A Comparative Study of Acid Leaching Behavior of Copper from Waste Printed Circuit Boards (PCBs)

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Vol. 49, No. 4 O2012PG pp. 479-486

ඍ଴৐ฎߦ׆ൡଞߦऀഉ֜ࠤॺಅౢՋܛଭण֗઴֜

׌ࢢজÂ ୨஼׆Â ଲ୍వ Â ׌ࣦ৤Â ׌৤լ

A Comparative Study of Acid Leaching Behavior of Copper from Waste Printed Circuit Boards (PCBs)

Min-seuk Kim, Jinki Jeong, Jae-chun Lee , Byung-su Kim and Soo-kyoung Kim

Abstract : Leaching of copper from the shredded waste printed circuit boards has been studied in nitric and sulfuric acid solutions. Hydrogen peroxide was added as oxidant in the case of sulfuric acid leaching. Effects of parameters such as acid and hydrogen peroxide concentrations, solution temperature, pulp density, and leaching time were investigated. In the nitric acid solution, an optimum copper dissolution of 96% was obtained in 120 min at 90Gtemperature, 100 g/L pulp density and 4.0 M HNO3 concentration. In the 2.0 M sulfuric acid solution with 10 vol.% hydrogen peroxide, 87% of copper was leached out in 120 min at 50Gtemperature and 50 g/L pulp density; the leaching of copper decreased remarkably by increasing the pulp density beyond 50 g/L. Tin and lead, the alloy components of solder, were leached into solution to less than 5% because of precipitation of tin as stannic acid in nitric acid and lead as sulfate in sulfuric acid solutions, respectively.

Key words : Waste printed circuit boards, Leaching, copper, Nitric acid, Sulfuric acid

څ أ ݗԓęডԓںࠞ߻܃ͿԐڌॠيқթʽदۍթধͿşࣺڷͿҙࢢĵνۆࠞ߻äʴقʂॢٍĵε

սॱॠٕɰ. ডԓࠞ߻قԴəęԓজսՙεԓজ܃ͿߐÀॠٕɰ. ࠞ߻܃ۆȬʪ, ࠞ߻֨Âę٣ʪ, ęԓজսՙ ۆȬʪ, ġؚȬʪˣۋĵνۆࠞ߻قй࠘əٖॳںܓԐॠٕɰ. ݗԓڌؚقۆॢĵνࠞ߻ۆ߯ۺܓæڹ

ݗԓȬʪ4.0 M, ġؚȬʪ100 g/L, ࠞ߻٣ʪ90, ࠞ߻֨Â120қۋ϶, ۋ˺ĵνۆࠞ߻ڱڹ96% ۋؽɰ.

ডԓȬʪ2.0 M, ęԓজսՙȬʪ10 vol.%, ġؚȬʪ50 g/L, ࠞ߻٣ʪ50, ࠞ߻֨Â120қۆࠞ߻ܓæقԴ

87%ۆĵνÀࠞ߻ʼؽڷ϶, ġؚȬʪÀ50 g/L ۋԜڷͿݒÀ॥ق˰͆ĵνࠞ߻ڱڹśü০Çՙॠٕɰ.

՝ʌۆ०ŚڙՙۍܳԵęǬڹÁÁݗԓࠞ߻قԴܳԵԓ, ডԓࠞ߻قԴডԓǬڷͿԵ߻ʼرϔڍǰڹࠞ߻

ڱںǣࢍǴؽɰ.

ܳڅر दۍթধͿşࣺ, ࠞ߻, ĵν, ݗԓ, ডԓ

2012ț4ښ24ێۿս, 2012ț8ښ10ێ֮ԐٰΒ 2012ț8ښ23ێóۦঝ܁

1) ॢĶݓݗۙڙٍĵڙġНۙڙٍĵ҆ҙ

*Corresponding Author(ۋۦߎ) E-mail; [email protected]

Address; Mineral Resources Research Division, Korea Institute of Geoscience & Mineral Resources, Daejeon 305-350, Korea

Դ΁

ۍթধͿşࣺ(Printed Circuit Boards)ڹۻşۻۙ܃

ुۆۚʴقज़սۺۍ४֮ĵՁुڷͿԴäۆϿ˜ۻ şۻۙ܃ुقԺ࠘ʼرەɰ. ۍթধͿşࣺڹࡾóş

ࣺę şࣺق ࢓ۦʼر ەə ۻۙҙु˞Ϳ ĵқʼəʚ,

ܳşࣺقəedge connectors, intergrated circuits, transistors,

capacitors, resistors ˣęÏڹäۆϿ˜ܛΪۆۻۙҙ

ु˞ۋ ࢓ۦʼر ەɰ. ۍթধͿşࣺۆ ܓՁڹ Ձɠę

܃ܓٍʪق ˰͆ ɵ͆ݓ϶ ێъۺڷͿ ڮν, Ճ͆кę

ԓজНۋ30%, ࣰ॔͆֟ۋ30%, Ś՚ۋ40% ܁ʪͿ؎

Ͳ܋ەɰ. ۍթধͿşࣺقۤ޳ʽۻۙҙु˞ڹɰتॢ

ڙՙ˞ں ॥ڮॠČ ەəʚ ܳڅ ڙՙͿə Ś(Au), ڹ (Ag), ࣻ͆˘(Pd), іŚ(Pt) ˣŊŚ՚ںҼ΅ॠيĵν (Cu),؎Θйɔ(Al), ؉ٍ(Zn), ߏ(Fe), ɦࡃ(Ni), Ǭ(Pb),

ܳԵ(Sn), Ҽ֟υ֟(Bi), ؋࣯Ђ(Sb), ࡾ΃(Cr), Ѯπή (Be)ˣęÏڹڮڌŚ՚˞ۋەɰ. ۋܼقԴǬ, ࡾ΃, Ѯπή ˣڹ ۍߕ ф ঞąڮ३НݗͿ қΪʼČ ەɰ

(Sun, 1991; Brodersen et al., 1992; Hoffmann, 1992; Cui and Zhang, 2008; Kumar et al., 2010).

