Introduction to
Ch t 1 I t d ti
Materials Science and Engineering
Chapter 1. Introduction
¾ Materials are engineered structures
¾ Materials are ... engineered structures.
¾ Structure ... has many dimensions ...
Structure features Dimension (cm)
Atomic bonding < 10
-8cm
Atomic bonding < 10
-8cm
Missing/extra atoms 10
-8cm
Crystals (ordered atoms) 10
-6- 10
1cm Second-phase particles 10
-6- 10
-2cm
1
p p 10 10 cm
Crystal texturing > 10
-4cm
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지난 25년 동안 세상을
바꾼 신기술 25가지
러멜슨-MIT 프로그램
의료 및 의약 분야 기술 제외
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지난 25년 동안 세상을 바꾼 신기술 25가지
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미국공학한림원
(National Academy of Engineering)
www beengineers com
www.beengineers.com
20세기를 바꾼 20번의 기술 혁명 20세기를 바꾼 20번의 기술 혁명
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Why do we need to study y y
Materials Science & Engineering ?
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- 2009/09/02
Why do we need to study MSE? y y
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Engineering Engineering
in Sports !
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N !!
Note !!
Not Maria Not Maria, But Racket.
(우리끼리 이야기)
Moment of Impactp
If the racket is weak or if its head is small,
Maria cannot win alone.
d k d d
…
A good racket is needed.
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Maria Sharapova
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Tennis Racket
Stronger andg M
lower density
material Bigger head More
Comfortable play
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today
1700’s 1970’s
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Optical Fiber
10 125 μm http://bp.snu.ac.kr
Combination of Materials
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Courtesy of Intel
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Combination of Materials
Polymer + Metal + Ceramics
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Detailed View of Transistor
ADF image EDS mapping
M t l C i
세라믹 Metal + Ceramic
Silicon Oxygen
Titanium Nitrogen
다결정 실리콘
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Titanium Nitrogen
단결정 실리콘
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Macroscopic and Microscopic
¾ Top-down approach
Ö Ö
Ö Ö
¾ B tt h
Integrated Circuit Transistor
Vacuum tube
¾ Bottom-up approach
Ö
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나노로봇
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Moore’s Law
“The number of transistors incorporated i hi
in a chip
will approximately double every 24 months”
10 mm
Pentium, 0.8 μm 선폭
Pentium, 0.5 μm 선폭 , μ 선폭
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Pentium II, 0.25 μm 선폭
Courtesy of Intel
http://bp.snu.ac.krCombination of Materials
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고강도 구조용 재료
세계 어딘가에…
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세계에서 제일 높은 빌딩 (452 m) 타이페이금융센터
– 타이페이금융센터
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세계에서 제일 긴 다리
둥하이 대교 35.2 km
http://bp.snu.ac.kr파괴 (Fracture) 파괴 (Fracture)
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반복 응력에 의한 파괴 (F ti u ) 반복 응력에 의한 파괴 (Fatigue)
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Improvement: Lighter and Stronger
Linear polymer : Microwaveable food containers, Dacron carpets and Kevlar ropes
ropes
Branched polymers : flexible shampoo bottles and milk jugs
Cross-linked polymers : Car tires and bowling balls
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Space Shuttle
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Space Shuttle
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1000°C
500°C 1000 C 1500°C
500 C 1500 C
- NASA selected four basic materials for the original design used on Columbia, the first
operational orbiter. Each was designed to insulate the orbiter's aluminum and/or graphite epoxy skin against a wide range of extreme temperatures, including a low of minus 250 degrees F.
- The basic materials were Reinforced Carbon-Carbon, Low- and High-Temperature Reusable Surface Insulation tiles, and Felt Reusable Surface Insulation blankets.
- Subsequent design improvements included use of advanced materials in certain areas. These materials are Flexible Insulation Blankets and Fibrous Refractory Composite Insulation. There are approximately 24,300 tiles and 2,300 Flexible Insulation Blankets on the outside of each
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orbiter.
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Space Shuttle
The high temperatures that were to be encountered by the Space Shuttle were simulated in the wind tunnels at Langley in the 1975 Shuttle were simulated in the wind tunnels at Langley in the 1975 test. These thermal-insulation materials were used on the Space Shuttle Orbiter in 1982.
from NASA
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from NASA
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Military Materials
- Money is not an object.
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Biomaterials
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Biomaterials – Hip Implant
¾ With age or certain illnesses, some
d l l
joints deteriorate. Particularly
those with large loads (such as hip).
