ɦ͆й͟ۆŚ՚ՁқںধսॠČڮ३Ś՚
ۆߌνমڱںݒÀ֨ࢅşڦॢٍĵͿ, ٍ҆ĵŔΝقԴəşćۺٍԑѪںۋڌ३ۻşۻۙҙुںä֨ࢅə
ٍĵε ьशॠٕɰ. दPCBə ٍԑߌνε ࣀ३, ҙुۋ äʽ şࣺ(dismantled PCB), äʽ ۻşۻۙҙु
(electric/electronic components, EECs) ŔνČٍԑқݕ(abrasion powder)ڷͿধսʼؽɰ. ٍ҆ĵقԴəŚ՚Ձ қۋ29.8wt% ॥ڮʽٍԑқݕڷͿҙࢢŚ՚Ձқںқνॠşڦ३ًҼܼࠞÌѪ(Elutriation method, reverse of gravity sedimentation)ںۋڌॠٕɰ. +100 mesh қݕۆąڍ, ؚԜϔݗԜ֧՚ʪ7 mm/s, ࣜҵȭۋ100 mm
՚ʪфࣜҵۆȭۋѺজق˰δŚ՚ՁқۆुڦфধսڱۆۋÀäۆǣࢍǣݓ؍ؕڷ϶ؚԜϔݗԜ֧՚
ʪ1 mm/s, ࣜҵȭۋ100 mmܓæقԴ35.7%ۆŚ՚ुڦф28.9%ۆধսڱںǣࢍǴؽɰ. ۋəٍԑқݕۆ
ۓۙࡾşÀۚ؉ݙق˰͆Ś՚/ҼŚ՚ՁқۓۙÂܛϊࠞÌ՚ʪۆۋÀÇՙʼرؚԜϔݗęʴ֨قʴъ
ҙڮʽĀęͿࣺɳʽɰ.
ܳڅر दۍթধͿşࣺ, ٍԑқݕ, ًҼܼࠞÌ, ुڦ, ধսڱ
2013ț10ښ15ێۿս, 2013ț10ښ29ێ֮ԐٰΒ 2013ț12ښ12ێóۦঝ܁
1) Ìڙʂॡİقȃݓۙڙėॡę 2) ॢĶݓݗۙڙٍĵڙġНۙڙٍĵ҆ҙ 3) ܼڙʂॡİۙڙտঞঞąėॡę
*Corresponding Author(ۋۦͺ) E-mail; [email protected]
Address; Department of Energy & Resources Engineering, Kangwon National University Chuncheon, Kangwon-do, 200-701
ISSN 2288-2790(online) http://dx.doi.org/10.12972/ksmer.2013.50.6.781
Դ
दۍթধͿşࣺ(wasted printed circuit board, WPCB) ͿҙࢢڮڌŚ՚Ձқںধսॠşڦॢۻߌνė܁ڹࡾ
ó2ÀݓѓѪڷͿқΪॣսەɰ. ߒѥݫė܁ڷͿə
ۻş/ۻۙҙु(electric/electronic components, EECs)ۋ
ۤʽԜۆWPCBεࣷ/қթॢŚ՚ՁқںԸѻ ॠəѓѪęWPCBقۤʽҙुںä֨ࢇ, қν
ٍĵȦЛ
Fig. 1. The weights and proportions of the three products after disassembling treatment using the apparatus.
ʽԓНͿҙࢢŚ՚ՁқںধսॠəѓѪۋɰ(Li et al., 2006; Eswaraiah et al., 2008; Wu et al., 2008; Das et al., 2009; Duan et al., 2009; Yoo et al., 2009; Kumar et al., 2010; Wu and Zhang, 2010; Duan et al., 2011;
Guo et al., 2011). ߒѥݫė܁ڹɰتॢܛΪۆPCBق
ۺڌۋ Àɠॠݓχ ĵν(Cu), ߏ(Fe)ˣ ܳڅŚ՚ę Ś (Au), ڹ(Ag)ˣۆŊŚ՚χںধսॠəė܁ڷͿҙ
ʽҙुق॥ڮʽй͟ۆৠڮŚ՚Ձқęڮ३ܼŚ՚
ধսфқνəҝÀɠॠɰ(Eswaraiah et al., 2008; Wu et al., 2008; Das et al., 2009; Duan et al., 2009; Yoo et al., 2009; Guo et al., 2011).
