EMERSON & CUMING

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EMERSON & CUMING

Room Temp Working Life Specific

Cure or Viscosity (100 gra,s Gravity Temperature

Catalyst Sizes Color Elevated (cP@25ºC) cP@25ºC) cP@25ºC Range of Use

9 4oz, 8oz, 1lbs, 8lbs, 40lbs Amber Room 80-105 45min 1.00 -40 to +130ºC

11 4oz, 8oz, 1lbs, 8lbs, 40lbs Dark Brown Elevated 35-60 >4 hrs. 1.10 -55to +155ºC

15 1lbs, 7lbs, 40lbs Amber/Black Room 25,000 2 hrs. 0.97 -40 to +90ºC

17M-1 4oz, 6oz, 1lbs, 8lbs Tan Room Slurry 24 hrs. 1.40 -20 to +230ºC

23LV 8oz, 1lbs, 8lbs, 40lbs Clear to Amber Room 20-30 1 hr. 1.01 -65to +105ºC

43 4oz, 1lbs, 8lbs, Amber Room 45-65 45min. 1.03 -65to +105ºC

B100 Pt, Qt, Gal, Pail Amber Room 300-500 25 min. 1.02 -40 to +105ºC

STYCAST® Encapsulants

CATALYST Selector Guide

Sizes: Qt, Gal, Pail

Characteristics Handling Properties

Mixed

Thermally Chemical Filled/ Low High Viscosity Mix Ratio Cure Temp. Fastest

Chemistry Conductive Resistance Unfilled Viscosity Temp. (cP @ 25oC) by Weight Room/Heat Cure

Flexible

Two Component Systems

1365-25 A/B Epoxy Good Unfilled X 150 100:100 RT/HT 2 hrs.

1365-65 A/B Epoxy Good Unfilled X 345 100:100 RT/HT 2 hrs.

2741/15 Epoxy Good Filled “ 36,000 “ 100:150 RT/HT 2-4 hrs.

2754 A/B Epoxy X Good Filled “ 24,000 “ 100:40 RT/HT 2 hrs.

4640/25 Silicone Poor X 45,000 100:0.4 RT/HT 4-6 hrs.

TU-906 A/B Polyurethane Good X 3,100 100:400 RT/HT 2 hrs.

XT-1122 A/B Epoxy Good Unfilled X X 1,000 100:66.7 Heat 2 hrs.

One Component Systems

E-151-8 Epoxy Good Unfilled X 1,100 N/A Heat 15 min.

Low Stress

2754 A/B Epoxy X Good Filled 24,000 100:40 RT/HT 2 hrs.

E-1000 A/B Epoxy Good X 1,500 100:120 Heat 3 hrs.

E-1030 A/B Epoxy X Good 12,000 100:14 Heat 3 hrs.

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EMERSON & CUMING

Typical Cured Properties

Temp. Specific Thermal Dielectric Dielectric Glass Coefficient

Range Gravity Conductivity Strength Constant Transition of Thermal Features and Comments

of Use (g/cm3) Hardness (W/m.K) (V/mil) at 1mHz Temp. Expansion Typical Applications

(10-6/oC)

-55 to +90oC 1.01 25A N/A N/A 4.0(1) N/A

-55 to +90oC 1.03 65A N/A N/A 4.0(1) N/A Excellent adhesion to a variety of sub strates.

-55 to +65oC 1.15 60A 0.35 350 3.3 11oC N/A Electronic embedment and sealing of metals,

ceramics, and plastics. Protection of stress sensitivecomponents where shock and impact

-65 to +105oC 1.53 80A 0.63 450 4.9 N/A esistance are required. Typical applications

include transformers,

-65 to +260oC 0.75 70A N/A 250 2.0 N/A An RTV condensation cure. Pourable and

Room temperature curable. motors, coils, and other electrical devices.

-40 to +130oC 1.00 50A N/A N/A N/A N/A Good thermal shock and moisture resistance.

-55 to +155oC 1.05 45D 0.29 360 3.2(2) 60 Heat, thermal shock, and impact resistant.

-40 to +130oC 1.05 55D N/A 325 3.4(2) N/A Excellent thermal shock and impact resistance.

-65 to +105oC 1.53 80A 0.63 450 4.9 N/A Designed for the encapsulation of a wide

range of stress sensitive electronics.They

-40 to +65oC 1.05 30A N/A 300 4.9(3) -18oC N/A offer excellent performance at low

temperatures and provide protection

-55 to +105oC 1.93 79A 0.58 375 5.8 159 from mechanical shock and vibration.

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STYCAST® Encapsulants

Sizes: Qt, Gal, Pail

Characteristics Handling Properties

Mixed

One Two Thermally Chemical Filled/ Low High Viscosity Mix Ratio Cure Temp.