߯Ŗ˞رߐɳşցۆś՚ॢьۻęą܃ՁۤڹՙҼ

ٍĵȦЛ

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Table 1. Chemical composition of waste printed circuit boards used in the study (wt.%)

Elements Cu Ca Sn Pb Al Fe Ni Mn Zn

Content 22.01 6.7 0.68 0.59 2.71 0.22 0.09 0.06 0.02

ۙͿॠيŚԞͿڏşɠںÀݓČەəۻşۻۙ܃ु

قʂॢĵϔچںۙŕॠČ, ۋìڹۻşۻۙ܃ुۆԐ ڌٍॢںɳ߹֨ࡈԴĀęۺڷͿदۻşۻۙ܃ु(WEEE, Waste Electric and Electronic Equipment)ۋʂ͟ڷͿ

ьԦॠČەɰ(Lee et al., 2007; ١ۦইˣ, 2011). ˰͆

Դʂҙқۆۻşۻۙ܃ुقԺ࠘ʼرەəदۍթধ Ϳşࣺ(WPCBs, Waste Printed Circuit Boards)ۆʂ͟

ьԦʪज़ٍۺۋɰ. ۻցॢцٮÏۋۍթধͿşࣺقə

ÁܛڮڌŚ՚Ӽχ؉ɦ͆ڮ३ܼŚ՚˞ۋ॥ڮʼرە ڷдͿۙڙঝ҃ٮঞą҃঒ࠑϸقԴदۍթধͿşࣺ

ۆ ۺۼॢ ߌνÀ څĵʽɰ.

दۍթধͿşࣺڷͿҙࢢŊŚ՚ںҼ΅ॢڮڌŚ՚ں

ধսॠə ʂशۺۍ Ԝڌė܁ڷͿə ࠪǣɰۆ Noranda ėѪ, ֟ڟʜBolidenԐۆRönnskår ڌʹͿėѪ, Ѳş ق঒҃ࡂۆUmicore ėѪˣۋەڷ϶Ͽ˃ڌڵͿε

ԐڌॠəČ٣߸߻ėѪۋɰ(Sun, 1991; ťѿսˣ, 2003;

Cui and Zhang, 2008; Antrekowitsch et al., 2006; HagelĦken, 2006). ۋ͠ॢČ٣߸߻ėѪڹŚ՚Ձқ˞ۋՃ͆к̚

əࣰ॔͆֟ڷͿֳيەČ঍Ԝۋ҄ۡॢदۍթধͿş

ࣺںʂ͟ߌνॣսەɰəۤ۾ۋەݓχԺҼ࣊ۙҼ ÀφʂॣӼχ؉ɦ͆ŊŚ՚ۆ՜֬ۋьԦॠ϶ێҙ

ڮڌŚ՚ۆ ধսÀ ҝÀɠॠɰə ɳ۾ۋ ەɰ. ˰͆Դ

߯Ŗ˞رՙőϿܓغۋÀɠॠ϶॥ڮʽϿ˜Ś՚ۙ

ڙۆধսÀÀɠॢ֥֩߸߻ėѪقʂॢٍĵÀটь০

ۋΘرݓČ ەɰ.

दۍթধͿşࣺڷͿҙࢢڮڌŚ՚ۆ֥֩ধսقʂॢ

ٍĵəʂҙқܳՁқۍĵνεʂԜڷͿݕॱʼؽڷ϶

ࠞ߻܃Ϳəݗԓ(HNO3),ডԓ(H2SO4), ّԓ(HCl), ؒϿ ɦ؉(NH3)ˣۋԐڌʼؽɰ(Sun, 1991; Mecucci and Scott, 2002; Koyama et al., 2006; Lee et al., 2007; Cui and Zhang, 2008; ؋ۦڍٮԴۦՁ, 2009; Kim et al., 2011;

Jha et al., 2011). दۍթধͿşࣺقܕۦॠəŚ՚Ձқ

˞ڹՃ͆к̚əࣰ॔͆֟ڷͿˆֳ͠يەş˺Лق

মڱۺۍࠞ߻ںڦॠيɳߕқνÀԸॱʼرآॠ϶ۋ εڦॠيйқթॠəąڍÀψɰ(Kumar et al., 2010).

˰͆Դʂҙқۆࠞ߻ٍĵ˞ڹۓۙࡾşÀ1 mm йχ ۍदۍթধͿşࣺۆқթНںʂԜڷͿսॱʼؽɰ. ۓ

ۙࡾşÀۚںս΀Ś՚ՁқęҼŚ՚Ձқۆɳߕқν ÀݒÀʼرࠞ߻মڱۋॳԜʼݓχйқթͿۍॢė܁

Ҽڌۆ Ԝ֧ںߣ͒ॢɰ.

