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˜ m× D } º (3C-SiC) x ¢ Ò Å ² Ž O U ­ Ž' [8 ý < gX c l õ m Í 2D ATLAS S ö o Ú7 _T  Ó Å R w ‹ Ž ì ŏ Œ

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’

˜ m× D } º (3C-SiC)  x ¢ Ò Å ² Ž O U ­ Ž' [8 ý < gX c l õ m Í 2D ATLAS S ö o Ú7 _T  Ó Å R w ‹ Ž ì ŏ Œ

™ » ò 6 B® £ · T Š û B ÷ 7 B · 0 ï F+ ä Z 9  · T „ ç ¡ - ! H

„

 · ¡ ¤ @ /† < Ɠ § ì ø ͕ ¸^ ‰õ † < Æl Õ ü t † < Æõ , ì ø ͕ ¸^ ‰Ó ü t$ í ƒ  ½ ¨™ è, „  Å Ò 561-756 (2008¸   8 Z 4 5{ 9  ~ à Î6 £ §)

‘ :

r ƒ  ½ ¨\ " f  H ò ø Í o½ ©™ è  ” ¸‚   à Ô ½ ™t Û ¼' \  ¦ ] j Œ • # Œ z  ´] j ™ è _  „  l & h “   : £ ¤$ í `  ¦ ì  r$ 3  % i Ü ¼ 9 z  ´+ « >\ " f   è ß –   õ \  ¦ 2D ATLAS r Ó ý t Y Us ‚  `  ¦ s 6   x # Œ q “ § % i  . z  ´+ « >\ " f ] j Œ •  ) a ò ø Í o½ ©

™

è  ” ¸‚  “ É r hot-wall ~ ½ Ód ” _   o† < Æl  © œ7 £ x ‚ Ã Ì ~ ½ ÓZ O `  ¦ s 6   x # Œ ½ + Ë$ í % i Ü ¼ 9, t 2 £ §“ É r 40 ∼ 100 nm s 



. ½ + Ë$ í  ) a ò ø Í o½ ©™ è  ” ¸‚  `  ¦ Ê ê€   > s à Ô „  > ´ òõ  à Ô ½ ™t Û ¼'  (back-gated field-effect transistors)

–

Ð ] j Œ • % i Ü ¼ 9, s \  ¦ 2D ATLAS r Ó ý t Y Us ‚  `  ¦ : Ÿ x K  ò ø Í o½ ©™ è  ” ¸‚   à Ô ½ ™t Û ¼'  ™ è  1 l x  Œ •: £ ¤$ í

` 

¦ q “ § ì  r$ 3  % i  . 2D ATLAS r Ó ý t Y Us ‚  \ " f_  ò ø Í o½ ©™ è  ” ¸‚  _  U  ´s ü < G V , _  U  ´s , t 2 £ §“ É r ]

j Œ •  ) a ™ è ü < ° ú  “ É r 4 µm, 3 µm, 45 nm s “ ¦, { 9 & ñ ô  Ç „    0 l x • ¸\  ¦ ° ú   H  “ ¦ & ñ % i Ü ¼ 9, t 2 £ § s 



Œ

• f ” \          H € ª œ ´ òõ   H ‘ : r ƒ  ½ ¨\ " f  H C ] j % i  . z  ´+ « >  õ ü < r Ó ý t Y Us ‚  _    õ \  ¦ q 

“

§ô  Ç Ê ê „    0 l x • ¸ 1.5 × 10

17

cm

−3

{ 9  M : „  À Ó on/off ratio (I

on

/I

of f

) ü < s 1 l x • ¸ (µ)   H y Œ •y Œ • 6.16 õ

 3.06 × 10

3

cm

2

/V·s \  ¦ ° ú   H ™ è  ] j Œ •s  0 p x † < Ê`  ¦ · ú ˜ à º e ” % 3  .