Chemistry Part Part Conductive Resistance Unfilled Viscosity Temp. (cP @ 25oC) by Weight Room/Heat

Flame Retardant

2057FR/11 Epoxy X Good Filled X X 3,400 100:8 Heat

2651-40FR/9 Epoxy X X Good Filled X 8,000 100:9 RT/HT

2850FT-FR/11 Epoxy X X Excellent X 65,000 100:4 RT/HT

E 1420FR A/B Epoxy X Good X 5,000 100:100 Heat

XT-5038-9 A/B Epoxy X Good X 1,600 100:11 RT/HT

G-508-1 Epoxy X X Good X 20,000 N/A Heat

Characteristics Handling Properties

Mixed Temp.

Thermally Chemical Filled/ Low Viscosity Mix Ratio Cure Temp. Fastest Range

Chemistry Conductive Resistance Unfilled Viscosity (cP @ 25oC) by Weight Room/Heat Cure of Use

High Service Temperature

2651-1 Epoxy X Good Filled 52,000 N/A Heat 4 hrs. -40 to +155oC

906-1 Epoxy X Good Filled 190,000 N/A Heat 8 min. -40 to +180oC

926-82-1 Epoxy Excellent 130,000 N/A Heat 12 min. -40 to +180oC

933-48 Epoxy Excellent 150,000 N/A Heat 12 min. -40 to +180oC

2762/17M-1 Epoxy X Excellent Filled 50,000 100:10 Heat 6 hrs. -20 to +230oC

4952/25 Silicone X Poor Filled 35,000 100:0.4 RT/HT 4-6 hrs. -65 to +260oC

5954 A/B Silicone X Poor Filled 35,000 100:100 RT/HT 20 min. -65 to +260oC

W-66/17M-1 Epoxy Excellent 15,000 100:40 Heat 6 hrs. -20 to +220oC

XT-1169 A/B Epoxy Good Filled X 7,300 100:80 Heat 2 hrs. -40 to +155oC

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EMERSON & CUMING

Features and Typical Applications

Provide flame resistance down to 1/8 of an inch. These products also offer various other features such as thermal shock protection, low viscosity, and thermal conductivity. Typical applications include a wide range of electrical componentssuch as capacitors and transformers.

Ability to withstand high temperatures, thermal shock, and chemical exposure. These products are designed for heat generating electronic devices which operate in harsh environments. Typical applications include sensors, ransformers, power supplies, and rectifiers.

Typical Cured Properties

Temp. Specific Thermal Dielectric Dielectric Glass Coefficient

Fastest Range Gravity Conductivity Strength Constant Transitionof Thermal

Cure of Use (g/cm3) Hardness (W/m.K) (V/mil) at 1mHz Temp. Expansion

(10-6/oC)

30-60 min. -55 to +155oC 1.58 85D 0.40 425 4.4 43

30-60 min. -40 to +130oC 1.49 87D 0.55 450 3.8 56

30-60 min. -55 to +155oC 2.33 94D 1.23 490 6.0 30

-40 to +130oC 1.27 65D N/A N/A 2.7 120

30 min. -40 to +130oC 1.48 85D N/A N/A 4.0 59oC 146

12 min. -20 to +180oC 1.55 85D 0.60 N/A N/A N/A

Typical Cured Properties

Specific Thermal Dielectric Dielectric Glass Coefficient Gravity Conductivity Strength Constant Transition of Thermal (g/cm3) Hardness (W/m.K) (V/mil) at 1mHz Temp. Expansion (10-6/oC)

1.60 88D 0.58 440 3.7 45

2.30 90D 0.86 400 N/A N/A

1.53 85D N/A 350 N/A N/A

1.45 85D N/A 350 N/A N/A

2.26 96D 1.37 400 3.3 N/A

2.20 70A 1.00 550 5.2 162

2.45 85A 1.15 450 5.0 -120oC 150

1.23 85D N/A 510 4.4(3) N/A

1.44 80D 0.40 420 3.6(3) 40

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EMERSON & CUMING

STYCAST® Encapsulants

Sizes: Qt, Gal, Pail

Characteristics Handling Properties

Mixed

One Two Thermally Chemical Filled/ Low High Viscosity Mix Ratio Cure Temp.

Chemistry Part Part Conductive Resistance Unfilled Viscosity Temp. (cP @ 25oC) by Weight Room/Heat

Easy Mix Ratio

1265 A/B Epoxy Good X 600 100:100 Heat

1269A A/B Epoxy Good X 5,000 100:100 Heat

1497 A/B Epoxy X X Good X 150,000 100:100 Heat

2072 A/B Epoxy X Good X 8,000 100:50 RT/HT

2741LV/15LV Epoxy Good 30,000 400:100 RT/HT

2760 A/B Epoxy/Polyurethane X X Good Filled 18,000 100:50 RT/HT

3180M A/B Epoxy Good 15,000 100:100 RT/HT

5952 A/B Silicone X X Poor Filled X 40,000 100:100 RT/HT

E 1410 A/B Epoxy X X Good X 35,000 100:100 Heat

S 5225 A/B Silicone X Poor X X 2,420 100:100 RT/HT

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Primarily designed for ease of use in eithermeter mix or manual dispense operations. These products also offer a wide range of features including heat dissipation, thermal and mechanical shockas well as thermal conductivity.