दPCBقҙʽҙुںқνॠəѓѪڷͿəşćۺ,
َۺ, জॡۺѓѪۋٍĵʼČەɰ. ॠݓχَߌνѓ֩
ڹҙुۤѓ֩ق˰͆ҙुۆқνমڱۋɵ͆ݓČ, জॡۺߌνѓ֩ڹदPCB ĵܓق˰͆ҙुқνÀ܃
ॢʼə ɳ۾ں ÀݓČ ەɰ(Li et al., 2006; Wu and Zhang, 2010; Duan et al., 2011). ۋقٍ҆ĵŔΝقԴ əɰتॢܛΪۆPCBقۺڌۋÀɠॢٍԑѪںۋڌ ॠي ۻşۻۙҙुں ä֨ࢅə ٍĵε ьशॠٕɰ (Kim et al., 2012; Lee at al., 2012). ۋė܁ںࣀ३
ߌνʽदPCBəҙुۋäʽşࣺ(dismantled board), ҙु(electric/electronic components, EECs), ٍԑқݕ (abrasion powder)ԜͿধսʼؽɰ. ÁԓНۆŚ՚ु
ڦə EECs(48.9%), abrasion powder(29.8%), dismantled board(7.5%) տڷͿঝۍʼؽɰ. ۋܼEECsٮdismantled PCBəÁۦݗՁقϑəࣷ/қթė܁ۋ߸Àʽ
قŚ՚ՁққνεڦॢԸѻė܁ق࣊ۓۋÀɠॠݓχ
ٍԑқݕۆąڍəқϊԜͿধսʼر߸Àۺۍࣷ/
қթė܁ػۋԸѻÀɠॠٕɰ. ০ٍԑқݕق॥ڮ ʽŚ՚ՁқڹܳͿĵν, Ǭ, ؉ٍ(Zn)ڷͿܓԐʼؽڷ
϶, ۋ͠ॢŚ՚Ձқںߌνॠݓ؍Čѓ࠘ॣąڍۙڙ ǯҼəН߸Àۺۍঞą١ّфԦćق؊ٖॳں
ܶսەɰČࣺɳʽɰ. ۋقٍ҆ĵقԴəٍԑқݕڷ ͿҙࢢŚ՚Ձқںқνॠşڦ३ۓʪқśں֬֨ॠٕ
Č, ÁĵÂѻًҼܼԸѻ(elutriation method, reverse of gravity sedimentation)Ѫں֬֨, ܓæѻŚ՚Ձқۆধ սڱę ुڦε ܓԐॠٕɰ.
֬ॹѓѪ
֬ॹڙΒ
҆֬ॹقԐڌʽदPCBͿҙࢢҙुқνεڦॢٍԑ ߌν, ьԦԓНڹFig. 1ęÏۋܓԐʼؽɰ. ۋٍܼ
ԑқݕ(abrasion powder)ڹ ۻߕ ԓН ܼ 13.9 wt%
(439.2 g)Ϳ, ٍԑқݕق प॥ʽ Ś՚ۆ Ҽڱڹ 29.8 wt%(130.9 g/439.2g)Ϳঝۍʼؽɰ(Fig. 1).
ٍԑқݕقप॥ʽŚ՚Ձқ, Ś՚॥͟(wt%)ںFig. 2 قǣࢍǴؽɰ. қݕǴŚ՚ՁқڹCu 20.1 wt% Pb 4.7 wt%, Al 2.9 wt%, Fe 1.2 wt%տڷͿܓԐʼؽɰ. ۋ͠
ॢқݕǴŚ՚ՁқڹPCBۆՁԜ, ۻۙҙुۆۤ
ںڦ३Ԑڌʽsoldering, şࣺǴҙۆCu ۻʪࠗۋٍ
ԑę܁قԴқݕڷͿьԦॢĀęͿࣺɳʼ϶, ٍ҆ĵق Դəٍԑқݕقप॥ʽܳڅŚ՚6 ܛΪ(Al, Cu, Fe, Ni, Pb, Zn)εধսʂԜŚ՚ՁқڷͿԸ܁ॠي֬ॹॠٕɰ.
Fig. 2. Metal and non-metal weight ratio and each metals contents for abrasion powder.
Fig. 3. Schematic diagram of this experiment.