PACS numbers: 73.23.-b, 73.63.-b

Keywords: ò ø Í o½ ©™ è  ” ¸‚  ,  ” ¸‚   à Ô ½ ™t Û ¼' , r Ó ý t Y Us ‚  

I. " e  ] Ø

‰

&

³F  V , “ É r {  ç ß –   (wideband gap) ì ø ͕ ¸^ ‰  H “ ¦Ø  ¦§ 4 ,

“

¦Å Ò  ™ è \  6 £ x6   x s  0 p x  9, “ ¦“ : r _   © œI \ " f ™ è  _

  Ö ¸6   x s  & h ½ + Ë l  M :ë  H \  ì ø ͕ ¸^ ‰ „  § 4 ™ è – Ð_  6 £ x6   x \ 

@

/ô  Ç ƒ  ½ ¨  Ö ¸ µ 1 Ïy  ”  ' Ÿ  ×  æ s  . s   H s [ þ t F « Ñ_  # Œ Q

„

  Ó ü t$ í s  [ j@ / „  § 4 ™ è _  › ¸| `  ¦ ½ ¨q  “ ¦ e ” l  M : ë

 H s  . : £ ¤ y , ò ø Í o½ ©™ è_   â Ä º V , “ É r {  ç ß –   \  -t  (2.2 eV ∼ 3.2 eV)\  ¦ t  9, Z  }“ É r \ P „  • ¸$ í (3.6 W/cm

C)

`

 ¦ t “ ¦ e ” l  M :ë  H \  Z  }“ É r „  · ú šõ  Z  }“ É r “ : r • ¸\ " f_  6 £ x 6

 

x s  0 p x  . ¢ ¸ô  Ç, Z  }“ É r † ½ Ó4 Ÿ ¤„  · ú š : £ ¤$ í M :ë  H \  [ j

@

/ „  § 4 ™ è _  › ¸| `  ¦ Ø  æì  r y  ë ß –7 á ¤ ô  Ç  [1–5]. : £ ¤ y , 6H ò

ø Í o½ ©™ è  4H ò ø Í o½ ©™ èü < q “ § % i `  ¦ M : 3C ò ø Í o½ ©™ è



 H  Œ •“ É r ³ ð€   à Ôê Á œ x 9 • ¸ M :ë  H \  “ ¦5 Å q 1 l x  Œ •`  ¦ 0 Aô  Ç ™ è  _

 6 £ x6   x s  6   x s    [6]. ¢ ¸ô  Ç  ” ¸‚  õ  ° ú  “ É r 1 " é ¶& h “  

½

¨› ¸\  ¦ ° ú   H ò ø Í o½ ©™ è_   â Ä º 8 A# Qè ß – F g † < Æ& h , „  l & h , \ P 

&

h

 : £ ¤$ í M :ë  H \  ´ ú §“ É r ƒ  ½ ¨ ”  ' Ÿ  ×  æ s   [2,7–10]. Õ ª Q



 ‰ & ³F  t  ƒ  ½ ¨ µ 1 ϳ ð  ) a ò ø Í o½ ©™ è  ” ¸‚   à Ô ½ ™t Û ¼' 



 H Z  }“ É r 0 l x • ¸– Ð “   # Œ > s à Ô\  _ ô  Ç „  > _  › ¸] X s  # Q

§ >

  [2, 11]. ‘ : r ƒ  ½ ¨  H ò ø Í o½ ©™ è  ” ¸‚   à Ô ½ ™t Û ¼' _ 

E-mail: sk [email protected]

z 

´+ « >  õ ü < 2D ATLAS r Ó ý t Y Us ‚     õ \  ¦ q “ § % i Ü ¼ 9, ò ø Í o½ ©™ è  ” ¸‚  _  0 l x • ¸\  ¦ 2D ATLAS r Ó ý t Y Us ‚  `  ¦ s

6   x # Œ › ¸] X † < ÊÜ ¼– Ð+ ‹ > s à Ô\  _ ô  Ç % ò † ¾ Óõ  „  l & h “   :

£ ¤$ í `  ¦ ì  r$ 3  % i  .

II. ÷ m Ç ] M ö

ò

ø Í o½ ©™ è  ” ¸‚   ½ + Ë$ í “ É r hot-wall ~ ½ Ód ” _   o† < Æl  © œ7 £ x

‚ Ã

́ © œq \  ¦ s 6   x ô  Ç vapor-liquid-solid (VLS) B j& m 7 £ §`  ¦ s  6

 