Typical Cured Properties

Temp. Specific Thermal Dielectric Dielectric Glass Coefficient Fastest Range Gravity Conductivity Strength Constant Transition of Thermal

Cure of Use (g/cm3) Hardness (W/m.K) (V/mil) at 1mHz Temp. Expansion

(10-6/oC)

-40 to +65oC 1.08 25A N/A N/A 3.0

-40 to +130oC 1.20 85D 0.27 430 3.8

12-16 Hrs. -65 to +155oC 1.70 80D 0.68 425 3.6 N/A

2-4 Hrs. -40 to +130oC 1.60 89D 0.42 400 4.2 61

-40 to +90oC 1.43 80D N/A 400 3.3

2 Hrs. -40 to +130oC 1.55 80D 0.60 450 4.0 122

-40 to +130oC 1.62 80D 0.40 430 4.0

20 mins. -65 to +260oC 2.05 75A 0.85 450 5.0 200

-40 to +175oC 1.80 94D 0.57 N/A 4.0(3) 106

-60 to +220oC 1.59 53A N/A 450 3.0 N/A

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EMERSON & CUMING

STYCAST® Encapsulants

Sizes: Qt, Gal, Pail

Characteristics Handling Properties Typical Cured Properties

Mixed Temp.

Thermally Chemical Filled/ Low High Viscosity Mix Ratio Cure Temp. Fastest Range Chemistry Conductive Resistance Unfilled Viscosity Temp. (cP @ 25oC) by Weight Room/Heat Cure of Use

General Purpose

A-312 Epoxy Excellent Unfilled X 3,000 N/A Heat 3 min. -40 to +130oC

E-151-8 Epoxy Good Unfilled X 1,100 N/A Heat 15 min. -40 to +130oC

1090/11 Epoxy Good X 29,000 100:10.5 Heat 30-60 min. -55 to +155oC

2057/9 Epoxy Good Filled X 4,000 100:6.5 RT/HT 1-2 hrs. -40 to +130oC

2651-40/23LV Epoxy X Good Filled X 2,200 100:18 RT/HT 2-4 hrs. -65 to +105oC

2651MM/11 Epoxy X Good Filled X 13,000 100:8.5 Heat 30-60

min.

-55 to +155oC

E 1400 A/B Epoxy X Good Filled 15,000 100:100 RT/HT 2-4 hrs. -65 to +105oC

Characteristics Handling Properties Typical Cured Properties

Mixed Temp. Specific

Chemical Filled/ Low High Viscosity Mix Ratio Cure Temp. Fastest Range Gravity Chemistry Resistance Unfilled Viscosity Temp. (cP @ 25oC) by Weight Room/Heat Cure of Use (g/cm3)

Thermally Conductive

1495/11 Epoxy Good Filled X 14,000 100:5 Heat 30-60 min. -55 to +155oC 1.89

2850FT/11 Epoxy Excellent Filled X 64,000 100:4.5 Heat 30-60 min. -55 to +155oC 2.29

4954/25 Silicone Poor Filled X 40,000 100:0.4 RT/HT 4-6 hrs. -65 to +260oC 2.30

2851FT Epoxy Excellent Filled X 100,000 N/A Heat 60 min. -55 to +155oC 2.25

906-1 Epoxy Excellent Filled X 190,000 N/A Heat 8 min. -40 to +180oC 2.30

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Features and Typical Applications Provide excellent heat dissipation and thermal shock resistance as well as protection from moisture and chemical agents. Typical applications include sensors, transformers, transducers, switches, and other small devices.

Features and Typical Applications Designed as general purpose encapsulants, these products offer a wide range of features ncluding thermal conductivity, mechanical shock and impact resistanceas well as thermal shock protection.

Specific Thermal Dielectric Dielectric Glass Coefficient Gravity Conductivity Strength Constant Transition of Thermal (g/cm3) Hardness (W/m.K) (V/mil) at 1mHz Temp. Expansion (10-6/oC)

1.14 86D N/A N/A N/A N/A N/A

1.05 55D N/A 325 3.4(3) N/A

0.80 82D 0.19 375 2.7 40

1.54 85D N/A 400 4.2 50

1.40 85D 0.55 450 3.8 61

1.59 89D 0.60 450 3.7 40

1.68 75D 0.74 400 4.0 11oC 149

Thermal Dielectric Dielectric Glass Coefficient Conductivity Strength Constant Transition of Thermal

Hardness (W/m.K) (V/mil) at 1mHz Temp. Expansion

(10-6/oC)

95D 1.25 400 4.1 33

96D 1.28 380 5.4 115oC 98

80A 1.30 520 5.0 157

94D 1.44 N/A 5.2 31

90D 0.86 400 N/A N/A

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Mixed Specific Tensile Lap

Mix Ratio Viscosity Gravity Shear Strength Temperature

Product Color A:B cP @ 25°C @ 25°C Cure Schedule (PSI) Range of Use Sizes

General Purpose

Two Component Systems - Epoxy Based

26 Off-White 100:100 Thixotropic 1.40 4 hr @ 25°C 2,100 -40 to +105°C Tube, Pt, Qt

A/B Paste or 20 min @ 65°C

Filled, room temperature curing, general purpose, epoxy adhesive. Recommended for varied uses including repair and manufac- ture of tools, furniture, boats, and electronic sub-assemblies.