Table 1. The result of the total weight and metal weight with a change of size ranges for abrasion powder Particle size +100 mesh
(150 )
100 × 140 mesh (150105 )
140 × 200 mesh (10575 )
200 mesh
(75 ) total
Total
weight (g) 103.9 44.7 91.1 199.5 439.2
Metal
weight (g) 59.3 17.3 20.4 33.9 130.9
Table 1ڹۓʪĵÂѻИóҼڱфŚ՚Ձқۆ॥͟
(g)ں ܓԐॢ Āęۋɰ. ٍԑқݕں 4Ò ĵÂ(+100, 100×140, 140×200, 200 mesh)ڷͿۓʪқśॢĀę, 100 mesh ࣀęٍԑқݕۆąڍۓۙࡾşÀۚ؉ݗս
ٍԑқݕۆИóҼڱۋݒÀॠٕڷǣ, ٍԑқݕǴŚ՚
Ձқۆ॥͟ڹۻߕۓʪĵÂقԴۓۙࡾşÀۚ؉ݗս
Ś՚॥͟ۋÇՙʼəąॳںǣࢍǴؽɰ(+100 mesh:
57.1 wt%, 100×140 mesh: 38.7%, 140×200 mesh: 22.4%,
200 mesh: 17%.). ۋəŚ՚ۆۻՁقۆ३ٍԑę܁
قԴҼİۺࢀۓۙۆқݕڷͿьԦॢĀęͿࣺɳʽɰ.
֨Βф֬ॹѓѪ
ٍԑқݕڷͿҙࢢ Ś՚Ձқں қνॠş ڦॢ ֬ॹѓ ѪڹԜ֧ॠəėşǣڮߕۆζںۋڌ३ۓۙεқ νॠəElutriation methodεۋڌॠٕɰ. ۋѓѪڹً
ҼܼࠞÌė܁(reverse of gravity sedimentation)ڷͿstokes’
lawÀۺڌʼرÁۓۙۆҼܼфࡾşۋͿҙࢢь ԦʼəÁۓۙۆࠞÌ՚ʪۋεۋڌॢԸѻѪۋɰ (Wills and Napier-Munn, 2006; Murugan et al., 2008;
Hettler et al., 2011).
ٍ҆ĵقԴəČҼܼۆŚ՚(metal)Ձқę۹Ҽܼۆ
ҼŚ՚(non-metal)Âۆқνεڦ३ۋѓѪںۺڌॠٕ
ڷ϶, ؚԜϔݗ(medium)ں֨Βۆۓۙқԓںڦ३ট ڌॠٕɰ.
֬ॹۤ࠘əFig. 3ęÏۋǴҙݔąۋ5 mmۍࣜҵ
(tube)εؚԜϔݗۋɺšҼ࠶قČ܁ॢ, ࣜҵٍʴ
֩ۆ ˥ݓࢥ ÀѺ՚ʪܓۼ ܁͟ऒ॒(BT100-2J, longer precision pump)قۤॠٕɰ. Ҽۋ࠶قٍĀʽࣜҵ ۆъʂठڹȭۋ500 mmۍज़ࢢҙ࠺ͤ(CL1040- 25500, Vissal) ॠɳҙۆࣜҵٍĀҙқقۤॠيऒ
॒εÀʴ֨ࢉڷͿ׆࠺ͤॠҙͿҙࢢؚԜϔݗۋ࣊ۓ
ʾսەʪԺ࠘ॠٕɰ. ٍԑқݕڹ࠺ͤԜҙقԴ࣊
ۓʼؽڷ϶, ࠺ͤۆԜҙقəॠҙͿҙࢢԜ֧ʼرѕ
ʼəؚԜϔݗںধսॣսەʪѻÒۆࣜҵεٍĀ
ॢъʂठҙқںҼۋ࠶قČ܁ॠيѕʼəؚԜ ϔݗں ধսॣ ս ەʪĵՁॠٕɰ.
ࣜҵεࣀ३ধսʽؚԜϔݗę࠺ͤǴҙۆؚԜϔݗ ڹÁÁČؚқνॠٕڷ϶, ֬ॹقԐڌʽؚԜϔݗ ڹ1ݒΪսققࣲ؎ࡔ(ethyl alcohol, 94%, Dae Jung, Korea)ںঔ०ॠيԐڌॠٕɰ. ֬ॹܓæڷͿə࠺ͤȭ ۋфǴą(500 mm, 25 mm), ֨Β࣊ۓ͟(10 g), ऒ॒
ۚʴ֨Â(10 min.)ںČ܁ॠٕڷ϶, ࣊ۓ֨Βۆۓʪĵ Â(+100, 100×140, 140×200, 200 mesh), ࠺ͤॠҙ Ϳҙࢢࣜҵۆȭۋ(100, 200, 400 mm), ؚԜϔݗۆԜ
֧՚ʪ(0.5, 1, 3, 5, 7 mm/s)εҼİܓæڷͿ֬ॹں֬
֨ॠٕɰ.