ٍ҆ĵقԴəۓۙࡾşÀ24 mmۍदۍթধͿş

ࣺۆқթНͿҙࢢŚ՚Ձқۆԓࠞ߻قʂॢٍĵε

սॱॠٕɰ. ࠞ߻܃ͿݗԓęডԓںԐڌॠٕڷ϶ডԓ ۆąڍԓজ܃Ϳęԓজսՙ(H2O2)εߐÀॠٕɰ. ࠞ߻

٣ʪٮ֨Â, ԓȬʪ, ԓজ܃ۆߐÀ͟, ġؚȬʪˣۆ

֬ॹѺսÀĵνۆࠞ߻äʴقй࠘əٖॳںܓԐॠٕ

ڷ϶, ؉ڐ͠ĵνۆ߯ۺࠞ߻ܓæقԴǬ, ܳԵ, ؎Θ йɔ, ߏˣęÏڹŚ՚Ձқۆࠞ߻äʴںܓԐٕɰ. ҆

ٍĵقԴսॱʽݗԓęডԓقۆॢŚ՚Ձқۆࠞ߻ä ʴقʂॢҼİٍĵəदۍթধͿşࣺڷͿҙࢢŚ՚Ձ қۆ֥֩߸߻֨ۺۼॢࠞ߻܃ۆԸ܁ںڦॢ޷Čۙ

ΒÀ ʾ ìۋɰ.

֬ॹѓѪ

֬ॹۦΒ

ٍ҆ĵقԴ֬ॹۦΒͿԐڌॢदۍթধͿşࣺ(ۓۙ

ࡾş1050 mm)ڹĶǴۆ(ܳ)ν࠻ڷͿҙࢢėśыؕ

ɰ. Scutter-cutter mill(Hyosung Corporation)ںԐڌॠ يėśыڹ֨Βε24 mmͿқթॢɰڼࠞ߻֬ॹ قԐڌॠٕɰ. ֨ΒۆজॡқԵںڦॠيٶս̚əݗ ԓق ڌ३ॢ ɰڼ ڙۙড়ġқġġʪć(Ͽʝ AAnalyst 400, PerkinElmer Inc.)εۋڌॠيŚ՚ۋ٣ۆȬʪε

ࠑ܁ॠٕɰ. 5Òۆ֨ΒεқԵॠيصرݕथŒÉڷͿ ҙࢢदۍթধͿşࣺۆজॡܓՁںćԓॠيTable 1ق

ǣࢍǴؽڷ϶Ś՚॥͟ڹ33.1 wt.%ۋؽɰ. ҆֬ॹق

Ԑڌॢ Ͽ˜ জॡأुڹ ֨أśۋؽɰ.

ࠞ߻֬ॹ

दۍթধͿşࣺۆ ࠞ߻֬ॹں ڦॠي ڿ߹şÀ ҙ޳

ʽ1 L 3ĵpyrex ъڿܓε२٣ܓقԺ࠘ॠيԐڌॠٕ

ɰ. ࢬ॒΁ࡑࣶʽİъşεъڿܓقԙۓॠيڌؚۆ

İъںॱॠٕɰ. ࠞ߻܃ͿݗԓęডԓںԐڌॠٕڷ϶

ȬʪəÁÁ1.04.0 M, 0.52.0 M ۋؽɰ. ডԓںࠞ

߻܃ͿԐڌॠəąڍ420 vol.% ęԓজսՙսεԓ জ܃ͿߐÀॠٕɰ. ъڿ٣ʪə3090ۋؽڷ϶ъڿ

֨Âڹ10120қԐۋقԴܓۼॠٕɰ. ࠞ߻֬ॹںڦ ॠيϤ۹ȬʪÀܓۼʽԓڌؚ500 mlεъڿܓقۤ

ۓॢˏÀَॠٕɰ. ڌؚۆ٣ʪÀйνԺ܁ʽъڿ٣ ʪقʪɵॠϸێ܁͟ۆ֨Βε࣊ۓॠČİъॠϸԴࠞ

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Leaching time (min)

0 30 60 90 120

Leaching of Cu (%)

0 20 40 60 80 100

Temperature (^oC) 25 60 75 90

Fig. 1. Effect of temperature on leaching of copper from WPCBs by 1.0 M HNO3 solution. (Pulp density, 100 g/L;

agitation speed, 600 rpm)

HNO₃ conc. (M)

0.0 1.0 2.0 3.0 4.0 5.0

Leaching of Cu (%)

0 20 40 60 80 100

Time (min) 30 60 90 120

Fig. 2. Effect of HNO3 concentration on leaching of copper from WPCBs at 90. (Pulp density, 100 g/L;

agitation speed, 600 rpm)

߻֬ॹں սॱॠٕɰ. ডԓں ࠞ߻܃Ϳ Ԑڌॠə ąڍ

Ϥ۹֨Βεъڿܓق࣊ۓॢɰڼԓজ܃ęԓজսՙս εܳۓॠČࠞ߻֬ॹں֨ۚॠٕɰ. ێ܁֨ÂÂüڷͿ

ڌؚ֨Βε޽ࠄ, ৠԵॢɰڼڙۙড়ġқġġʪćεԐ ڌॠيࠞ߻ʽŚ՚ۋ٣˞ۆқԵںॱॠČࠞ߻ڱںć ԓॠٕɰ. ęԓজսՙəęϐÂԓࠥή(KMnO4)εԐڌ ॠəҙक़Ѫ܁͟(volumetric determination)ڷͿқԵॠ

ٕɰ(Kolthoff et al., 1971).