286 White 100:100 Thixotropic 1.71 24 hr @ 25°C 2,200 -55 to +105°C Qt, Gal, Pail

A/B (by Volume) Paste or 4 hr @ 45°C

or 2 hr @ 65°C

Filled, general purpose, thermally conductive, epoxy adhesive. Room temperature cure. Convenient mix ratio. Recommended for a wide variety of maintenance and production applications. Ideal for use in piping applications

involving metal and plastic pipe.

45 Black 100:50 to 37,000 1.34 to 24 hr @ 25°C 3,100 -40 to +90°C 1lbs, 12lbs, 60lbs

100:150 1.18 or 30 min @ 70°C

(Cat 15) or 15 min @ 105°C

Filled, general purpose, room temperature curing, epoxy adhesive and sealant. Flexibility can be adjusted by the amount of Catalyst 15 used. Convenient mix ratio. Good impact resistance. Excellent adhesion to metal, glass, and plastic substrates.

45 CLEAR Amber 100:100 to 20,000 1.07 to 24 hr @ 25°C 2,400 -40 to +90°C 1lbs, 8lbs, 48lbs

100:300 1.04 or 30 min @ 70°C

(Cat 15 CLR) or 15 min @ 105°C

Clear, unfilled version of ECCOBOND^®45.

45 LV Black 100:25 to 25,000 1.43 to 24 hr @ 25°C 2,400 -40 to +90°C 1lbs, 12lbs, 60lbs

100:100 1.23 or 30 min @ 70°C

(Cat 15 LV) or 15 min @ 105°C

Lower viscosity version of ECCOBOND^®45.

51 Black Varies with 200,000⁽¹⁾ 1.63⁽²⁾ Refer to 2,200⁽³⁾ Refer to 2lbs, 12lbs, 60lbs

Catalyst Used Catalyst Chart Catalyst Chart

Filled, general purpose, epoxy adhesive. Used with a variety of catalysts. Excellent adhesion to a variety of metal, plastic and ceramic substrates.

55 Milky Varies with 16,000⁽¹⁾ 1.18⁽²⁾ Refer to 1,700⁽³⁾ Refer to 1lbs, 9lbs, 48lbs

White Catalyst Used Catalyst Chart Catalyst Chart

Unfilled, low viscosity, general purpose, epoxy adhesive. Used with a variety of catalysts. Typical applications include electronic component assembly, staking of adjustment and calibration screws, anchoring of inserts and end filling.

ECCOBOND® Adhesives

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Mixed Specific Volume Tensile Lap

Mix Ratio Viscosity Gravity Resistivity Shear Strength Temperature

Product Color A:B cP @ 25°C @ 25°C Cure Schedule (Ohm-Cm) (PSI) Range of Use Sizes

Electrically Conductive

Silver Filled Systems

56 C Silver 100:2.5 Thixotropic 3.50 60 min @ 65°C 0.0002 800 -40 to +130°C 113 Grm Kit

(Cat 9) Paste or 30 min @ 100°C 454 Grm Kit

Silver filled, high electrical conductivity, epoxy adhesive. Excellent thermal conductivity. Requires heat cure to obtain optimal properties. Recommended for applications where hot soldering is impractical. Listed on many government specifications.

57 C Silver 100:100 Thixotropic 3.50 16 hr @ 25°C 0.0006 700 -40 to +90°C 113 Grm Kit

A/B Paste or 3 hr @ 65°C 454 Grm Kit

or 45 min @ 100°C

Silver filled, electrically conductive, room temperature curing, epoxy adhesive. Good thermal conductivity. Convenient 1:1 mix ratio by weight or volume. Adheres to a wide variety of substrates. Recommended for use in applications where hot soldering is impractical.

59 C Silver N/A Thixotropic 2.40 20 min @ 25°C 0.001 300 -55 to +260°C 113 Grm Kit

Paste 454 Grm Kit

One component, solvent containing, silver filled, electrically conductive, silicone pressure sensitive adhesive.

High flexibility. High tack. Bonds formed can be repeatedly opened and sealed.

83 C Silver 100:3.5 Thixotropic 3.00 60 min @ 65°C 0.0004 1,000 -55 to +130°C 113 Grm Kit

Paste or 30 min @ 100°C 454 Grm Kit

Two component, silver filled, electrically conductive, epoxy adhesive. Smooth, creamy consistency. Good thermal conductivity. Requires heat cure to obtain optimal properties. Easier handling version of ECCOBOND^®56 C with similar properties.