֬ॹںࣀ३ধսʽࠞÌԓНͿқνʽՁқф॥͟
ڹ Chemical Digestionں ۋڌॠي ٰۻ ڌ३֨ࢇ ˏ, ڮʪĀ०॔͆υ(ICP, Optima 7300DV, PerkinElmer, USA)εۋڌॠيқԵॠٕɰ.
Fig. 4. The characteristic of wettability of abrasion powder with change of a ratio of ethyl alcohol.
Fig. 5. Grade and recovery for metals with change of the particle size.
ĀęфČ
Fig. 4əًҼܼࠞÌė܁ق࣊ۓʼəؚԜϔݗۆܓ æںԺ܁ॠşڦॢ֬ॹڷͿ, ؚԜϔݗǴঔ०Ҽ(0, 10, 20, 30 vol%)εѺজ֨ࡈܵҼॠٕɰ. 500 ml Ҽۋ࠶ق
ٍԑқݕ5 gں࣊ۓ, 5 min.Â܁࠘ॢқԓԜε
ঝۍॠٕɰ. قࣲ؎ࡔ10 vol%ۋǴঔ०ʽڌؚۆąڍ,
ٍԑқݕۋؚԜϔݗǴقқԓʼݓ؍ڹԜͿć՚
ڮݓʼؽɰ. ъϸققࣲ؎ࡔۆ॥͟ۋݒÀ॥ق˰͆
ؚԜϔݗǴٍԑқݕۆқԓۋڌۋॠٕڷ϶, قࣲ؎ࡔ ۆ॥͟30 vol% ܓæقԴʂҙқۆٍԑқݕۋқԓԜ ڷͿܕۦ॥ںঝۍॣսەؽɰ. ۋəؚԜϔݗڌؚǴ
قࣲ؎ࡔںߐÀ॥ق˰ؚ͆ԜϔݗۋÀݕशϸۤͳۋ
ÇՙʼČ, қݕǴܕۦॠəͪݕˣڮşНۋϔݗǴق
ঔ०ʼş˺Лۋɰ. ۋًҼܼࠞÌ֬ॹۆϔݗǴق
ࣲ؎ࡔڹ 30 vol% ঔ०ڷͿ Č܁ॠٕɰ.
Fig. 5ə҆֬ॹقԴԐڌॢ࠺ͤقԴؚԜϔݗۆԜ
֧՚ʪ(3 mm/s), ऒ॒ۚʴ֨Â10 min., ॠҙͿҙࢢࣜ
ҵۆ ȭۋε 400 mmͿ Č܁ॢ ԜقԴ ۓʪĵÂں
+100, 100×140, 140×200, 200 meshڷͿѺজ֨ࡈ֬
ॹॢ Āęۋɰ. Á ۓʪĵÂѻ Ś՚ۆ ुڦə +200 mesh ܓæقԴ ۓʪۆ ࡾşÀÇՙॣս ݒÀॠٕɰ (ݒÀڱ: +100 mesh: 57.1% G72.01%, 140×200 mesh:
22.4% G75.75%). ъϸ, ۓۙۆࡾşÀۚ؉ݗսŚ śü০ÇՙʼرŚ՚ुڦ44.1%, ধսڱ34.5%Ϳঝۍ ʼؽɰ. ۋəŚ՚ՁқۆۓʪÀ࠶ݗսۓۙۆԜʂ ۺࠞÌ՚ʪÀݒÀʼر, ؚԜϔݗںধսॠəࣜҵۆ
ȭۋ(400 mm)ūݓ Ԝ֧ॠə ۓۙۆ Ҽڱۋ Çՙʼş
˺ЛقǣࢍǦĀęͿࣺɳʽɰ(Wills and Napier-Munn, 2006). ˰͆Դۓۙࡾş200 meshεşܵڷͿؚԜϔݗ ۆԜ֧՚ʪε+200 mesh(1, 3, 5, 7 mm/s), 200 mesh (0.5, 1, 3, 5 mm/s)Ϳǣɀرۋ֬ॹں֬֨ॠٕɰ.