֬ॹĀęфČ޶

दۍթধͿşࣺۆݗԓࠞ߻

ݗԓȬʪ 1.0 M, ġؚȬʪ 100 g/L, İъ՚ʪ 600 rpmۆࠞ߻ܓæقԴࠞ߻٣ʪε2590ͿѺজ֨ࢅ

ϸԴ120қʴ؋दۍթধͿşࣺۆࠞ߻֬ॹںॱॢĀ ęεFig. 1قǣࢍǴؽɰ. ࠞ߻٣ʪÀȭ؉ݗս΀ĵν ۆࠞ߻ڱۋݒÀॠٕɰ. 60قԴ120қÂࠞ߻ॠٕں

˺ĵνۆࠞ߻ڱڹ15% ܁ʪۋؽڷǣࠞ߻٣ʪÀ7 5, 90Ϳȭ؉ݙق˰͆ࠞ߻ڱڹÁÁ45%, 55%Ϳ

ݒÀॠٕɰ.

Fig. 2əݗԓȬʪε1.0 M4.0 MڷͿѺজ֨ࢅϸ Դ 90قԴ दۍթধͿşࣺں ࠞ߻ॠٕں ˺ ĵνۆ

ࠞ߻ڱں ǣࢍǶ ìۋɰ. ġؚȬʪə 100 g/L ۋؽɰ.

ݗԓȬʪÀݒÀ॥ق˰͆ĵνۆࠞ߻ڱۋݔԸۺڷͿ

ݒÀॠٕɰ. 1.0 M ݗԓڌؚںԐڌॠي30қÂदۍթ ধͿşࣺۆ ࠞ߻ں ॱॠٕں ˺ ĵνۆ ࠞ߻ڱڹ أ

20%ۋؽڷǣݗԓȬʪÀ4.0 MڷͿȭ؉ݙق˰͆ĵ νۆࠞ߻ڱڹ80%Ϳśü০ݒÀॠٕɰ. ŔνČ4.0 M ݗԓڌؚںԐڌॠي120қÂࠞ߻ॠٕں˺ʂҙқۆ

ĵνÀࠞ߻ʼؽڷ϶ࠞ߻ڱڹ97%قɵॠٕɰ. दۍթ ধͿşࣺڷͿҙࢢݗԓڌؚقۆॢĵνۆࠞ߻ъڿڹ

ݗԓȬʪق˰͆ɰδъڿşĵεࣀॠيێرǣəìڷ Ϳ؎Ͳ܋ەɰ. ݗԓȬʪÀǰڹąڍٮȭڹąڍۆࠞ

߻ъڿڹÁÁɰڼęÏۋǣࢍǷսەɰ(Demir et al., 2004).

3Cu + 8HNO3 G3Cu(NO3)2 + 2NO + 4H2O (1) Cu + 4HNO3 G Cu(NO3)2 + 2NO2 + 2H2O (2)

दۍթধͿşࣺۆۤۓ͟ں25125 g/LͿѺজ֨ࢅ

ϸԴ4.0 M ݗԓڌؚںԐڌॠي90قԴ120қÂࠞ

߻֬ॹںॱॠٕɰ. Fig. 3ڹĵν, Ǭ, ܳԵ, ؎Θйɔ, ߏۆࠞ߻äʴںǣࢍǶìۋɰ. दۍթধͿşࣺۆġؚ

ȬʪÀ100 g/Lقɵॣ˺ūݓĵνࠞ߻ڱۆÇՙəϔ ڍййॠٕڷǣġؚȬʪÀ100 g/L ۋԜڷͿݒÀ॥

ق˰͆ĵνࠞ߻ڱۋԜɾ০Çՙॠٕɰ. दۍթধͿ şࣺقԴʂҙқ՝ʌۆ०ŚڙՙͿܕۦॠəܳԵęǬ ۆࠞ߻äʴڹɰβóǣࢍǮɰ. ġؚȬʪÀ100 g/L ۋ ॠێ˺Ǭۆࠞ߻ڱڹ9799%εڮݓॠٕڷǣġؚ

ȬʪÀ125 g/LͿȭ؉ݙق˰͆ࠞ߻ڱڹ93%ͿÇՙ ॠٕɰ. ܳԵۆ ࠞ߻ڱڹ 15% ܁ʪͿ ϔڍ ǰؕɰ.