C 429-2 Silver N/A 2,500,000 4.20 90 min @ 125°C 0.2 2,000 -55 to +155°C 125 Grm, 250 Grm

or 30 min @ 150°C 500 Grm

or 5 min @ 180°C

One component, high strength, moderate cost, silver filled, electrically conductive, epoxy adhesive. Excellent adhesion and long term durability. Designed for use in miniature lamp bonding.

Nickel Filled System

64 C Dark Grey 100:5 Thixotropic 3.20 24 hr @ 25°C 0.02 800 -55 to +130°C 109 Grm

A/B Paste or 1 hr @ 65°C 432 Grm

or 30 min @ 100°C

Two component, nickel filled, electrically conductive, epoxy adhesive. Room temperature cure. Good balance of low cost and high conductivity. Recommended for use where exposure to salt water causes silver based systems to corrode.

ECCOBOND® Adhesives

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Thermally Conductive

One-Component Systems - Epoxy Based

281 Black N/A Thixotropic 2.21 4 hr @ 85°C 2,000 -55 to +175°C Qt, Gal, Pail

Paste or 1 hr @ 120°C

or 30 min @ 150°C or 15 min @ 175°C

Highly filled, thermally conductive, thixotropic, epoxy adhesive. Good thermal shock, electrical insulation and chemical resistance properties. Low coefficient of expansion. Recommended for bonding metals and ceramics in heat sink applications.

A 410-05 P Grey N/A Thixotropic 1.50 45 min @ 120°C 4,000 -40 to +180°C Qt, Gal, Pail

Paste or 10 min @ 160°C

or 3 min @ 175°C

High strength, aluminum filled, epoxy adhesive for bonding to most oily or other poorly prepared metal surfaces.

Sag resistant. Excellent heat and chemical resistance. Recommended for bonding metal motor housings.

276 Black 100:10 Thixotropic 2.35 8 hr @ 120°C 2,700 -40 to +230°C Qt, Gal, Pail

(Cat 17 M 1) Paste or 6 hr @ 150°C

or 3 hr @ 175°C or 2 hr @ 200°C

Highly filled, high temperature resistant, thermally conductive, epoxy adhesive and sealant. Requires heat cure. Excellent chemical resistance. Used for bonding metal, glass and ceramic substrates.

285 Black Varies with Thixotropic 2.40⁽²⁾ Refer to 2,100⁽³⁾ Refer to Qt, Gal, Pail

Catalyst Used Paste⁽¹⁾ Catalyst Chart Catalyst Chart

Highly filled, thermally conductive, epoxy adhesive. Low shrinkage and coefficient of expansion. Used with a variety of catalysts. Recommended for bonding metal and ceramic substrates in heat sink applications.

286 White 100:100 Thixotropic 1.71 24 hr @ 25°C 2,200 -55 to + 105°C Qt, Gal, Pail

or 2 hr @ 65°C

involving metal and plastic pipe.(1) Indicates viscosity of resin only. Mixed viscosity will vary with catalyst used.

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Mixed Specific Tensile Lap Peel

Mix Ratio Viscosity Gravity Shear Strength Strength Temperature

Product Color A:B cP @ 25°C @ 25°C Cure Schedule (PSI) (PLI) Range of Use Sizes

High Strength-Peel

45 Black 100:50 to 37,000 1.34 to 24 hr @ 25°C 3,100 – -40 to +90°C 1lbs, 12lbs

100:150 1.18 or 30 min @ 70°C 60lbs

(Cat 15) or 15 min @ 105°C

Filled, general purpose, room temperature curing, epoxy adhesive and sealant. Flexibility can be adjusted by the amount of Catalyst 15 used. Convenient mix ratio. Good impact resistance. Excellent adhesion to metal, glass, and plastic substrates.

91 Black Varies with 98,000⁽¹⁾ 1.57⁽²⁾ Refer to 3,500⁽³⁾ – Refer to 2lbs, 12lbs

Fiberglass filled, medium viscosity, epoxy adhesive with excellent thermal cycling properties. Used with a variety of catalysts. Designed for bonding metals exposed to high stress conditions and for bonding crystals to metals in continuous vibration applications.

ECCOBOND® Adhesives

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High Strength-Impact Resistance

One Component System - Epoxy Based

G 757 Grey N/A Thixotropic 1.20 45 min @ 140°C 1,500 -40 to +140°C Qt, Gal, Pail

or 10 min @ 180°C

Very flexible, thixotropic, epoxy adhesive. Excellent low temperature resistance. Excellent adhesion to glass, steel, copper, aluminum and fiberglass reinforced plastics. Recommended for use in headlamp glass bonding.

