Emission enhancement behaviors in the coupling
between surface plasmon polaritons and light emitters
작성 : 한양대학교 물리학과 최기영
CONTENTS
• Concept of SP-LED
• History
• Theoretical calculations
• PL enhancement of BLUE GaN SP-LED
• PL, EL enhancement of GREEN GaN SP-LED
• Summary
A Better Light Emitting Diode
Display
Free-Space
Optical Communication
Brighter
General Lighting
Brighter, More Directional
Brighter, More Directional, Faster
rate ion recombinat ve
nonradiati :
efficiency extraction
:
rate emission s
spontaneou 1 :
nr extrac
nr extrac
extrac ext
Γ
= Γ
Γ + Γ
= Γ
η τ η η η
) % /
( 4
2
1
2
≈
=
g f
extrac
n
η n
• Geometric optics
• Random scattering in surface textured structure
APL 63, 2174 (1993)
CONCEPT
2 0
1 1
( ) 2 ( )
R f i ρ ω
τ ω ε
= = p E ⋅
SE Rate : =
Dipole moment
of the radiating source Electric field strength
of half photon (vacuum fluctuation)
Photon DOS
(Density of States) Surface Plasmons Field enhancement
Directional extraction
p int
p nr
R R R η =
+
'
int p spp sp nr
R
R R
R η = R +
+ +
HISTORY
We have shown for the first time that
strongly directional emission … by SP excited
on a periodically structured surface.
HISTORY
An SPP energy gap can block this decay channel and significantly inhibit the emission from the sample.
HISTORY
HISTORY
… spontaneous emission into surface plasmon is ~ 55 times faster … We have carefully calibrated the internal quantum efficiency of this InGaN SQW and we find it to be > 90%.
ONLY
There are Photo-luminescences.
From 1999 to 2008
Can it work?
HISTORY
HISTORY
2.68 10 1.75 300
p
at K
F at K
= ⎜ ⎛
⎝
… the enhanced Fp…
can be attributed
to an increase in the spontaneous emission rate due to SP-QW coupling.No improvement I-V curve
Improvement
I-L curve
-. Gain condition
-. FDTD 계산을 통해 반사형 금속 격자 구조 결정 -. Green GaN SP-LED 의 PL, EL 측정
-. Blue GaN SP-LED 의 PL 측정
Theoretical calculations
Purcell Factor:
2 0
0
0
/ ( )
( ) / 1
/ '
SP SP
p SP p
SP SP
k k a
F R R R
V c k U ε
= + = + E
2
0
1 1
( ) 2 ( )
R f i ρ ω
τ ω ε
= = p E ⋅
Spontaneous Emission Rate : =
Green
Purcell’s factor on flat metal surface
Extraction efficiency condition
( )
int 0 int
0 int
0 0
int int
0 int
1
1 1 1
1
1 1
r sp
sp
r nr sp r nr r sp r sp
sp
r r nr sp r p r
r nr
r sp sp
r nr r nr sp
p r p p r nr
r nr
r nr sp
p r nr
k C k
k k k k k k C k k C k
k k k k k F k
k k
k C k C k
k k k k C k
F k F F k k
k k
k k k k
C
F k k
ξ η η
η
η η
η + ⋅
+ + + + ⋅ + ⋅
= = = ⋅ = ⋅
+ +
+
+ ⋅ ⋅
+ ⎡ ⎤
+ +
= ⋅ = ⋅ = ⋅ +⎢⎣ ⋅ + ⎥⎦
+
+ +
= ⋅ + ⋅ −
+
( )
0 int
1 1 1
r nr
r nr
p p
k k k
C F
F η
⎡ ⎛ + ⎞⎤
⎢ ⎜ + ⎟⎥
⎢ ⎝ ⎠⎥
⎣ ⎦
⎡ ⎤
= ⋅ +⎢ ⋅ − ⎥
⎣ ⎦
0
1 int
sp when C
ξ η
∴ ≥ ≥
0 int
r
r nr
k k k η =
+
int
r sp
sp
r nr sp
k C k
k k k
η = + ⋅ + +
r nr sp
p
r nr
k k k
F k k
+ +
= +
Original IQE :
Modified IQE by SP :
Purcell’s factor :
Extraction efficiency of SP : C
Enhancement factor of IQE : int0
int SP sp
ξ η
=η
2nd order coupling (Λ=103nm), T=0.02%, R=0.07%, A=99.91%
n-GaN
p-GaN (20nm) Ag (20nm) PR
(100nm, n=1.6)
Λ
4th order coupling (Λ=206nm), T=0.03%, R=0.09%, A=99.88%
Case 1
2nd order coupling (Λ=103nm), T=2.06%, R=1.18%, A=96.76%
n-GaN
p-GaN (20nm) Ag (20nm) Λ
4th order coupling (Λ=206nm), T=0.06%, R=0.54%, A=98.86%
Case 2
2nd order coupling (Λ=103nm), T=8.91%, R=2.74%, A=88.35%
n-GaN p-GaN
(20nm, 120nm) Ag (20nm)
4th order coupling (Λ=206nm), T=6.84%, R=2.89%, A=90.27%
Case 3
Λ
0 40 80 120 160 200 240 0
5 10 15 20 25
Λ=λSP Λ=2λSP Λ=3λ Λ=4λSPSP
R e fl ectan ce [ A .U ]
grating depth [nm]
Λ
SP 1storder 2ndorder 3rdorder 4th order 1차 회절광이 수직으
로 방출된다.