ۋìڹݗԓڌؚقԴڌ३ʽܳԵۋ٣ۋܳԵԓ(H2SnO3)

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Pulp density (g/L)

0 25 50 75 100 125

Leaching of Metals (%)

0 20 40 60 80 100

Cu Pb

Sn Al Fe

Fig. 3. Effect of pulp density on leaching of metals from WPCBs by 4.0 M HNO3 solution at 90. (Leaching time, 120 min; agitation speed, 600 rpm)

H₂SO₄ conc. (M)

0.0 0.5 1.0 1.5 2.0 2.5

Leaching of Cu (%)

0 20 40 60 80

60 120 Time (min)

Fig. 4. Effect of H2SO4 concentration on leaching of copper from WPCBs at 50. (Conc. of H2O2, 4 vol.%; pulp density, 100 g/L; agitation speed, 600 rpm)

ڷͿԵ߻ʼؽş˺Лۋ϶ܳԵԓۆԵ߻ъڿڹъڿ֩

(3)ę Ïۋ ǣࢍǷ ս ەɰ(Mecucci and Scott, 2002;

Al-Suhybani, 1989). ؎Θйɔۆࠞ߻ڱڹɰδŚ՚ڙ ՙ˞قҼॠيԜʂۺڷͿǰؕəʚ, ۋìڹŚ՚фԓ জНۆ঍ࢗͿܕۦॠə؎ΘйɔܼقԴԓজН঍ࢗۆ

؎Θйɔۋ ݗԓق ǦڌՁۋş ˺ЛڷͿ ࣺɳʽɰ.

Sn + 4HNO3 G H2SnO3 + H2O + 4NO2 (3)

दۍթধͿşࣺۆডԓࠞ߻

ĵνε ܳڅՁқڷͿ ॥ڮॠČ ەə दۍթধͿşࣺ

ںডԓڷͿࠞ߻ॠəąڍĵνۆࠞ߻ڱۋϔڍǰɰ

(ۋۦߎˣ, 2006). ˰͆Դٍ҆ĵقԴəডԓقۆॢ

ĵνࠞ߻ڱۆॳԜںڦॠيęԓজսՙεԓজ܃Ϳߐ Àॠٕɰ. ęԓজսՙۆܕۦॠقডԓقۆॢĵνۆ

ࠞ߻ъڿڹɰڼęÏۋǣࢍǷսەɰ(Olubambi, 2006).

H2O2 G G 2H2O + 1/2 O2 (4) H2SO4 + H2O2 G H2SO5 + H2O (5) Cu + H2SO5 G GCuSO4 + H2O (6)

Fig. 4ə4 vol.% ęԓজսՙۆܕۦॠق0.52.0 M ডԓڌؚںԐڌॠي50قԴ120қʴ؋दۍթধͿ şࣺڷͿҙࢢĵνεࠞ߻ॢĀęۋɰ. ġؚȬʪə100 g/L ۋؽڷ϶İъ՚ʪə600 rpm ۋؽɰ. ডԓȬʪÀ

ݒÀ॥ق˰͆ĵνࠞ߻ڱۋԜɾ০ݒÀॠٕɰ. 1.0 M

ডԓڌؚڷͿ 60қÂ ࠞ߻ॠٕں ˺ ĵν ࠞ߻ڱڹ

40% ܁ʪۋؽڷǣ2.0 M ডԓڌؚںࠞ߻܃ͿԐڌॠ

ٕں˺52%ͿॳԜʼؽɰ. ŔνČࠞ߻֨Âں60қق Դ120қڷͿݒÀॠٕں˺ĵνࠞ߻ڱڹأ510%

܁ʪॳԜʼؽɰ. ۋۦߎ(2006)ۆ҃Čقۆॠϸęԓজ սՙεߐÀॠݓ؍Č2.0 M ডԓڌؚںԐڌॠي90

قԴ60қÂदۍթধͿşࣺںࠞ߻ॠٕں˺ĵνࠞ

߻ڱڹ5% йχۋؽɰ. ۋͿҙࢢęԓজսՙÀĵνۆ

ࠞ߻মڱںԜɾ০ॳԜ֨ࢅəԓজ܃ےںঝۍॣսە ؽɰ.

4 vol.% ęԓজսՙۆܕۦॠق0.5 M ডԓڌؚڷͿ

दۍթধͿşࣺۆࠞ߻֨ࠞ߻՚ʪεॳԜ֨ࢅşڦॠ يࠞ߻٣ʪεȭٕɰ. ġؚȬʪə100 g/L, İъ՚ʪə

600 rpm ۋؽɰ. Fig. 5قԴ҃əцٮÏۋࠞ߻ߣşق ə٣ʪÀȭںս΀ĵνۆࠞ߻ڱۋȭؕɰ. 30قԴ

10қÂࠞ߻ॠٕں˺أ6%ۆĵνÀࠞ߻ʼؽڷǣ9 0قԴĵνۆࠞ߻ڱڹ27% ۋؽɰ. ࠞ߻֨Âں30 қڷͿݒÀॠٕں˺, ࠞ߻٣ʪÀȭ؉ݙق˰͆ĵν

ࠞ߻ڱۋݒÀॠɰÀ90قԴə١০Ͳࠞ߻ڱۋÇՙ ॠٕɰ. ŔνČ120қʴ؋ࠞ߻ںॱॠٕں˺50Gۋ ԜقԴĵνۆࠞ߻ڱۋÇՙॠٕɰ. ۋٮÏڹۋڮə

ࠞ߻٣ʪÀȭ؉ݙق˰͆ęԓজսՙۆқ३՚ʪÀݒ ÀॠيӊνՙϿʼČࠞ߻قমęۺڷͿԐڌʼݓЇॠ ş˺Лۋɰ. ۋԜęÏڹ֬ॹĀęεц࢖ڷͿĵνۆ

ࠞ߻՚ʪٮęԓজսՙۆқ३՚ʪεČͲॣ˺߯ۺࠞ

߻٣ʪə 50Ϳࣺɳʽɰ.

