17. Semiconductor Photon Detectors
Detector zoology
6.0 0.2
AlN Direct gap
Indirect gap
III-Nitrides (c ~ 1.6 a0)
5.0 AlN E(eV)=1.24/ λ(㎛)
Theory
p (eV)
0.3
0 4
4.0
th(㎛)
GaN
Zincblend ZnS GaN
Bandga
0.4 0.5 0 6
3.0
2 0 avelengt
AlP
GaP AlAs ZnSe
CdS ZnTe InN
GaN
0.60.7
1.0 2.0
1 0
Wa
InN GaP
GaAs InP
CdSeAlSb CdTe Si
Theory
2.0 0.0 5.0
1.0
6H-SiC ZnO GaSb
InSb Ge
AlO23 InAs
3C-SiC
Al2O3
3 0 3 5 4 0 4 5 5 0 5 5 6 0 6 5
2 5
Lattice Constant (Å)
3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5
2.5
Photon detection devices
Photons to thermal energy
(phototube)
Metal-Semicon. photoconductor (Schottky-barrier photodiode)
( y p )
The External Photoeffect: Photoelectron Emission
Æ Photogenerated electrons escape from the material as free electrons Æ photoelectrons Æ Photogenerated electrons escape from the material as free electrons. Æ photoelectrons
< Ph t lti li t b (PM t b ) >
metal semiconductor
< Phototube > < Photomultiplier tube (PM tube) >
The Internal Photoeffect: Photoconductivity
Æ Excited carriers remain within the material, serve to increase electrical conductivity.
Generation: Absorbed photons generate free carriers (electrons and holes) Generation: Absorbed photons generate free carriers (electrons and holes).
Transport: An applied electric field induces these carriers to move, which results in a circuit current.
Amplification: large electric fields enhance the responsivity of the detector.
Here we will discuss three types of semiconductor photodetectors Photoconductors
Photodiodes (PD)
Here we will discuss three types of semiconductor photodetectors
Quantum efficiency Responsivity
Photon noise Photoelectron noise
Photodiodes (PD)
Avalanche photodiodes (APD)
Responsivity
Response time. Gain noise
Quantum efficiency of photodetectors
⎡ ⎤
Number of Collected electrons Internal Quantum Efficiency
ηint = Number of Collected electrons = −⎡⎣ −α ⎤⎦
Number of Photons *Entering* detector 1
e d
External Quantum Efficiency
( )
ζ α νηext = Number of Collected electrons = − ⎡⎣ − − ⎤⎦ = / Number of Photons *Incident* on detector 1 1
F /
ph o
d i q
R e P
h External Quantum Efficiency
Fresnel loss
S f bi ti ff t
Fraction absorbed in detection region Surface recombination effect
Responsivity and Response time
Photo Current (Amps) i h q Responsivity
η ν
= Photo Current (Amps) = = Incident Optical Power (Watts) ext
ph o
i q
R P h
→Photocurrent : iph = RPo
Photoconductors
Photoconductors
Photodiodes
n
P +
- i
pTwo operation modes of PN photodiodes
Open circuit (photovotaic) Sh t i it ( h t d ti ) Open-circuit (photovotaic)
operation of PDs Short-circuit (photoconductive)
operation of PDs
Open-circuit (photovotaic) operation of PDs
Photovoltage Vp
across the device that increases across the device that increases with increasing photon flux.
This mode of operation is used, for example, in solar cells
Short-circuit operation of PDs
Reverse-biased PDs
p-i-n Photodiodes (PIN PDs)
Heterojunction Photodiodes
Schottky-barrier Photodiodes (M t l i d t PD ) (Metal-semiconductor PDs)
A thin semitransparent metallic A thin semitransparent metallic
film is used in place of the p-type (or n-type) layer in the p-n junction photodiode.
•Simple to fabricate
•Quantum efficiency:
Medium
Problem: Shadowing of absorption region by contacts
•Capacitance: Low T i d
•Capacitance: Low
•Bandwidth: High
Can be increased by thinning absorption layer and
To increase speed,
decrease electrode spacing and absorption depth
backing with a non absorbing material. Electrodes must be moved closer to reduce transit time.
•Compatible with standard electronic processes
Absorption layer
•Compatible with standard electronic processes GaAs FETS and HEMTs
InGaAs/InAlAs/InP HEMTs
Non absorbing substrate
Array Photodiodes : CCD & CMOS
CCD Sensor CMOS Sensor
Conventional Cameras use photographic films to record image.
Digital cameras use a solid Digital cameras use a solid- state device called an image sensor to record image in f f di i l i f i
form of digital information.
CCD = Charge Coupled Device.
CMOS = Complementary Metal Oxide Semiconductor
Comparison CCD/CMOS sensors
CMOS: low cost CCD : medium to high-end
Source: B. Diericks: CMOS image sensor concepts. Photonics West 2000 Short course (Web)
Charge-coupled devices (CCD)
charge transfer to next pixel cell
CCD (Charge coupled device) CCD (Charge coupled device)
• Vertical charge transfer
• Horizontal charge transfer Horizontal charge transfer
• Output capacitor reset
CCD
H i t l Shift R i t
Output
capacitor Amp Horizontal Shift Register
CCD IMAGERS CCD IMAGERS Qualities
Qualities
■ Text book performance for all parameters
(QE, read noise, MTF, dark current, linearity, etc.).
(QE, read noise, MTF, dark current, linearity, etc.).
Deficiencies
■ Low high-energy radiation damage tolerance.
e.g. proton bulk damage and resultant CTE degradation.
■ Significant off-chip electronic support required.
■ Difficulty with high-speed readout (inherently a serial read out device).
CMOS image sensors CMOS image sensors
• Based on
• Based on standard production p
process for CMOS chips,
ll i t ti allows integration with other
components
components.
CMOS IMAGERS CMOS IMAGERS Qualities
Qualities
■ Very tolerant to high-energy radiation sources (long life time).
■ On- chip system integration
(low power, low weight and compact designs).
■ Hi h d / l i ti
■ High speed / low noise operation
(inherently a parallel- random access readout device).
Deficiencies
■ Currently lacks performance in most areas compared to the CCD
( h ti / ll ti / t f d / t)
(charge generation/collection/ transfer and /measurement).
Avalanche Photodiodes (APD)
APD with only one type of carrier (e or h) is desirable.
• High resistivity p-doped layer increases electric field across absorbing region
• High-energy electron-hole pairs ionize other sites to multiply the current
• Leads to greater sensitivity
light absorption intrinsic region
( li htl d d i )
(very lightly doped p region)
High resistivity p region
larger charge density
APD with only one type of carrier (e or h) is desirable.
: ionization coefficients of e and h
Ionization ratio :
Æ h Æ Æ e Æ h Æ e Æ …..
The ideal case of single-carrier multiplication is achieved when The ideal case of single-carrier multiplication is achieved when