2차 회절광이 수직으 로 방출된다.
Λ=λ
SP=6 λ
0Λ=2λ
SPΛ=4λ
SPkx ky
GaN circle Air circle
3차와 2차 회절광이 GaN로 방출되고 3차 회절광 만이 공 기 중으로 방출된다.
Λ=3λ
SPFourier Trans. Fourier Trans.
4차와 3차 회절광이 GaN로 방출되고 4차 회절광 만이 공 기 중으로 방출된다.
0 10 20 30 40 50 0.0
0.2 0.4 0.6 0.8 1.0
Fraction
Distance [nm]
A
B
C D
A : Lossy surface wave mode B : Surface plasmon mode C : Direct radiation mode D : Balance
h = 20 nm 에서의 비율은, A : 25.1 %
B : 55.9 % C : 19 %
silver GaN
Λ d
Q.W h
0 0
(a) (b)
400
1000
Wav e le ngth [ n m]
Angle (degree) Purcell’s factor
700 500 600
800 900
5 10 15
0.0 1.0
0.5
20 40 60
silver GaN
Λ d
Q.W h
silver GaN
Λ d
Q.W h
0 0
(a) (b)
400
1000
Wav e le ngth [ n m]
Angle (degree) Purcell’s factor
700 500 600
800 900
5 10 15
0.0 1.0
0.5
20
20 4040 6060
100 200 300 400 500 600 100
200 300 400 500 600
1.5 2 2.5 3
200 400 600 800 1000 1200
200 400 600 800 1000 1200
3 3.5 4 4.5 5 5.5 6 6.5 7 7.5
10 20 30 40 50 60 110
120 130 140 150 160
10 20 30 40 50 60 110
120 130 140 150 160
Grating depth [nm]
Grating period [nm ]
Grating depth [nm]
Gra ting per iod [nm]
7.5
3.0 1.5
3.0
100 200 300 400 500 600
100 200 300 400 500 600
1.5 2 2.5 3
100 200 300 400 500 600
100 200 300 400 500 600
1.5 2 2.5 3
200 400 600 800 1000 1200
200 400 600 800 1000 1200
3 3.5 4 4.5 5 5.5 6 6.5 7 7.5
200 400 600 800 1000 1200
200 400 600 800 1000 1200
3 3.5 4 4.5 5 5.5 6 6.5 7 7.5
10 20 30 40 50 60 110
120 130 140 150 160
10 20 30 40 50 60 110
120 130 140 150 160
Grating depth [nm]
Grating period [nm ]
Grating depth [nm]
Gra ting per iod [nm]
7.5
3.0 1.5
3.0
(a) (b)
0 int
0 0
int
1 1 1
sp
int sp
int p
C
F
η η
ξ η η
⎛ ⎞
= ≈ + − ⎜ ⎜ ⎝ − ⎟ ⎟ ⎠
0
int sp 1
C η for ξ
∴ ≥ ≥
에서, 의 조건이 성립한다.
추출효율이 Green GaN LED 의 original IQE(~20%로 가정) 보다 크므로 SP gain 은 1보다 크다.
Purcelll’s factor SP gain
Refractive indices :
GaN = 2.44, Al2O3=1.77157, Silicon encapsulant = 1.5 Al2O3로 방출되기 위한 GaN 내에서의 내부 방사각도 = 46.5°
Encapsulant 로 방출되기 위한 GaN 내에서의 내부 방사각도 = 37.9 ° (*Encapsulant 는 형태가 다양할 수 있어 계산하지 않음.)
GaN Al2O3 Encap.
Angular distribution
SP gain 에 의한 IQE 증가와 extraction efficiency 를 고려해서 External efficiency 를 계산.