x % i Ü ¼ 9  6   x ) a l ^ ‰ ™ èÛ ¼– Ѝ  H ± ú “ É r “ : r • ¸\ " f ½ ©™ è ü

< ò ø ͙ è_  ½ ¨$ í q  { 9 & ñ ô  Ç Methltrichlorosilane (MTS, CH

3

SiCl

3

) `  ¦  6   x % i  . l ^ ‰™ èÛ ¼_  s 1 l x`  ¦ 0 Aô  Ç H  o

# Q l ^ ‰– Ѝ  H à º™ è\  ¦  6   x % i Ü ¼ 9, ½ + Ë$ í r  “ : r • ¸  H 950

C – Ð Ä »t  % i  . ½ + Ë$ í  ) a ò ø Í o½ ©™ è  ” ¸‚  `  ¦ s 6   x # Œ



” ¸‚   à Ô ½ ™t Û ¼' \  ¦ ] j Œ • l  0 AK  í ß – o½ ©™ è (SiO

2

)  500 nm 7 £ x ‚ à Ìs   ) a “ ¦0 l x • ¸_  z  ´o – B H l ó ø Í`  ¦  6   x % i Ü ¼ 9, s M :_  “ ¦0 l x • ¸ z  ´o – B H l ó ø Í“ É r „  > ´ òõ à Ô ½ ™t Û ¼'  (field-effect transistor) \ " f Ê ê€  „  F G (back-gate) _  % i ½ + É

`

 ¦ ô  Ç . Ÿ íž Ðo ™ èÕ ªA x \  ¦ s 6   x # Œ 8 £ ¤& ñ 6   x „  F G J ‡  

`

 ¦ + þ A$ í ô  Ç Ê ê „   c ” 7 £ x ‚ à Ìl \  ¦ s 6   x # Œ „  F G (Ti/Au =

50/150 nm) `  ¦ + þ A$ í % i  .  s ß ¼– Ðx & Ï @`  ¦ s 6   x # Œ ò ø Í

-342-

(2)

Fig. 1. (a) A FE-SEM image of SiC nanowire FET. (b) A schematic view of SiC nanowire FET.



o½ ©™ è  ” ¸‚  s  ì  r í ß –÷ &# Q e ”   H isopropyl alcohol (IPA) 6

  xÓ  o`  ¦ ï  r q   ) a r « Ñ\  b  # Qä ¼ 9  ” ¸‚  _  0 Au \  ¦ F g † < Æ

‰

&

³p  â Ü ¼– Ð S X ‰ “  ô  Ç Ê ê e-beam lithography („   c ” o ™ è Õ

ªA x )\  ¦ s 6   x # Œ Source (™ èÛ ¼)ü < Drain (× ¼Y U“  ) % i 

½

+ É`  ¦   H F K5 Å q (Ti/Au = 50/150 nm) „  F G J ‡  `  ¦ + þ A

$ í

% i  . ™ èÛ ¼ü < × ¼Y U“   F K5 Å q 7 £ x ‚ à Ì`  ¦ l  „   buffered hydrofluoric acid (BHF) \  ¦ s 6   x # Œ ò ø Í o½ ©™ è  ” ¸‚  \ 



ƒ  & h Ü ¼– Ð + þ A$ í  ) a í ß – o½ ©™ è\  ¦ ] j ô  Ç Ê ê „   c ” 7 £ x ‚ à ́ © œ q

\  ¦ s 6   x # Œ F K5 Å q 7 £ x ‚ à Ì`  ¦ % i  . Lift-off õ & ñ `  ¦  5 g ò

ø Í o½ ©™ è  ” ¸‚   à Ô ½ ™t Û ¼' \  ¦ ] j Œ • % i   [11]. ] j Œ •  ) a ò

ø Í o½ ©™ è  ” ¸‚   à Ô ½ ™t Û ¼'   H semiconductor parame- ter analyzer (HP4156C)  ƒ      ) a probe station`  ¦ s 6   x

# Œ „  l & h “   : £ ¤$ í `  ¦ 8 £ ¤& ñ % i Ü ¼ 9, 8 £ ¤& ñ ½ + É M :_  “ : r • ¸



 H  © œ“ : r`  ¦ Ä »t  % i  .

III. ÷ m Ç] M ö + s ÇÊ Ý

ò ø

Í o½ ©™ è  ” ¸‚   à Ô ½ ™t Û ¼' \  ¦ ] j Œ •   H X <  6   x ) a ò ø Í



o½ ©™ è  ” ¸‚  _  t 2 £ §“ É r ∼45 nm s  9, U  ´s   H ∼4 µm s

 . Fig. 1(a)   H ] j Œ •  ) a ò ø Í o½ ©™ è  ” ¸‚   à Ô ½ ™t Û ¼

Fig. 2. Experimental electrical characteristics of SiC nanowire FET : (a) V

DS

-I

D

characteristics graph as func- tion of V

G

of -40, -30, -20, -10, 0, +10, +20, +30 and +40 V, inset graph is enlarged plot of (a). (b) V

G

-I

D

graph at V

DS

of +0.3 V.