Two Component System - Epoxy Based

24 Clear 100:28 800 1.17 24 hr @ 25°C 1,800 -65 to +105°C 2lbs, 17lbs

A/B or 4 hr @ 45°C

or 2 hr @ 65°C

Clear, low viscosity, room temperature curing, epoxy adhesive. Exhibits resilient bonds when joining dissimilar materials. Excellent impact resistance. Recommended for bonding glass, polystyrene, polysulfone, polycarbonate, rigid PVC and PVDC.

45 Black 100:50 to 37,000 1.34 to 24 hr @ 25°C 3,100 -40 to +90°C 1lbs, 12lbs

100:150 1.18 or 30 min @ 70°C 60bs

(Cat 15) or 15 min @ 105°C

Filled, general purpose, room temperature curing, epoxy adhesive and sealant. Flexibility can be adjusted by the amount of Catalyst 15 used. Convenient mix ratio. Good impact resistance. Excellent adhesion to metal, glass and plastic substrates.

45 CLEAR Amber 100:100 to 20,000 1.07 to 24 hr @ 25°C 2,400 -40 to +90°C 1lbs, 8lbs

100:300 1.04 or 30 min @ 70°C 48lbs

(Cat 15 CLR) or 15 min @ 105°C

Clear, unfilled version of ECCOBOND^®45.

91 Black Varies with 98,000⁽¹⁾ 1.57⁽²⁾ Refer to 3,500⁽³⁾ Refer to 2lbs, 12lbs

Fiberglass filled, medium viscosity, epoxy adhesive with excellent thermal cycling properties. Used with a variety of catalysts. Designed for bonding metals exposed to high stress conditions and for bonding crystals to metals in continuous vibration applications.

ECCOBOND® Adhesives

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Low Temperature Performance

One Component Systems - Epoxy Based

930-09 Grey N/A Thixotropic 1.28 40 min @ 140°C 1,200 -55 to +120°C Qt, Gal, Pail

or 15 min @ 180°C

Flexible, non-blushing, epoxy adhesive for glass headlamp bonding. Maintains flexibility at temperatures as low as –40°C. Low volatility. Excellent humidity resistance.

or 10 min @ 180°C

Very flexible, thixotropic, epoxy adhesive. Excellent low temperature resistance. Excellent adhesion to glass, steel, copper, aluminum and fiberglass reinforced plastics. Recommended for use in headlamp glass bonding.

24 Clear 100:28 800 1.17 24 hr @ 25°C 1,800 -65 to +105°C 3lbs, 12lbs

A/B or 4 hr @ 45°C

or 2 hr @ 65°C

Clear, low viscosity, room temperature curing, epoxy adhesive. Exhibits resilient bonds when joining dissimilar materials. Excellent impact resistance. Recommended for bonding glass, polystyrene, polysulfone, polycarbonate, rigid PVC and PVDC.

285 Black Varies with Thixotropic 2.40^{( 2)} Refer to 2,100⁽³⁾ Refer to Qt, Gal, Pail

Catalyst Used Paste⁽¹⁾ Catalyst Chart Catalyst Chart

Highly filled, thermally conductive, epoxy adhesive. Low shrinkage and coefficient of expansion. Used with a variety of catalysts. Recommended for bonding metal and ceramic substrates in heat sink applications.

286 White 100:100 Thixotropic 1.71 24 hr @ 25°C 2,200 -55 to +105°C Qt, Gal, Pail

or 2 hr @ 65°C

involving metal and plastic pipe.

Two Component System - Silicone Based

TP 50 Red 100:9 Thixotropic 1.87 24 hr @ 25°C 100 -65 to +230°C Qt, Gal, Pail

A/B Paste or 1 hr @ 120°C

Filled, RTV silicone rubber, paste adhesive. Room temperature cure. Very flexible. Color coded for ease of use. Requires use of a primer (Primer S-11). Recommended for seam sealing, caulking, bonding or application to vertical surfaces.

ECCOBOND® Adhesives

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High Temperature Performance

2780-45 Black N/A 65,000 1.73 90 min @ 120°C 3,000 -40 to +180°C Qt, Gal, Pail

or 40 min @ 140°C or 20 min @ 160°C

Filled, pourable, high temperature resistant, epoxy adhesive. Long term resistance to boiling glycol. Excellent thermal shock resistance. Recommended for tube and radiator sealing.

281 Black N/A Thixotropic 2.21 4 hr @ 85°C 2,000 -55 to +175°C Qt, Gal, Pail

Paste or 1 hr @ 120°C

or 30 min @ 150°C or 15 min @ 175°C

Highly filled, thermally conductive, thixotropic, epoxy adhesive. Good thermal shock, electrical insulation and chemical resistance properties. Low coefficient of expansion. Recommended for bonding metals and ceramics in heat sink applications.

A 359 Grey N/A Thixotropic 1.50 90 min @ 100°C 3,000 -40 to +180°C 6oz, Qt

Paste or 30 min @ 120°C Gal, Pail

or 5 min @ 160°C

Aluminum filled, heat curing, epoxy adhesive. Sag resistant. Exceptional thermal and chemical resistance. High hot strength.