Fig. 6(a, b, c)ڹ࠺ͤۆȭۋ(500 mm) фǴą(25 mm),
ऒ॒ۚʴ֨Â10 min., ॠҙͿҙࢢࣜҵۆȭۋ(400 mm) εČ܁ॢԜقԴۓʪĵÂѻؚԜϔݗۆԜ֧՚ʪ(1, 3, 5, 7 mm/s)εѺজ֨ࡈ֬ॹॢĀęۋɰ. ۓʪĵÂۋ
+100 mesh قԴəؚԜϔݗۆԜ֧՚ʪÀݒÀ॥ق˰
͆ࠞÌНݗͿধսʼəŚ՚ۆुڦÀć՚ۺڷͿݒÀ ʼؽڷǣধսڱقəࢀٖॳںй࠘ݓ؍ؕɰ. ۋəۓ ąۋࢀŚ՚қϊۆąڍ, ҼŚ՚ۓۙقҼ३Ҽܼۋࡾ
Č, ϔݗۆ Ԝ֧՚ʪÀ ݒÀʼʌ͆ʪ Ԝʂۺ ࠞÌ՚ʪ
Àࡾş˺Лقۋق˰δٖॳںäۆыݓ؍Čࠞ
ÌʽԜͿڮݓʼəъϸ, ҼŚ՚ۓۙəϔݗۆ՚ʪ ݒÀٮ॥ƍ֖óԜҙͿѕʼş˺ЛقǣࢍǦĀę Ϳࣺɳʽɰ(Fig. 6(a)). 100×140, 140×200 mesh ĵÂۆ
ąڍϔݗۆԜ֧՚ʪݒÀٮ॥ƍࠞÌʽŚ՚Ձқۆ
ुڦəݒÀ, ধսڱڹ۾ÇՙʼəąॳںǣࢍǴؽ ɰ. ০Ԝ֧՚ʪ1 mm/sقԴ3 mm/sڷͿݒÀʼəĵ ÂقԴŚ՚ۆुڦÀśü০ݒÀʼؽəʚ, ۋəÁĵ ÂۆŚ՚ۓۙٮҼŚ՚ۓۙÂқνεڦ३Դə1 mm/s ۋԜۆϔݗ՚ʪÀڅĵʼݓχ, ۋ҃ɰȭڹϔݗԜ֧՚
Fig. 6. Grade and recovery of metals with change of the rising velocity of medium (a) +100 mesh, (b) 100×140 mesh, (c) 140×200 mesh, (d) 200 mesh.
ʪقԴəŚ՚ՁқۆۓؚܼۙԜϔݗۆ՚ʪݒÀق
˰͆ҼŚ՚ۓۙٮ॥ƍҙڮʼəŚ՚ۋьԦʼرǣ
ࢍǦ ĀęͿ ࣺɳʽɰ.
Fig. 6(d)əFig. 6(a, b, c)ٮʴێॢܓæقԴؚԜϔ ݗۆԜ֧՚ʪε0.5, 1, 3, 5 mm/sͿѺজ֨ࡈ֬ॹॢ
ĀęͿ, ؚԜϔݗ1 mm/s ۋԜۆܓæقԴəࠞÌʽԓ НۆŚ՚ՁқধսڱۋśüॠóÇՙʼČ, Ś՚Ձқۆ
ुڦə ۾ ݒÀʼə ìں ঝۍॠٕɰ. ۋə 200 meshĵÂԓНۆۓۙࡾşÀȃИۚ؉Ś՚ۓۙٮҼ Ś՚ۓۙÂࠞÌ՚ʪÀÇՙʼر, ǰڹ՚ʪۆؚԜϔ ݗܓæقԴʪҼŚ՚Ձқۆۓۙٮ॥ƍŚ՚Ձқۆ
ۓۙÀ ҙڮʼر ǣࢍǦ ìڷͿ ࣺɳʽɰ.
˰͆Դۋ֬ॹڹÁۓʪĵÂق˰͆ধսڱۋ80%
ۋԜۍܓæܼुڦÀÀۤȭڹ֬ॹܓæۆؚԜϔݗ
Ԝ֧՚ʪεČ܁(+100 mesh: 7 mm/s, 100×140 mesh:
7 mm/s, 140×200 mesh: 3 mm/s, 200 mesh: 1 mm/s) ॠČ, ࠺ͤقԺ࠘ʽࣜҵۆȭۋε100, 200, 400 mm Ϳ ܓۼॠي ֬ॹںݕॱॠٕɰ.