'

_  field-emission scanning electron microscopy (FE- SEM)  ”  s  9, Fig. 1(b)   H ] j Œ •  ) a ™ è  ½ ¨› ¸_  — ¸d ” 

•

¸\  ¦    · p  כ s  . Fig. 2(a) ü < (b)  H Semiconductor parameter analyzer (HP4156C)  ƒ      ) a probe station

`

 ¦ s 6   x # Œ ò ø Í o½ ©™ è „  > ´ òõ à Ô ½ ™t Û ¼' _  „  l & h “   :

£ ¤$ í `  ¦ 8 £ ¤& ñ ô  Ç   õ Õ ªA á Ôs  . Fig. 2(a)   H > s à Ô „  

· ú

š (V

G

)`  ¦ -40 V \ " f +40 V  t  10 V m ”     or &   9, × ¼Y U“   „  · ú š (V

DS

) s  -1 V \ " f 1 V_  # 3 0 A\ " f_ 

×

¼Y U“   „  · ú š-× ¼Y U“   „  À Ó : £ ¤$ í Õ ªA á Ôs “ ¦, î ß –A á ¤ \  ¶ ú š{ 9 

 )

a Õ ªA á ԍ  H Fig. 2(a) Õ ªA á Ô\ " f V

DS

\  ¦ 0.3 V \ " f 0.5 V  t  S X ‰ @ /ô  Ç Õ ªA á Ôs  . Fig. 2(b)   H VDS  +0.3 V { 9

 M :, > s à Ԅ  · ú š-× ¼Y U“  „  À Ó (V

G

− I

D

) Õ ªA á Ô\  ¦   



· p  כ s  . Fig. 2(a)ü < 2(b) \ " f S X ‰ “  ½ + É Ã º e ” 1 p w s  ½ + Ë$ í

 )

a ò ø Í o½ ©™ è  ” ¸‚  “ É r „  l & h Ü ¼– Ð n-+ þ A ì ø ͕ ¸^ ‰ : £ ¤$ í `  ¦

f ” `  ¦ · ú ˜ à º e ” Ü ¼ 9 à Ô ½ ™t Û ¼'  1 l x  Œ •`  ¦   H  כ `  ¦ S X ‰ “  

(3)

Table 1. Comparison of the simulated devices performance.

Doping concentration Mobility Transconductance, g

m

I

on

/I

of f

(cm

3

) (cm

2

/V·s) (at V

DS

= 1 V) (at V

gs

= -40 ∼ 40 V, V

DS

= 0.3 V)

5 × 10

19

23.9 3 × 10

−8

1.07

1 × 10

18

890.8 2.9 × 10

−7

2.3

1.5 × 10

17

3.06 × 10

13

3.7 × 10

−7

6.16

½

+ É Ã º e ”  . Fig. 2(a)ü < 2(b)   õ ü <  A _  d ”  (1)õ  (2) :

Ÿ

x # Œ „    s 1 l x • ¸_  > í ß –s  0 p x  .

µ = g

m

L

2

CV

DS

(1)

C = 2πε

0

ε

SiC

L

ln(2h/r) (2)

#

Œl " f g

m

“ É r transconductance, L“ É r G V , _  U  ´s – Ð 3 µm s  9, h  H í ß – o½ ©™ è 8 £ x _  ¿ ºa – Ð 500 nm s  . ¢ ¸ô  Ç,



” ¸‚  _  ì ø Ít 2 £ §“   r“ É r 22.5 nm s  . Æ Ò& h “   ò ø Í o½ ©

™

è  ” ¸‚   à Ô ½ ™t Û ¼' _  „  l & h “   : £ ¤$ í , 7 £ ¤, H o # Q 0 l x

•

¸\  ¦ > í ß –`  ¦ # Œ  ô  Ç . Õ ª Q  Fig. 2(a)\ " f · ú ˜ à º e ”  1

p

w s  ò ø Í o½ ©™ è à Ô ½ ™t Û ¼'   H ¢ - a„  y  depletion ÷ &t  · ú §



 H o # Q 0 l x • ¸_  S X ‰ “  s  0 p x t  · ú § . # Œl " f  H  A  _

 à ºd ”  (3)`  ¦ s 6   x # Œ H o # Q 0 l x • ¸\  ¦ ç ß –] X & h Ü ¼– Ð Ä »Ø  ¦

% i  .