(Encap. 까지 도달한 빛은 모두 추출된다고 가정) A : total external efficiency
B : collimated radiation 되는 비율 (GaN 에서 9° / Encap. 내에서는 14.7° )
Dashed line : bare chip 상태의 conventional green GaN LED 의 external efficiency.(4.2%)
(original IQE : 20 % / randomly free dipole 에서 radiation 된 빛의 encap. 까지의 추출효율 : 21 %)
A B
120 130 140 150 160
0 10 20 30 40 50 60 70
Efficiency [%]
Grating period [nm]
External quantum efficiency
GREEN SP-LED EXPERIMENTS
400 500 600 700 800 0.0
0.2 0.4 0.6 0.8 1.0
Photons escaped
Wavelength (nm) 34.1% within 20o
after escape 81.9%
13.9%
1/(2n2) = 7.7%
Why Green?
OPTICS EXPRESS 16, 1269 (2008) JKPS 53, 1715 (2008)
± 10
D± 90
DWhy Green?
SP propagation length
450 500 550 600 650 700 750 800 0
500 1000 1500 2000 2500 3000 3500 4000
Propagation Length of SPs [nm]
Wavelength of Photon [nm]
Surface Plasmon on the Ag/GaN Interface PLSPs k
= ′′
2 1
2 2
3
) ( 2
mm d
m d m
k c
ε ε ε
ε ε ε ω
′
⎟⎟ ′′
⎠
⎜⎜ ⎞
⎝
⎛
′ +
= ′
′′
0.0 0.5 1.0 1.5 2.0 2.5
0 2 4 6 8 10 12 14
In-plane Wavevector (2π /μm)
Frequency (2πc/μm)
460nm
530nm
SP-dispersion on Ag/GaN
λsp~70 nm λsp~140 nm
2
ndorder gratings (
Λ~280nm)might be readily fabricated by Holo litho at Green.
Λ = λsp, 2λsp, 3λsp, …
Nanopatterning
Green LEDs might be possible.
Schematic structure
Metal (Ag-based) p-GaN
n-GaN
Silicon submount
Photon
Sapphire
c Exciton generation
d Surface plasmon excitation e Radiation
InGaN MQW
e-h
D
Λ
h D
Λ
h
Purcell’s factor calculation by FDTD
bulk
spon cavity
p cavity
spon bulk
F P
P τ
= τ =
Y. Xu et al., J. Opt. Soc. Am. B 16, 465 (1999) 30nm
80nm 30nm 80nm radiation flux detecting plane
bulk
τ
spon cavityτ
spon cavityP
P
bulk: spontaneous emission lifetime in bulk material : spontaneous emission lifetime in microcavity
: radiation power for a dipole in a microcavity
: radiation power for a dipole in a bulk dielectric material
F
p : Purcell’s enhancement factorFDTD calculation results
100 200 300 400 500
1.0 1.5 2.0 2.5 3.0 3.5
Purcell's factor
Diameter [nm]
▶ 주기:250nm, 높이:50nm, 지름:170nm인 원기둥 격자 Z방향 수평다이폴 30nm거리
▶ 높이:50nm, 지름:170nm인 단일 원기둥
FluxTop FluxBot FluxX FluxY Sum N_Lifetime Nine pillars 1.968 -1.422 0.006 0.010 3.405 0.336
One pillar 2.107 -1.344 0.008 0.021 3.480 0.329
Etched GaN – Ag 2D grating Etched GaN – Ag
2D grating
Holographic Litho or NIL
P-GaN dry etch damage recovery
Holographic Litho or NIL
P-GaN dry etch damage recovery
GaN – SiO
2/Ag 2D grating GaN – SiO
2/Ag
2D grating
Holographic Litho
Posi & double exposure
Dry & wet hybrid etch
Holographic Litho
Posi & double exposure
Dry & wet hybrid etch
GaN – SiO
2/Ag 1D grating GaN – SiO
2/Ag
1D grating
Direct e-beam writing
Dry & wet hybrid etch
Direct e-beam writing
Dry & wet hybrid etch
GaN – ITO/Ag 2D grating GaN – ITO/Ag
2D grating
Holographic litho (image reversal & double
exposure)
ITO Lift-Off
Holographic litho (image reversal & double
exposure)
ITO Lift-Off
GaN Ag GaN
Ag SiO2
GaN Ag SiO2
GaN Ag ITO
1차 샘플
1차 샘플 2차 샘플2차 샘플 최종 목표
최종 목표
<OR>
E-beam litho on SiO2/GaN
LED fab as in normal 1mm FC Dry & wet
hybrid etch of SiO2
I-V-L measurement on wafer probe station
장점: 최단시간소요, P-GaN 손상無 단점: 공정비용高, 면적小, 전극저항高
단면도 평면도
Surface Plasmon LED 제작 공정
Wafer
SP 0001 SP 0002 SP 0003 SP 0004
CD-SEM 으로 grating 확인 함 SiO2 dry etch + wet etch
~130nm
SP 0004
CD-SEM 으로는 grating 확인 못함 SiO2 wet etch
~130nm
SP 0003
CD-SEM 으로 grating 확인 함 SiO2 dry etch + wet etch
~40nm
SP 0002
CD-SEM 으로는 grating 확인 못함 SiO2 wet etch
~40nm
SP 0001
비고 grating 형성방법
p-GaN 두께 wafer Lot
Wet etch로 SiO2 grating을 형성한 것은 최종적으로 grating이 남아있지 않아서 reference와 유사한 특성을 보임
Surface Plasmon LED EL 특성
0.00E +00 2.00E -04 4.00E -04 6.00E -04 8.00E -04 1.00E -03 1.20E -03 1.40E -03
0.00E +00 2.00E -02 4.00E -02 6.00E -02 8.00E -02 1.00E -01 I (A )
L(W)
40n m p-GaN Re f 40n m p-GaN Gr ati n g
0.00E +00 5.00E -04 1.00E -03 1.50E -03 2.00E -03 2.50E -03
0.00E +00 2.00E -02 4.00E -02 6.00E -02 8.00E -02 1.00E -01 I( A)
L(W)
130n m p-GaN Re f 130n m p-GaN Gr ati n g
GaN Ag SiO2
GaN Ag
GaN Ag
GaN Ag
27% UP
유의차 없음
vs. vs.