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Leaching temperature (^oC)

20 40 60 80 100

Leaching of Cu (%)

0 15 30 45 60 75

10 30 60 120 Time (min)

Fig. 5. Effect of temperature on leaching of copper from WPCBs by 0.5 M H2SO4 solution. (Conc. of H2O2, 4 vol.%; pulp density, 100 g/L; agitation speed, 600 rpm)

H₂O₂ Conc. (vol.%)

0 5 10 15 20 25

Leaching of Cu (%)

0 20 40 60 80 100

Fig. 6. Effect of H2O2 concentration on leaching of copper from WPCBs by 2.0 M H2SO4 solution at 50Gfor 120 min. (pulp density, 100 g/L; agitation speed, 600 rpm)

Pulp density (g/L)

0 25 50 75 100 125

Leaching of metals (%)

0 20 40 60 80

100 Cu

Pb

Sn Al Fe

Fig. 7. Effect of pulp density on leaching of copper from WPCBs by 2.0 M H2SO4 solution at 50G for 120 min.

(Conc. of H2O2, 10 vol.%; agitation speed, 600 rpm)

Fig. 6ڹęԓজսՙۆȬʪε420 vol.%ڷͿѺজ

֨ࢅϸԴ2.0 M ডԓڌؚںԐڌॠيदۍթধͿşࣺڷ Ϳҙࢢĵνεࠞ߻ॢĀęεǣࢍǶìۋɰ. ࠞ߻٣ʪ ə50, ࠞ߻֨Âڹ120қŔνČġؚȬʪə100 g/L ۋؽɰ. ęԓজսՙۆߐÀ͟ۋݒÀॣս΀ĵνࠞ߻ڱ ۋ ݒÀॠٕɰ. ࠞ߻ڌؚ ܼ ęԓজսՙۆ ȬʪÀ 4

vol.%قԴ 12 vol.%Ϳ ݒÀ॥ق ˰͆ ĵν ࠞ߻ڱڹ

59%قԴ77%ͿݒÀॠٕɰ. ŔνČęԓজսՙۆȬʪ À12 vol.% ۋԜڷͿݒÀʼؽں˺ĵνࠞ߻ڱۆݒ À߸Ճə˅জʼؽڷ϶20 vol.% ęԓজսՙۆܕۦॠ ق2.0 M ডԓڌؚںԐڌॠي85%ۆ ĵνεࠞ߻ॣ

ս ەؽɰ.

ęԓজսՙۆ ܕۦ ॠق ġؚȬʪε 25125 g/LͿ

Ѻজ֨ࢅϸԴ 2.0 M ডԓڌؚں Ԑڌॠي 50قԴ

120қÂ दۍթধͿşࣺۆ ࠞ߻֬ॹں ॱॠٕɰ. ęԓ জսՙۆȬʪə10 vol.%ۋؽɰ. Fig. 7قԴ҃əцٮ

ÏۋġؚȬʪÀ50 g/L ۋԜڷͿݒÀ॥ق˰͆ĵν

ࠞ߻ڱڹśü০Çՙॠٕڷ϶ۋìڹĵνࠞ߻ںڦॢ

ԓۋČÄʼؽş˺Лۋɰ. 50 g/LۆġؚȬʪقԴ87%

ۆĵνÀࠞ߻ʼؽڷǣ, ġؚȬʪÀ100 g/LڷͿݒÀ

॥ق˰͆ࠞ߻ڱڹ73%ͿÇՙॠٕɰ. ŔνČߏę؎

Θйɔۆࠞ߻ڱʪܓŚ؂Çՙॠٕɰ. ܳԵۆࠞ߻ڱڹ

أ80% ܁ʪͿԴġؚȬʪۆٖॳںäۆыݓ؍ؕɰ.

ݗԓںࠞ߻܃ͿԐڌॠٕںąڍࠞ߻ʽܳԵۋɰ֨

ܳԵԓࠞۻڷͿԵ߻ʼرࠞ߻ڱۋϔڍǰؕݓχęԓ জսՙۆܕۦॠقডԓںࠞ߻܃ͿԐڌॠəąڍҼ İۺࠞ߻ڱۋȭؕɰ. ՝ʌۆ०ŚڙՙͿܕۦॠəǬ ۆąڍࠞ߻ڱۋ5% ۋॠͿϔڍǰؕڷ϶, ۋìڹࠞ

߻ʽǬۋ٣ۋڌ३ʪÀϔڍǰڹডԓǬ(PbSO4, pKsp

= 7.78)ڷͿ Ե߻ʼؽş ˺Лۋɰ.