I = nqµEA (3)

#

Œl " f E  H „  l  © œs  9 A  H ò ø Í o½ ©™ è_  é ß –€  & h Ü ¼– Ð, þ j 7

á x& h Ü ¼– Ð ò ø Í o½ ©™ è  ” ¸‚  _  H o # Q 0 l x • ¸ü < s 1 l x • ¸  H y Œ • y

Œ

• ∼5 × 10

19

cm

−3

, ∼0.6 cm

2

/V·s s % 3  . „    s 1 l x • ¸

 ± ú “ É r s Ä »  H ¿ º t – Ð & ñ o ½ + É Ã º e ”   H X <, €  $  ' Í



 P :  H ò ø Í o½ ©™ è  ” ¸‚  _  0 l x • ¸ Z  } l  M :ë  H \  µ 1 ÏÒ q t÷ &



 H ì  r í ß –´ òõ  M :ë  H s  9,   É r    H ò ø Í o½ ©™ è  ” ¸‚  õ 

>

s à Ô í ß – o½ ©™ èü <_  ] X ½ + Ë Â Òì  r _  ì  r í ß –´ òõ  M :ë  H s   [2]. s [ þ t \  @ /ô  Ç S X ‰ z  ´ô  Ç Æ Ò& h “   ƒ  ½ ¨ € 9 כ ¹  9 p-+ þ A H

o # Q_  Å Ò{ 9  (s “ : r Å Ò{ 9  x 9 S X ‰ í ß – 1 p x)`  ¦ : Ÿ x ô  Ç H o # Q_  compensation ƒ  ½ ¨ Õ ª×  æ  _  ×  æ כ ¹ô  Ç \ V | ¨ c  כ s  9, ‰ & ³F  s [ þ t \  @ /ô  Ç [ jx 9 ô  Ç ƒ  ½ ¨ ”  ' Ÿ  ×  æ \  e ”  .

IV. ÷ m Ç] M öÊ Ý S ö o Ú7 _T  Ó Å + s ÇÊ Ý8 ý R w ‹

z 

´+ « >   õ ü < q “ §ƒ  ½ ¨\  ¦ 0 A # Œ 2D ATLAS r Ó ý t Y Us 

‚

  á Ԗ ÐÕ ªÏ þ ›`  ¦ s 6   x # Œ ò ø Í o½ ©™ è  ” ¸‚   à Ô ½ ™t Û ¼' _  :

£ ¤$ í `  ¦ ì  r$ 3  % i  . 2D ATLAS r Ó ý t Y Us ‚  \   6   x ) a ™ è



 ½ ¨› ¸  H z  ´+ « >õ  ° ú  “ É r ½ ¨› ¸– Ð ”  ' Ÿ  % i Ü ¼ 9,  ” ¸‚  _  t

2 £ § s   Œ • f ” \          H € ª œ ‰ & ³ © œ“ É r C ] j % i  .

Fig. 3. Simulated electrical characteristics graph of SiC nanowire FET at same structure with experimentation : (a) V

DS

-I

D

characteristics graph as function of V

G

of -40, -30, -20, -10, 0, +10, +20, +30 and +40 V, inset graph is enlarged plot of (a). (b) V

G

-I

D

graph at V

DS

of +0.3 V.