Used for replacing brazing in pipe and air conditioner tube assemblies.

A 410-05 P Grey N/A Thixotropic 1.50 45 min @ 120°C 4,000 -40 to +180°C Pint,Qt

or 3 min @ 175°C

High strength, aluminum filled, epoxy adhesive for bonding to most oily or other poorly prepared metal surfaces. Sag resistant.

Excellent heat and chemical resistance. Recommended for bonding metal motor housings.

or 2 hr @ 177°C or 1 hr @ 200°C

Filled, heat curing, high temperature resistant, epoxy adhesive. Excellent chemical resistance. Maintains high shear strength up to 230°C. Recommended for bonding metals, glass, ceramics and high temperature thermoset plastics.

(Cat 17 M 1) Paste or 6 hr @ 150°C

or 3 hr @ 175°C or 2 hr @ 200°C

Highly filled, high temperature resistant, thermally conductive, epoxy adhesive and sealant. Requires heat cure. Excellent chemical resistance. Used for bonding metal, glass and ceramic substrates.

Two Component System - Silicone Based

TP 50 Red 100:9 Thixotropic 1.87 24 hr @ 25°C 100 -65 to +230°C Qt, Gal, Pail

Filled, RTV silicone rubber, paste adhesive. Room temperature cure. Very flexible. Color coded for ease of use. Requires use of a primer (Primer S-11). Recommended for seam sealing, caulking, bonding or application to vertical surfaces.

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Fast Cure

A 316-48 Black N/A 53,000 1.37 60 min @ 100°C 2,500 -40 to +155°C Qt, Gal, Pail

or 30 min @ 120°C or 15 min @ 140°C or 2 min @ 175°C

Pourable, fast heat curing, epoxy adhesive and insulation compound. Excellent chemical and heat resistance.

A 359 Grey N/A Thixotropic 1.50 90 min @ 100°C 3,000 -40 to +180°C 6oz,Qt

or 5 min @ 160°C

Aluminum filled, heat curing, epoxy adhesive. Sag resistant. Exceptional thermal and chemical resistance. High hot strength. Used for replacing brazing in pipe and air conditioner tube assemblies.

D 275 Black N/A 70,000 1.15 60 min @ 100°C 4,500 -40 to +130°C 12oz, Qt

or 20 min @ 120°C Gal, Pail

or 6 min @ 160°C

Semi-rigid, high strength, fast curing, pourable, epoxy structural adhesive. Good peel strength (12 pli).

Recommended for bonding metals, plastics and ceramics.

D 778 Yellow N/A Thixotropic 1.20 45 min @ 100°C 2,800 -40 to +130°C Qt, Gal, Pail

or 10 min @ 160°C

High strength, semi-flexible, thixotropic, fast heat curing, epoxy structural adhesive. Good peel strength (20 pli). Recommended for reinforcing riveted or weld bonded metal panels for cabinets, buses, trailers or other sheet metal structures.

G 909 Grey N/A Thixotropic 1.15 90 min @ 100°C 5,800 -40 to +150°C Pt, Qt

or 20 min @ 150°C

High strength, thixotropic, flexible, epoxy adhesive. High peel strength (30 pli). Recommended for bonding copper, aluminum and fiberglass reinforced plastics. Good bonds to oily steel.

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Specialty

Filter End Cap

A 316 Beige N/A 38,000 1.38 20 min @ 120°C 2,500 -40 to +155°C Qt, Gal, Pail

or 10 min @ 140°C or 5 min @ 160°C or 2 min @ 180°C

One component, pourable, fast heat curing, epoxy adhesive. Exhibits excellent thermal stability and resistance to chemicals. Used as end cap adhesive for jet fuel and hydraulic oil filters. Available in a range of colors and viscosities.

Lighting

930-09 Grey N/A Thixotropic 1.28 40 min @ 140°C 1,200 -55 to +120°C Qt, Gal, Pail

or 15 min @ 180°C

One component, flexible, non-blushing, epoxy adhesive for glass headlamp bonding. Maintains flexibility at temperatures as low as -40°C. Low volatility. Excellent humidity resistance.

or 10 min @ 180°C

One component, very flexible, thixotropic, epoxy adhesive. Excellent low temperature resistance. Excellent adhesion to glass, steel, copper, aluminum and fiberglass reinforced plastics. Recommended for bonding glass headlamps.

3193-17 Grey N/A Thixotropic 1.17 25 min @ 100°C – -40 to +105°C Qt, Gal, Pail

One component, heat curing, thixotropic epoxy adhesive. 100% solids and elastomer modified. Bonds well to ABS, polycarbonate and other heat sensitive plastics. For bonding automotive headlamp lens to reflector.

Needle Bonding

1962-31 Cream N/A 29,000 1.62 90 min @ 105°C 1,800 -40 to +155°C Qt, Gal, Pail

or 30 min @ 120°C or 15 min @ 140°C

One component, medium viscosity, epoxy needle bonding adhesive. Designed to bond stainless steel cannulae into polypropylene hubs. Also recommended as a filter end cap adhesive.