ۓʪĵÂۋ+100 meshۍ֬ॹقԴəࣜҵۆȭۋѺ
জق˰δࠞÌʽŚ՚ۆধսڱфुڦѺজÀػə
ìڷͿঝۍʼؽɰ(Fig. 7(a)). ۋə+100 meshقप॥
ʽ Ś՚Ձқۆ ۓۙ ࡾşÀ ؚԜϔݗۆ Ԝ֧՚ʪ 7 mm/sܓæقԴəࣜҵۆ߯ՙȭۋܓæۍ100 mmū ݓҙڮʼݓ؍Č, ҼŚ՚ՁқڹۓۙۆࡾşÀ࠶ݓʌ
͆ʪҼܼۋǰş˺ЛقࣜҵۆȭۋقԜěػۋʂҙ қ ҙڮʼş ˺Лق ǣࢍǦ ĀęͿ ࣺɳʽɰ. ъϸق
100×140 mesh ۓʪĵÂۆąڍࣜҵȭۋÀ100 mmق Դ200 mmڷͿԜ֧ʿق˰͆ࠞÌʽŚ՚ՁқۆुڦÀ
śü০ݒÀʼČ(100 mm: 49.01% G200 mm: 90.5%), 200 mmۋԜܓæقԴəࣜҵȭۋѺজق˰δŚ՚Ձ қۆुڦфধսڱѺজÀäۆػəìںঝۍॠٕɰ.
ۋ͠ॢĀęəؘԴسśॠٕˢۋŚ՚, ҼŚ՚ÂҼܼ
ۋٮࠞÌ՚ʪقۆ३ǣࢍǦĀęͿ׆Ś՚ۓۙÀ
ؚԜڌϔق ۆ३200 mmйχūݓəԜ֧ʼݓχ 200 mm ۋԜĵÂūݓԜ֧ॠşۻقɰ֨ࠞÌʼəъϸ
ҼŚ՚ۓۙə200 mmۋԜĵÂقԴʪć՚Ԝ֧ॠي
ѕʼş˺Лق ǣࢍǦ ĀęͿ ࣺɳʽɰ.
140×200 mesh ۓʪĵÂڹࣜҵۆȭۋ200 mmۋॠ
Fig. 7. Grade and recovery of metals with change of the height of outlet tube from the bottom (a) +100 mesh, 7 mm/s, (b) 100×140 mesh, 7 mm/s, (c) 140×200 mesh, 3 mm/s, (d) 200 mesh, 1 mm/s.
قԴࣜҵۆȭۋÀȭ؉ݙق˰͆Ś՚Ձқۆধսڱ
фुڦÀʴ֨قݒÀॠٕڷ϶, 200 mmۋԜĵÂقԴ əŚ՚ۆধսڱڹݒÀ, ुڦəÇՙॠəĀęεঝۍ ॠٕɰ. ۋə200 mmۋॠܓæقԴəŚ՚, ҼŚ՚Ձқ ۋʴъҙڮʼݓχࣜҵۆȭۋÀȭ؉ݙق˰͆Ҽܼ
ۋȭڹŚ՚ۆҙڮ͟ۋÇՙ, ҼŚ՚Ձқۆҙڮ͟ڹ
ࣜҵۆȭۋقٖॳںࡾóыݓ؍؉Ś՚Ձқۆुڦ ٮ ধսڱۋ ॥ƍ ݒÀʽ ìڷͿ ԦÁʽɰ. ̚ॢ, 200 mmۋԜĵÂقԴəࣜҵۆȭۋÀȭ؉ݙق˰͆࠺ͤ
ԜҙūݓʪɵॠəҼŚ՚ՁқۋÇՙʼرǣࢍǦìڷ ͿԦÁʽɰ. 200 meshĵÂۆąڍ, ࣜҵۆȭۋÀȭ
؉ݗս Ś՚ۆ ধսڱ(100 mm: 28.9%, 400 mm:
83.1%)ۋśü০ݒÀ, ुڦəأ10% ܁ʪÇՙʼə
ìڷͿঝۍʼؽɰ. ۋ͠ॢĀęəٍԑқݕ200 mesh ܓæقԴəŚ՚ęҼŚ՚ۆࠞÌ՚ʪۋÀܶر˞Č, ۋͿۍ३ؚԜϔݗۆڮʴقۆॢ˃ÀݓՁқۆۓۙ
˞ۋʂҙқ॥ƍҙڮʼäǣࠞÌʼرьԦॢĀęͿ
ࣺɳʽɰ.
Ā
दPCBͿҙࢢۻşۻۙҙुںٍԑė܁ںۋڌ, қν ॠəę܁قԴьԦॢٍԑқݕڷͿҙࢢŚ՚Ձқںқ ν, Ըѻॠşڦ३ًҼܼࠞÌѪںۋڌॠي֬ॹॠٕɰ.