Õ

ª s Ä »  H ò ø Í o½ ©™ è  ” ¸‚  _  t 2 £ §“   45 nm  € ª œ ‰ & ³



© œ — ¸4 S q`  ¦ & h 6   x l \  ¿ º,  l  M :ë  H s  . ò ø Í o½ ©™ è  ” ¸

‚

 _  0 l x • ¸\  ¦ n-+ þ A, 5 × 10

19

cm

−3

Ü ¼– Ð ç  H{ 9  >  Ä »t  

%

i  . „  l & h “   : £ ¤$ í `  ¦ ì  r$ 3  l  0 AK  z  ´+ « >\ " fü < ° ú  “ É r

›

¸| Ü ¼– Ð „  l & h  : £ ¤$ í `  ¦ ì  r$ 3  % i Ü ¼ 9, Fig. 3 (a), (b)



 H Õ ª\    É r r Ó ý t Y Us ‚     õ  Õ ªA á Ôs  . Fig. 3 (a) Õ ª A

á Ô\ " f V

G

   † < Ê\     V

DS

-I

D

Õ ªA á Ô_     o; Ÿ ¤ s

  Œ •6 £ §`  ¦ S X ‰ “  ½ + É Ã º e ”   H X <, s   H 0 l x • ¸ Z  } l  M :ë  H \ 

(4)

>

s à Ô „  · ú š\  _ ô  Ç ´ òõ   Œ •l  M :ë  H s  . Fig. 3 (b) _  Õ

ªA á Ôü < 0 A\  ] jr ô  Ç d ”  (1) ∼ (3) `  ¦ s 6   x # Œ „   _  s

1 l x • ¸ü < transconductance (g

m

), on/off ratio \  ¦ ½ ¨ % i 



. Õ ª   õ  „   _  s 1 l x • ¸ü < transconductance, on/off ratio   H y Œ •y Œ • 23.9 cm

2

/V·s, 3 × 10

−8

S, 1.07 – Ð > í ß – ÷ &

%

3  . s  Qô  Ç Ã ºu   H €  •ç ß –_  š ¸  ” > r F  t ë ß – z  ´+ « >    õ

ü < r Ó ý t Y Us ‚     õ  Ä » ô  Ç  ⠆ ¾ Ó`  ¦ ˜ Ðs   H  כ `  ¦ S X ‰

“

 ½ + É Ã º e ”  . š ¸  ” > r F    H s Ä »\   H [ j t  ” > r F

ô  Ç . ' Í   P : s Ä »  H ™ è  r Ó ý t Y Us ‚   õ & ñ \ " f  

”

¸‚   ³ ð€  \ " f  } 9 l \    É r ì  r í ß –´ òõ \  ¦ “ ¦ 9 t  · ú §

€

Œ

¤Ü ¼ 9, ¿ º   P :  H F K5 Å q õ  ò ø Í o½ ©™ è  ” ¸‚  õ _  ] X ½ + Ë`  ¦

¢ -

a# 4 ô  Ç š ¸b ”  ] X ½ + Ës   “ ¦ 9 % i  . z  ´] j z  ´+ « > õ & ñ \ " f

š

¸b ”  ] X ½ + Ë : £ ¤$ í `  ¦ Z  } s l  0 A # Œ \ P % ƒo  / B N& ñ `  ¦ ”  ' Ÿ  



 H X <, \ P % ƒo  / B N& ñ `  ¦ ”  ' Ÿ  €   Schottky Barrier Height (SBH) Lowering ‰ & ³ © œs  { 9 # Q  Ti _  { 9 † < Êà º (4.33 eV)

 0.1 ∼ 0.2 eV y Œ ™™ è >   ) a   [12]. t ë ß – 2D ATLAS r

Ó ý t Y Us ‚  “ É r / B N& ñ r Ó ý t Y Us ‚  s      ™ è  K $ 3  r Ó ý t Y

Us ‚  s l  M :ë  H \  s  Qô  Ç \ P % ƒo  / B N& ñ `  ¦ ”  ' Ÿ ½ + É Ã º \ O 



. s  ‰ & ³ © œ`  ¦ r Ó ý t Y Us ‚    © œ\  & h 6   x l  0 A # Œ Ti _  { 9

† < Êà º\  ¦    or &  z  ´' Ÿ  % i Ü ¼ 9, s – Ð l “   # Œ F K5 Å q õ

 ò ø Í o½ ©™ è  ” ¸‚  “ É r ¢ - a# 4 ô  Ç š ¸b ”  ] X ½ + Ës   “ ¦ 9½ + É Ã º e ”

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 כ

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Fig. 4. Simulated electrical characteristics graph for NWs n-type doped SiC NW with 1.5 × 1017 cm

−3

: (a) V

DS

-I

D

characteristics graph as function of V

G

of -40, -30, -20, -10, 0, +10, +20, +30 and +40 V, inset graph is enlarged plot of (a). (b) V

G

-I

D

graph at V

DS

of +0.3 V.

