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W38V5315-Z LED Lamp

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W38V5315-Z

LED Lamp

1. Features

▶ InGaN UV Chip.

▶ Smooth, Consistent Spatial Radiation Patterns.

▶ High Luminous Output.

▶ Ultra Violet emission.

2. Applications

▶ Commercial Outdoor Signs.

▶ Street Light.

3. Package Dimensions

Unit : mm

PIN Connections 1. Anode

2. Cathode

W38V5315-Z W38V5315-Z(B)

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W38V5315-Z

LED Lamp

4. Absolute maximum ratings

Ta=25℃

Symbol

IF

IFP

PD

Topr

Tstg

Tsol

*1. Pulse Width=0.1msec, Duty ratio = 1/16

*2. 5 sec at location 2.0mm away from the base of the epoxy bulb.

5. Electrical Characteristics

Ta=25℃

Item Test Condition Min Typ Max Unit

Forward Voltage IF= 20mA 3.0 3.4 3.6 V

A 7 - 10

B 10 - 14

C 14 - 20

D 20 - 28

E 28 - 40

Peak Wavelength IF= 20mA - 380 - ㎚

Spectrum Radiation

Band width IF= 20mA - 22 - ㎚

Viewing Angle IF= 20mA - ±15 - deg

*3. This Value includes ± 20% tolerance caused by Luminous Intensity measurement method of Won semiconductor Co.LTD

℃ -30~100 ℃

Power Dissipation Operating Temperature

108

Storage Temperature

-30~85

Unit Item

Forward Current

Pulse Forward Current *1

30 65

Ratings

260±5℃ ℃ Soldering Temperature *2

Symbol

2Θ1/2 λP

△λ VF

Radiant Intensity *3 Ie IF= 20mA mW/sr

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W38V5315-Z

LED Lamp

6.Characteristic Diagrams

Fig.1 IF - VF Fig.2 IF - Ta

Fig.3 Spectrum Distribution

Fig.5 Radiation Characteristics

Relative Luminous Intensity Iv [%]

Wavelength [nm]

Forward Voltage VF[V] Ambient Temperature Ta[℃]

Forward Current IF[mA] Forward Current IF [mA]

Relative Intensity [%]

Forward Current [mA]

Fig.4 Ie - IF

Radiant Intensity Ie[㎽/㏛]

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W38V5315-Z

LED Lamp

7. Soldering Profile

7-1. Reflow Soldering

7-2. TTW Soldering

120 to 180s

240-245°C 10-40s

183°C

Ramp-down rate up to 6°C/s

Defined for Preconditioning up to 6°C/s Ramp-up rate up to 6°C/s

Defined for Preconditioning 2-3°C/s T(°C)

300

250

200

150

100

50

0

0 25 50 75 100 125 150 175 200 225 250 t(sec)

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W38V5315-Z

LED Lamp

8.Reliability Test Items and Conditions

8-1. The Reliability criteria of LED Lamps

※ U.S.L. : Upper Standard Level ※ L.S.L. : Lower Standard Level 8-2. Results of Reliability Test

Min Max

Forward Voltage VF IF=20㎃ - U.S.L. × 1.1

Reverse Current IR VR=5V - U.S.L. × 2.0

Luminous Intensity IV IF=20㎃ L.S.L. × 0.7 -

Test Condition Symbol

Item Limit

NO Item Test Condition Test Hours/

Cycles

Sample

Size Ac/Re

1 Solder Heat Temp : 260℃± 5℃ 5 SEC 76 PCS 0/1

2 Temperature Cycle H : +100℃ 30min 5 min L : -30℃ 30min

100 CYCLE 76 PCS 0/1

3 Thermal Shock

H : +100℃ 5min 10 sec

L : -30℃ 5min

100 CYCLE 76 PCS 0/1

4 High Temperature Storage Temp : 100℃ 1000 HRS 76 PCS 0/1 5 Low Temperature Storage Temp : -30℃ 1000 HRS 76 PCS 0/1

6 Operating Life IF : 20 mA 1000 HRS 76 PCS 0/1

7 High Temperature /

High Humidity 60℃ / 90% RH 1000 HRS 76 PCS 0/1

참조

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