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Biomaterials – Hip Implant
¾ Requirements
9 Mechanical strength (many cycles)
9 Good lubricity 9 Good lubricity 9 Biocompatibility
Ball
¾ Key problems to overcome
9 Fixation agent to hold the acetabular cup
9 Cup lubrication material
l f
Acetabular Cup and Liner
9 Femoral stem – fixing agent (“glue”)
9 Must avoid any debris in cup
Femoral Stem
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Must avoid any debris in cup
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Example – Hip Implant
¾ Requirements
9 h l h
9 mechanical strength (many cycles)
9 d l b
9 good lubricity 9 biocompatibility
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Adapted from Fig. 22.24, Callister 7e.
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Improvement: Copying from the Nature p py g
Crystal
Planes Calcite (CaCO 3 )
Crystal planes
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Materials Science & Engineering
¾ Relation between the STRUCTURE, PROPERTIES & PROCESSING
SYNTHESIS SYNTHESIS (PROCESSING)
NANOSTRUCTURES
PROPERTIES
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PROPERTIES
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MSE
¾ Relations among the
N t t P ti P i & P f
Nanostructures, Properties, Processing, & Performance
PROCESSING
NANOSTRUCTURES PROPERTIES
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PERFORMANCE
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Materials Science and Engineering
Processing Nanostructures 9 9 Sintering Heat treatment
9 Thin Film 9 Thin Film
9 Melt process 9 Mechanical 9 Subatomic
9 Crystal
9 Microstructure 9 Macrostructure
9 Electrical
Properties
9 Magnetic 9 Thermal 9 Optical
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Optical
9 Mechanical
Performance
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Materials Science, Materials Engineering
¾ M t i ls S i n
, g g
¾ Materials Science
9 Investigating the relationships that exist between the nanostructures and properties of materials.
¾ Materials Engineering
9 D i i i i th t t f t i l t 9 Designing or engineering the structure of a material to
produce a predetermined set of properties.
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¾ Structure
¾ Structure
9 Subatomic structures
Involves electrons within the individual atoms and interactions with their nuclei.
9 Crystal structures
Organization of atoms or molecules relative to one another.
9 Nanostructures
9 Macrostructures
¾ Properties
9 A materials trait in terms of the kind and magnitude of response
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9 A materials trait in terms of the kind and magnitude of response to a specific imposed stimulus ( E , H , hν , stress, etc.).
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Inside Materials…
Atomic Structure
Product
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Microstructure
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Key Concern…
Solids are constituted with an ordered arrangement of atoms.
What if the order breaks down... Æ Defects
STM on Si
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dislocations
Grain boundaries in bubble raft model
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Al 2 O 3 (Alumina) (Alumina) Transparent p Single crystal
Translucent Opaque
Small polycrystalline
¾ Different processing Æ different structure Æ different property
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¾ Different processing Æ different structure Æ different property Æ different performance
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OPTICAL
• Transmittance:
--Aluminum oxide may be transparent, translucent, or y p , , opaque depending on the material structure.
single crystal
polycrystal: low porosity (Translucent)
polycrystal: high porosity (Opaque)
Adapted from Fig. 1.2, Callister 7e.
single crystal (Translucent) (Opaque)
(Specimen preparation, P.A. Lessing; photo by S.
Tanner.)
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Atomic Structure
n
-typep
-type41 http://bp.snu.ac.kr
- 2009/09/07
Crystal Structure
Diamond Graphite
(Carbon; BN)
10 Hardness 2
/
3
D /3
3.5 g/cm3
Density 2.2 g/cm3
1.54 Å Bond length 3.4/1.48 Å(111) Cleavage (001)
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(111) Cleavage (001)
cubic Crystal structure hexagonal
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Structure – Processing - Properties
¾ Properties depend on the structures.
9 Hardness vs. structure of steel
600
(d)
)
400 500
(b)
(c) 30μm
(BHN )
300
400 (a) (b)
4μm
rdness
100
200 30μm 30μm
Ha r
¾ Processing can change the structures
100 0.01 0.1 1 10 100 1000
Cooling rate (C/s)43
¾ Processing can change the structures 9 Structure vs. cooling rate of steel
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Electrical Properties
• Electrical Resistivity of Copper:
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Adapted from Fig. 18.8, Callister 7e.(Fig. 18.8 adapted from: J.O. Linde, Ann Physik 5, 219 (1932); and C.A. Wert and R.M. Thomson, Ph i f S lid 2 d diti
5 6
ρ
Physics of Solids, 2nd edition,McGraw-Hill Company, New York, 1970.)