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(5)

r

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17

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3

cm

2

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Y

c p w Š à U Ø ”  ô

[1] J. Wan, M. A. Capano, M. R. Melloch and J.

A. Cooper, IEEE Electronic Device Lett. 23, 482 (2002).

[2] H. K. Seong, H. J. Choi, S. K. Lee, J. I. Lee and D.

J. Choi, Appl. Phys. Lett. 85, 1256 (2004).

[3] M. Ruff, H. Mitlehner and R. Helbig, IEEE Trans- actions on Electron Devices 41, 1040 (1994).

[4] J. S. Lee, Y. K. Byeun, S. H. Lee and S. C. Choi, Journal of Alloys and Compounds 456, 257 (2008).

[5] D. J. Spry, A. J. Trunek and P. G. Neudeck, Mater.

Sci. Forum 457, 1061 (2004).

[6] K. K. Lee, Y. Ishida, T. Ohshima, K. Kojima, Y.

Tanaka, T. Takahashi, H. Okumura, K. Arai and T.

Kamiya, IEEE Transactions on Electron Devices 7, 466 (2003).

[7] L. D. Zhang, G. W. Meng and F. Phillipp, Mater.

Sci. Eng. A 286, 34 (2000).

[8] T. H. Yang, C. H. Chen, A. Chatterjee, H. Y. Li, J. T. Lo, C. T. Wu, K. H. Chen and L. C. Chen, Chem. Phys. Lett. 379, 155 (2003).

[9] S. Honda, Y. G. Baek, T. Ikuno, H. Kohara, M.

Katayama, K. Oura and T. Hirao, Appl. Surf. Sci.

212, 378 (2003).

[10] Z. Yang, Y. Xia and R. Mokaya, Chem. Mater. 16, 3877 (2004).

[11] H. K. Seong, S. Y. Lee, H. J. Choi, T. H. Kim, N. K.

Cho, K. S. Nahm and S. K. Lee, Mater. Sci. Forum 527, 771 (2006).

[12] K. Jagadeswara, V. Rajagopal and P. Narasimha, J.

Mater Sci: Mater. Electron 19, 333 (2008).

[13] J. Wang, E. Polizzi and M. Lundstrom, J. Appl.

Phys. 96, 2192 (2004).

Fabrication of 3C-SiC Nanowire Field-effect Transistors and Their Simulation Study by Using the 2D ATLAS Simulator

Dong-Joo Kim, Seung-Yong Lee, Jung-Hwan Hyung and Sang-Kwon Lee

Department of Semiconductor Science and Technology,

Semiconductor Physics Research Center, Chonbuk National University, Jeonju 561-756 (Received 5 August 2008)

We report on the electrical characteristics of 3C-SiC nanowire (NW) field-effect transistors (FETs), which were prepared by using conventional electron-beam lithography (EBL). The SiC NWs used in the FETs were normally in the range of 40 ∼ 100 nm. In addition, the current-voltage (I-V) characteristics of the SiC NW FETs were compared with the simulated results. From the 2D ATLAS simulation, the carrier mobility and the on/off ratio were estimated to be ∼3.06 × 10

3

cm

2

/V·s and ∼ 6.16, respectively. We also noticed that detailed studies, such as direct doping and modulation of the doping in SiC NWs, are required for further fabrication of high-performance SiC NW-based devices.

PACS numbers: 73.23.-b, 73.63.-b

Keywords: SiC Nanowire, Nanowire transistor, 2D ATLAS simulation

E-mail: sk [email protected]

수치

Fig. 2. Experimental electrical characteristics of SiC nanowire FET : (a) V DS -I D characteristics graph as  func-tion of V G of -40, -30, -20, -10, 0, +10, +20, +30 and +40 V, inset graph is enlarged plot of (a)
Fig. 3. Simulated electrical characteristics graph of SiC nanowire FET at same structure with experimentation : (a) V DS -I D characteristics graph as function of V G of -40, -30, -20, -10, 0, +10, +20, +30 and +40 V, inset graph is enlarged plot of (a)
Fig. 4. Simulated electrical characteristics graph for NWs n-type doped SiC NW with 1.5 × 1017 cm −3 : (a) V DS -I D characteristics graph as function of V G of -40, -30, -20, -10, 0, +10, +20, +30 and +40 V, inset graph is enlarged plot of (a)

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