ٍ҆ĵقԴࠞ߻܃ͿԐڌॢݗԓڌؚęডԓڌؚق

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ۆॢदۍթধͿşࣺۆࠞ߻֨ܳڅՁқۍĵνۆࠞ߻

χںČͲॣ˺ݗԓڌؚۋʌমڱۺۋؽɰ. ডԓڌؚ

ںࠞ߻܃ͿԐڌॠəąڍęԓজսՙεԓজ܃ͿߐÀ ॠəʚ, ęԓজսՙəࠞ߻٣ʪۆԜ֧ق˰͆қ३՚ʪ Àӊ͆܋Դ՜֬ۋ࠶ݓдͿࠞ߻মڱۆॳԜںڦॢ

٣ʪܓۼق܃ॢۋ˰βóʽɰ. ݌, ęԓজսՙۆқ३ قۆॢ՜֬ںز܃ॠşڦॠي50GۋॠقԴডԓࠞ

߻ںॱॠдͿࠞ߻মڱۆॳԜۋرͷɰ. ॢठԓࠞ߻

قۋڹқν܁܃ė܁قԴĵνۆڌϔ߸߻ںۺڌॠə

ąڍ, ݗԓࠞ߻ؚقܕۦॠəNOxقۆॢĵνۆ߸߻

܃ͿԐڌʼəLIX64, LIX84, LIX860 ˣęÏڹ࢈ͪ

ۋ࣡ ߸߻܃ۆ َজ(degradation)À ێرǣдͿ ڌϔ߸

߻قۆॢĵνۆ܁܃Àڌۋॠݓ؍ɰ(Bart et al., 1990).

˰͆ԴदۍթধͿşࣺۆࠞ߻܃εԸ܁ॣ˺ܳڅŚ՚

Ձқۆࠞ߻ڱӼχ؉ɦ͆ˏۋڹқν܁܃ė܁ںČ Ͳॠي Ը܁ॠيآ ॢɰ.

Ā΁

ٍ҆ĵقԴəݗԓęডԓںࠞ߻܃ͿԐڌॠيदۍ թধͿşࣺқթН(24 mm)ͿҙࢢĵνεҼ΅ॢڮ ڌŚ՚ۆࠞ߻قʂॢҼİٍĵεսॱॠٕɰ. ĵνۆ

ࠞ߻ڱڹݗԓۋȭؕڷǣܳԵۆࠞۻۋьԦॠٕČę ԓজսՙεԓজ܃ͿԐڌॢডԓۆąڍĵνۆࠞ߻ۋ

Àɠॠٕڷǣ ݗԓ҃ɰə ġؚȬʪ, ࠞ߻ڱ Ͽ˃ ǰڹ

սܵۆĀęεǣࢍǴؽɰ. ࠞ߻܃εԸ܁ॣ˺ܳڅŚ

՚Ձқۆࠞ߻ڱӼχ؉ɦ͆ˏۋڹқν܁܃ė܁قۆ

ࠞ߻܃ۆٖॳʪČͲॠيآॢɰ. ٍ҆ĵقԴصرݕ

Āęε څأॠϸ ɰڼę Ïɰ.

1. ݗԓڌؚقۆॢदۍթধͿşࣺڷͿҙࢢĵνࠞ߻

ۆ ߯ۺܓæڹ ݗԓȬʪ 4.0 M, ġؚȬʪ 100 g/L,

ࠞ߻٣ʪ 90, ࠞ߻֨Â 120қۋ϶, ۋ ˺ ĵνۆ

ࠞ߻ڱڹ96% ۋؽɰ. ŔνČǬ, ؎Θйɔ, ߏۆࠞ

߻ڱڹÁÁ97%, 38%, 75% ۋؽڷ϶, ܳԵڹࠞ߻

ʽɰڼܳԵԓ(H2SnO3)ڷͿ Ե߻ʼر߯ܛࠞ߻ڱ ڹأ 1.5%ق ҝęॠٕɰ.

2. ęԓজսՙۆܕۦॠقডԓڌؚںԐڌॠيदۍթ ধͿşࣺڷͿҙࢢĵνεࠞ߻ॠəąڍ, ęԓজսՙ ۆȬʪÀ ݒÀॣս΀ ĵνۆ ࠞ߻ڱۋ ݒÀॠٕɰ.

3. 4 vol.% ęԓজսՙۆܕۦॠق0.5 M ডԓڌؚڷ Ϳ दۍթধͿşࣺ(100g/L)ε 120қ ʴ؋ ࠞ߻ॠٕ

ں˺ࠞ߻٣ʪÀ50GۋԜڷͿȭ؉ݙق˰͆ĵν ۆࠞ߻ۋÇՙॠٕɰ. ۋìڹࠞ߻٣ʪÀȭ؉ݙق

˰͆ęԓজսՙۆқ३՚ʪÀݒÀॠيӊνՙϿʼ

Čࠞ߻ق মęۺڷͿ Ԑڌʼݓ Їॠş ˺Лۋɰ.

4.दۍթধͿşࣺۆġؚȬʪε25125 g/LͿѺজ֨

ࢅϸԴ10 vol.% ęԓজսՙۆܕۦॠق2.0 M ডԓ ڌؚڷͿ50قԴ120қÂࠞ߻ںॱॠٕں˺, 50 g/LۆġؚȬʪقԴ87%ۆĵνÀࠞ߻ʼؽڷǣġ

ؚȬʪÀŔۋԜڷͿݒÀ॥ق˰͆ĵνࠞ߻ڱڹ

śü০ Çՙॠٕɰ.

5.ęԓজսՙۆܕۦॠقডԓڌؚڷͿदۍթধͿş

ࣺںࠞ߻ॠəąڍǬۆࠞ߻ڱڹ5% ۋχۋؽڷ϶

ۋìڹ ࠞ߻ʽ Ǭۋ ডԓڌؚقԴ ডԓǬ(PbSO4)ڷ ͿԵ߻ʼؽş ˺Лۋɰ.