927-10 E Yellow N/A 11,000 1.34 20 min @ 90°C 1,400 -40 to +105°C Qt, Gal, Pail

or 15 min @ 100°C or 10 min @ 120°C

One component, fast curing, epoxy adhesive for needle bonding with polypropylene hubs. Also recommended for bonding, sealing or insulating of heat sensitive parts.

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(1) Indicates viscosity of resin only. Mixed viscosity will vary with catalyst used.

(2) Indicates specific gravity of resin only. Mixed specific gravity will vary with catalyst used.

(3) Indicates typical tensile lap shear strength value. Tensile lap shear strength will vary with catalyst used.

Specific Working Life

Viscosity Gravity (100 Grams Typical Cure Temperature

Product Color cP @ 25°C @ 25°C @ 25°C) Schedule Range of Use Sizes

Catalysts

Room Temperature Cure - Variable Hardness

15 Black 25,000 0.97 2 hr 16-24 hr @ 25°C -40 to +90°C 1lbs, 7lbs, 40lbs

15 Clear Light Amber or 2-4 hr @ 65°C 1lbs, 8lbs, 40lbs

Easy-to-use, simple mix ratios. Hardness of cured castings can be controlled by the amount of hardener used. Long working life. Yields cured castings or adhesives having outstanding adhesion to a wide variety of substrates. Very low peak exotherm.

15 LV Black 15,000 0.97 2 hr 16-24 hr @ 25°C -40 to +90°C 1lbs, 8lbs, 40lbs

15 LV Clear Light Amber or 2-4 hr @ 65°C 1lbs, 8lbs, 40lbs

Lower viscosity version of 15/15 Clear.

Room Temperature Cure - General Purpose

9 Amber 80-105 1.00 45 min 16-24 hr @ 25°C -40 to +130°C 4oz, 8oz

or 2-4 hr @ 65°C 1lbs, 8lbs, 40lbs

General purpose, low viscosity. Imparts good physical strength and chemical resistance to cured castings.Recommended for most general purpose applications.

1309 Blue 75 1.01 20 min 8-16 hr @ 25°C -40 to +130°C 8oz, 1lbs

or 1-2 hr @ 65°C 8lbs, 40lbs

Faster curing version of 9. Very fast room temperature curing, low viscosity, general purpose. Short working life. Imparts excellent chemical resistance.

Recommended for adhesives and small castings due to high exotherm.

23 LV Water-Clear 20-30 1.01 60 min 16-24 hr @ 25°C -65 to +105°C

to Slight Amber or 2-4 hr @ 65°C

Excellent low temperature performance properties, excellent thermal shock/cycle and impact resistance. Best hardener for cryogenic applications.

Excellent adhesion to glass. Very low viscosity, low exotherm. Light color good for clear castings.

24 LV Water-Clear 10-25 1.01 30 min 8-16 hr @ 25°C -65 to +105°C 4oz, 8oz

to Slight Amber or 1-2 hr @ 65°C 1lbs, 8lbs, 40lbs

Faster curing, shorter working life version of 23 LV. Recommended for small mass castings due to higher exotherm.

Heat Cure

11 Dark Brown 35-60 1.10 >4 hr 2-4 hr @ 100°C -55 to +155°C 4oz, 8oz

(@ 35°C) +4-16 hr @ 150°C 1lbs, 8lbs, 40lbs

General purpose, low viscosity, elevated temperature curing. Long working life. Yields cured coatings with excellent chemical resistance. Subject to partial crystallization at temperatures below 65°C. (Crystals can be removed by warming gently to 65°C and maintaining until all crystals have dissolved.)

43 Amber 45-65 1.03 45 min 16-24 hr @ 25°C -40 to +175°C 4oz, 1lbs, 8lbs

or 1-2 hr @ 65°C +2-4 hr @ 150°C

Room temperature gelling version of 28. Excellent for low stress potting and bonding. Will post cure in actual use. Combines the benefits of both 9 and 28.

B 97 Reddish 4,000-8,000 0.96 >24 hr 4 hr @ 60°C -20 to +230°C Pt, Qt

Brown +1-4 hr @ 150°C

Very high temperature resistance, not as brittle as 17 M 1. Cures from 80° to 200°C. Excellent chemical resistance. May also be used as an accelerator for 17 M 1. Long working life. Cured castings exhibit excellent retention of properties at elevated temperatures and outstanding chemical resistance.

17 M 1 Tan Slurry 1.40 >24 hr 3 hr @ 125°C -20 to +230°C 4oz, 6oz

@ 25°C +3 hr @ 150°C 1lbs, 8lb

+16 hr @ 175°C

Very high temperature resistant, highest high-temperature strength, lowest shrink. Non-crystallizing.Long working life. Imparts excellent chemical resistance to cured castings. Recommended for applications requiring the optimum in high temperature performance.