ٍԑқݕǴŚ՚॥͟ڹ29.8 wt%ͿܓԐʼؽڷ϶, Ś՚
ՁқںًҼܼԸѻںۋڌ३қνॠşڦ३ۓʪқśں
(+100, 100×140, 140×200, 200 mesh) ॠٕڷ϶, ؚԜ ϔݗۆԜ֧՚ʪ(0.5, 1, 3, 5, 7 mm/s) фॠҙͿҙࢢۆ
ࣜҵۆȭۋ(100, 200, 400 mm)εܓۼॠيۓʪĵÂѻ
ًҼܼࠞÌқν֬ॹں֬֨ॠيɰڼęÏڹĀں
ʪॠٕɰ.
1. ۓʪқśĀę, +100 mesh ε܃ٽॢۓʪĵÂقԴ ə ۓۙࡾşÀ ۚ؉ݗս ٍԑқݕۆ ИóҼڱۋ
ݒÀॠٕڷ϶200 mesh ࡾşۆٍԑқݕۆИóҼ ڱ(45.4 wt%)ۋ Àۤ ȭó ঝۍʼؽɰ. Ś՚॥͟ۋ
Àۤ ȭڹ ۓʪĵÂڹ +100 mesh (Ś՚॥͟: 57.1 wt%)ͿܓԐʼؽɰ.
2. ؚԜϔݗۆ Ԝ֧՚ʪÀ ݒÀ॥ق ˰͆ Ś՚Ձқۆ
ुڦəϿ˜ۓʪĵÂقԴݒÀॠٕڷǣ, 100 mesh ۓʪܓæقԴə ۓۙۆ ࡾşÀ Çՙ॥ق ˰͆ Ś՚
Ձқۆ ধսڱۋ śü০ Çՙॠə ąॳں ǣࢍǴؽ ɰ. ۓۙࡾşÀۚ؉ݗսϔݗԜ֧՚ʪѺজق˰
͆Ś՚ՁқۆধսڱۋࡾóٖॳںыəìڷͿܓ Ԑʼؽɰ. ÁۓʪĵÂѻŚ՚Ձқধսڱ80% ۋԜ
ܓæقԴ Àۤ ȭڹ ुڦ(+100 mesh: 89.7%, 100
×140 mesh: 89.74%, 140×200 mesh: 75.8%, 200 mesh: 25.5%)εÍəؚԜϔݗۆ՚ʪəۓʪĵ ق ˰͆ ۋε ǣࢍǴؽɰ (+100 mesh: 7 mm/s, 100×140 mesh: 7 mm/s, 140×200 mesh: 3 mm/s, 200 mesh: 1 mm/s).
3. +100 mesh ܓæقԴəࣜҵۆȭۋѺজق˰δŚ՚
ۆुڦфধսڱѺজəǣࢍǣݓ؍ؕڷǣ, 100 mesh ĵÂقԴəࣜҵۆȭۋÀȭ؉ݗսŚ՚Ձ қۆধսڱۋݒÀʿںঝۍॠٕɰ. ÁۓʪĵÂѻ
߯ʂ ुڦə 100 mm ȭۋ ܓæقԴ +100 mesh:
91.53%, 200 mesh: 35.7%, 200 mm ȭۋقԴ 100
×140 mesh: 89.7%, 140×200 mesh: 80.7%Ϳঝۍʼ ؽڷ϶, ۓۙࡾşÀۚںսŚ՚ۆुڦʪÇՙ॥
ں؎սەؽɰ. ۋəŚ՚ęҼŚ՚ՁқۓۙۆࠞÌ
՚ʪۋÀÇՙʼر ьԦʽĀęͿࣺɳʽɰ.
ԐԐ
ٍ҆ĵə2010țʪݓ֩ą܃ҙۆۦڙڷͿॢĶقȃ ݓşցथÀڙ(KETEP)ۆݓڙںы؉սॱॢٍĵę܃
ۓɦɰ (No. 20105010006B).
3FGFSFODFT
Das, A., Vidyadhar, A. and Mehrotra, S.P., 2009, “A noble flowsheet for the recovery of metal value from waste printed circuit boards,” Resources, Conservation and recycling, Vol. 53, pp. 464-469.
Duan, C.L., Wen, X.F., Shi, C.S., Zhao, Y.M., Wen, B.F.
and He, Y.Q., 2009, “Recovery of metals from waste printed circuit boards by mechanical method using a water medium,” J. of Hazardous Materials, Vol. 166, pp.
478-482.