ԐԐ

҆ȦЛڹ2011țʪݓ֩ą܃ҙۆۦڙڷͿॢĶقȃ ݓşցथÀڙ(KETEP)ۆݓڙںы؉սॱॢٍĵę ۦۙڙজşցÒь”ۆսॱڷͿصرݕٍĵĀęۆێ ҙۓɦɰ.

޷ČЛॶ

׌ࣦ৤, ଲ୍వ, ছ਎ෂ, 2003, “૳ଜฅ଀઩ଭ෉ඍPCBs ߦऀഉֱׁুړౠฎ৤,”෉֝஺֜ਏਆഗվ෈ฎ஺^{, 40}

֫ 3෹, pp. 184-190.

ੲ୍૴, ছ୍ন, 2009, “ୢୀਆ೥޾઩ছ֜ࠤࢫசজଭฎ

৤ࠜ଍෉ாॺಅౢࢫಅౢઁ઩ছକࠤாॺ୪Ջ઴

֜,” ୀ଀ࠤਚଲ೨ࠫ^, ୪18֫ ୪5෹, pp. 44-51.

ૈ୍෮, ׌ஜ৤, ࢂজࢢ, ࢢ஺଀, 2011, “෉֝ଭE-waste ࠤ

ਚଲ೨ࠫਏਆഗր ୍ୀ଀ฃॷડ,” ୀ଀ࠤਚଲ೨ࠫ^, ୪

20֫ 5෹, pp. 16-33.

ଲ୍వ݊, 2006, ඍୢ׆ୢୀ׆׆ଭഠ೷ࠤਚଲ೨ࠫ׆

২Թࢳ, 2C-A-1-1, ୀ଀୍ฆ૳׆২Թࢳॷડౖஂ࣪ճছ,

෉֝஺ாୀ଀઴֜଀, p. 143.

Al-Suhybani, A.A., 1989, “Effect of some inorganic anions on corrosion of tin in nitric acid,” British Corrosion, Vol.

24, pp. 204-210.

Antrekowitsch, H., Potesser, M., Spruzina, W. and Prior, F., 2006, “Metallurgical recycling of electronic scrap,”

Proceedings of EPD Congress 2006, TMS, San Antonio, Texas, USA, March 12-16, pp. 899-908.

Bart, H.J., Marr, R., Bauer, A., Schein, R., and Marageter, E., 1990, “Copper extraction in nitrate media,” Hydrometallurgy, Vol. 23, No. 2-3, pp. 281-295.

Brodersen, K., Tartler, D., Bergmann, H.W., Werner, G.D.

and Eder, S., 1992, “Scrap of electronics, Hazardous waste or raw material resources?,” Proc. of the 1992 Conf. on

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the Recycling of Metals, the ASM European Office, the European Council of ASM Intern. and its Technical Committee, Düsseldorf/Neuss - Germany, 13-15 May, pp.

45-51.

Cui, J. and Zhang, L., 2008, “Metallurgical recovery of metals from electronic waste: A review,” J. Hazard. Mater., Vol. 158, No. 2-3, pp. 228-256.

Demir, H. ÖOzmetin C., Kocakerim, M.M., Yapıcı, S. and Çpur M., 2004, “Determination of a semi empirical kinetic model for dissolution of metallic copper particles in HNO3 solutions,” Chemical Engineering and Processing, Vol. 43, pp. 1095-1100.

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218-223.

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׌ࢢজ

1991țٍՃʂॡİŚ՚ėॡęėॡԐ 1993țٍՃʂॡİŚ՚ėॡęėॡԵԐ 1998țٍՃʂॡİŚ՚ėॡęėॡчԐ

ইۦ ॢĶݓݗۙڙٍĵڙ ġНۙڙٍĵ҆ҙ ޾ےٍĵڙ (E-mail; [email protected])

ଲ୍వ

ইۦ ॢĶݓݗۙڙٍĵڙ ġНۙڙٍĵ҆ҙ ޾ےٍĵڙ (欧G 彳櫾躇G 缧49嘳G 缧1埲G 垾畢)

׌৤լ

1997țۍॠʂॡİŚ՚ėॡęėॡԐ

1999țۍॠʂॡİŚ՚ėॡęėॡԵԐ

2004țԴڐʂॡİۦΒėॡҙėॡчԐ

ইۦ ॢĶݓݗۙڙٍĵڙ ġНۙڙٍĵ҆ҙ Ըےٍĵڙ (E-mail; [email protected])

୨஼׆

ইۦ ॢĶݓݗۙڙٍĵڙ ġНۙڙٍĵ҆ҙ ޾ےٍĵڙ (欧G 彳櫾躇G 缧49嘳G 缧1埲G 垾畢)

׌ࣦ৤

1989țۻҚʂॡİŚ՚ėॡęėॡԐ

1993țۻҚʂॡİŚ՚ėॡęėॡԵԐ

1999țڮࢍʂॡİŚ՚ėॡęėॡчԐ

ইۦ ॢĶݓݗۙڙٍĵڙ ġНۙڙٍĵ҆ҙ ޾ےٍĵڙ

(ʪ֨ġԓٍĵࣳۤ) (E-mail; [email protected])