40nm p-GaN
40nm p-GaN 130nm p-GaN
130nm p-GaN
SP Coupling 有 SP Coupling 無
TEM & SEM images of EPI layer
50nm
250 80
30
nm h nm d nm Λ =
=
=
Reference wafer 의 spectral map
• p-layer를 얇게 제작했을 때 정상적으로 녹색 파장이 방출되는지를 확인하기 위해 spectral map 을 측정
PL enhancement, I-L curve, I-V curve
480 490 500 510 520 530 540
PL intensity [arb. unit]
Wavelength [nm]
Reference SP-LED
480 490 500 510 520 530 540
0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5
PL enhancement [I spled/I ref]
Wavelength [nm]
(a)
(b)
0.00 0.02 0.04 0.06 0.08 0.10 1
2 3 4 5
Forward current [A]
Luminous flux [lm]
Reference SP-LED
0.001 0.02 0.04 0.06 0.08 0.10 2
3 4 5
V f [V]
Forward current [A]
Reference SP-LED
~1.15
Decay rate
17 K 300 K ref. 0.12 ns-1 0.29 ns-1 SP-LED 0.16 ns-1 0.31 ns-1
Purcell’s enhancement factor
1.33 (17 K) 1.07 (300 K)
0 20 40 60 80 100
0.01 0.1 1 10
PL intensity [arb. units]
Time (ns)
reference SP-LED
17 K
300 K
저온-상온 TRPL 결과 비교
nr
r sp
p
r nr
k k
F k k
+ k +
= +
“
저온에서는 non-radiative recombination 이 감소하므로 저온에서의 Purcell’s factor 값이 더 큰 것은 표면 플라즈몬 모드로의 결합이 영향을 미치고 있다고 생각할 수 있다.”Advanced Materials 20, 1253 (2008)
Wall-plug efficiency
, ,
,
(
power spled power ref)
power
power ref
η η
η η
Δ = − η
power spled,, power ref
η
: wall-plug efficiency of SP-LED : wall-plug efficiency of ref.
0.00 0.02 0.04 0.06 0.08 0.10
0 1 2 3 4 5
W a ll-plug effi ciency [%]
Forward current density [A/mm
2]
Reference SP-LED #1 SP-LED #2 SP-LED #3
0.00 0.02 0.04 0.06 0.08 0.10
0.400 0.425 0.450 0.475 0.500 0.525 0.550 0.575 0.600
Δη
powerForward current density
Sample image
BLUE SP-LED EXPERIMENTS
p-GaN
40 nm 30 nm
20 nm 10 nm
n-GaN
90° 10° 0°
TRPL result
w=10nm w=20nm
w=30nm w=40nm
400nm 500nm
0ns
100ns
400 420 440 460 480 500 0.04
0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20 0.22
0.24 10nm
20nm 30nm 40nm un-coated
decay rate (1/ns)
wavelength (nm)
400 420 440 460 480 500
0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2
2.4 10nm
20nm 30nm 40nm un-coated
F p
wavelength (nm)
(a) (b)
400 420 440 460 480 500
0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20 0.22
0.24 10nm
20nm 30nm 40nm un-coated
decay rate (1/ns)
wavelength (nm)
400 420 440 460 480 500
0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2
2.4 10nm
20nm 30nm 40nm un-coated
F p
wavelength (nm)
(a) (b)
Purcell’s enhancement factor
Sample images
-EL 관측 :
p-GaN층의 두께가 20nm, 40nm인 LED구조에 대하여 모두 current 주입에 의한 광의 발생이 확인 됨.