Duan, H.b., Hou, K., Li, J.H. and Zhu, X.D., 2011,
“Examining the technology acceptance for dismantling of waste printed circuit boards in light of recycling and environmental concerns,” J. of Environmental Management, Vol. 92, pp. 392-399.
Eswaraiah, C., Kavitha, T., Vidyasagar, S. and Narayanan, S.S., 2008, “Classification of metals and plastics from printed circuit board(PCB) using air classifier,” Chemical Engineering and Processing, Vol. 47, pp. 565-576.
Guo, C., Wang, H., Liang, W., Fu, J.G. and Yi, X., 2011,
“Liberation characteristic and physical separation of printed circuit board(PCB),” Waste Management, Vol. 31, pp. 2161-2166.
Hettler, E.N., Gulliver, J.S. and Kayhanian, M., 2011 “An elutriation device to measure particle settling velocity in urban runoff,” Science of the Total Environment, Vol.
409, pp. 5444-5453.
Kim, Y.J., Lee, J.H., Lee, J.-C. and Lee, J.R., 2012 “Disassembly of the mounted electric/electronic components on wasted printed circuit board and their characterizations,” J. of The Korean Society for Geosystem Engineering, Vol. 49, No. 6, pp. 728-735.
Kumar, V., Lee, J.-C., Jeong, J.K. and Kim, B.S., 2010 “Review on mechanical recycling of end-of life electical and electronic equipments for recovery of metallic components,”
J. of the Korean Society for Geosystem Engineering, Vol.
47, No. 5, pp. 593-608.
Lee, J.R., Kim, Y.J. and Lee, J.C., 2012, “Disassembly and physical separation of electric/electronic components layered in printed circuit boards (PCB),” J. of Hazardous Materials, Vol. 241-242, pp. 387-394.
Li, J.H., Tian, B.G., Liu, T.Z., Liu, H., Wen, X.F. and Honda, S.I., 2006, “Status quo of e-waste management in mainland China,” J. of Mater cycles Waste Management, Vol. 8, No. 1, pp. 13-20.
Murugan, R.V., Bharat, S., Deshpande, A.P., Varughese, S.
and Haridoss, P., 2008, “Milling and separation of the multi-component printed circuit board materials and the analysis of elutriation based on a single particle model,”
Powder Technology, Vol. 183, pp. 169-176.
Wills, B.A. and Napier-Munn, T.J., 2006, WILLS` Mineral Processing Technology, 7th Ed., Butterworth-Heinemann, Oxford, p. 101.
Wu, G.Q. and Zhang, Z.K., 2010, “Recycling of waste printed circuit boards,” Circuit world, Vol. 36, No. 4, pp.
35-39.
Wu, J., Li, J. and Xu, Z.M., 2008, “Electrostatics separation for multi-size granule of crushed printed circuit board waste using two-roll separation,” J. of Hazardous Materials, Vol. 159, pp. 230-234.
Yoo, J.M., Jung, J.K., Yoo, K.K., Lee, J.-C. and Kim, W.B., 2009, “Enrichment of the metallic component from waste printed circuit boards by a mechanical separation process using stamp mill,” Waste Management, Vol. 29, pp. 1132-1137.
ઽ
ইۦ Ìڙʂॡİ قȃݓۙڙėॡę чԐę܁
(欧G 彳櫾躇G 缧49嘳G 缧6埲G 垾畢)
ହ
2013țÌڙʂॡİقȃݓۙڙėॡę
ėॡԐ
ইۦ Ìڙʂॡİ قȃݓۙڙėॡę ԵԐę܁
(E-mail; [email protected])
ੲஂւ
1996țČͲʂॡİজॡŚ՚ėॡчԐ 2011țॢĶݓݗۙڙٍĵڙےٍĵڙ
ইۦ ܼڙʂॡİ ۙڙտঞঞąėॡę ҙİս
(E-mail; [email protected])
ଲ୨ผ
ইۦ Ìڙʂॡİ قȃݓۙڙėॡę ԵԐę܁
(欧G 彳櫾躇G 缧49嘳G 缧6埲G 垾畢)
ଲ୍వ
ইۦ ॢĶݓݗۙڙٍĵڙ ġНۙڙٍĵ҆ҙ ےٍĵڙ (欧G 彳櫾躇G 缧49嘳G 缧1埲G 垾畢)
ଲ୍ߡ
ইۦ Ìڙʂॡİ قȃݓۙڙėॡę ҙİս (欧G 彳櫾躇G 缧49嘳G 缧6埲G 垾畢)