3 4
s tivity , ρ O hm-m)
2 3
Resi s (10
-8O
T (°C)
-200 -100 0
1 0
• Adding “impurity” atoms to Cu increases resistivity.
Deforming
C increasesresisti it
T ( C)
200 100 0
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• Deforming Cu increases resistivity.
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THERMAL
S Sh ttl Til
Th l C d ti it
• Space Shuttle Tiles:
--Silica fiber insulation
offers low heat conduction.
• Thermal Conductivity of Copper:
--It decreases when It decreases when you add zinc!
y 400
Adapted from chapter- opening photograph, Chapter 19, Callister 7e.
(C t f L kh d
n ductivit y m -K)
400 300
(Courtesy of Lockheed Missiles and Space Company, Inc.)
e rmal Co n (W/
m 200 100
f f C
Composition (wt% Zinc)
Th e
0 0 10 20 30 40
Adapted from
Fig. 19.4W, Callister 6e. (Courtesy of Lockheed Aerospace Ceramics Systems,
Adapted from Fig. 19.4, Callister 7e.
(Fig. 19.4 is adapted from Metals Handbook:
Properties and Selection: Nonferrous alloys and Pure Metals, Vol. 2, 9th ed., H. Baker,
(Managing Editor), American Society for Metals,
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y ,
Sunnyvale, CA)
(Note: "W" denotes fig.
is on CD-ROM.)
( g g ), y ,
1979, p. 315.)
100 μm
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MAGNETIC Properties
¾ Magnetic Storage:
9 Recording medium is ecord ng med um s tion Fe+3%Si
magnetized by recording head
e tiza t
Fe
agn e
¾ M ti P bilit
Magnetic Field
M
¾ Magnetic Permeability vs.
Composition:
9 Adding 3 at. % Si makes
Fe a better recording medium!
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DETERIORATIVE
¾ H T
¾ Stress & Salt water...
9 causes cracks!
¾ Heat Treatment
9 Slows crack speed in salt water!
9 causes cracks!
“held at
“as-is”
10
-8160ºC for 1 hr before testing”
ed (m/s) 10
-10 Alloy 7178 tested inincreasing load
c rack spe
saturated aqueous NaCl solution at 23ºC
c
Material:
7150-T651 Al "alloy"
(Zn-Cu-Mg-Zr)
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( g )
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Materials Classification
¾ Metal, ceramics, polymer, composite p y p
¾ Structure
9 Single crystal
¾ Chemical
9 Organic
¾ Properties
9 Electronic Single crystal 9 Polycrystal Organic
9 Inorganic
Electronic 9 Optical
9 Crystallinity 9 Amorphous 9 Magnetic
9 Structural Structural Amorphous 9 Biomaterials
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CLASSIFICATION OF MATERIALS
Three basic groups:
metals ceramics polymers
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¾ Metal Materials Classification
¾ Metal
9 Free electrons 9 Strong, ductile
9 Good conductors of electricity & heat 9 Opaque, reflective
¾ Ceramic
9 Ionic/covalent bonding – compounds of metallic & non- metallic elements (oxides, carbides, nitrides, sulfides)
m m ( , , , f )
9 Brittle
9 Not good conductor of electricity & heat
¾ Polymer
9 Covalent bonding Æ sharing of electrons
9 Soft (flexible) ductile low strength low density 9 Soft (flexible), ductile, low strength, low density 9 Thermal & electrical insulators
9 Optically translucent or transparent
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9 Organic compounds (plastic, rubber, etc.)
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Materials 소재 Materials 소재
¾ What is materials science?
¾ Why should we know about it?
¾ Materials drive our society:
¾ Materials drive our society:
9 Stone Age 9 Bronze Age g 9 Iron Age 9 Now
Silicon Age
Silicon Age
Polymer Age?
Carbon Age?
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Materials Classification
화학적 분류: 유기재료 (organic)
무기재료(inorganic): 금속, 세라믹 재질적 분류: 금속재료(metal)
세라믹재료(ceramics) 고분자재료(polymer) 복합재료(composite) 용도별 분류: 전자재료(electronic)
광학재료(optical) 구조재료(structural) 생체재료(biomaterials) 구조적 분류: 단결정(single crystal)
다결정(polycrystalline) 결정질( lli i )
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결정질(crystallinity) 비정질(amorphous)
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Chapter 1 - SUMMARY
¾
Use the right materials for the right job.¾
Understand the correlations betweenproperties
structures and processingproperties, structures, and processing.
¾
New design opportunities offered by new materials.¾ Reading - Chapter 1 of Callister
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