Chapter 3: Polycrystalline Microstructures
3.1 Interfacial Tension and Microstructure
Microstructure after sintering is determined by the interfacial tension.
ij = interfacial tension force per unit length between phases i and j.
If we consider an equilibrium between three interfacial tensions:
sine law
a/sin A=b/sin B=c/sinC 1
3.1.1 Wetting Angle
Assume interfacial tension = interfacial energy
= wetting angle
s= solid surface energy
l= liquid surface energy
sl= solid/liquid interfacial energy
Wetting angle: the angle between
solid/liquid and liquid/vapour interfaces when a liquid drop is placed on a solid substrate
> 90: nonwetting
< 90: wetting
= 0: spreading
> 90 < 90 = 0
N.b. force balance only satisfied in x
direction real equilibrium not maintained The smaller (higher wettability)
enhanced densification in liquid phase sintering
improved bonding in soldering/brazing
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3.1.2 Dihedral Angle
Dihedral angle: the angle at the junction between two grains
b = grain boundary energy of phase
= interfacial energy between and phases
= dihedral angle
• Solid/solid, solid/liquid and solid/vapour
systems also reach an equilibrium defined by the surface energies.
• If a polycrystalline solid is immersed in a liquid or vapour, grooves form where grain boundaries meet the surface.
• is determined only by i.e. is independent of pressures in the phases.
• If is a vapour, is > 120, because s > b
• Usually s 2 - 3 b and 150
Dihedral angles also exist at internal inclusions.
Solid grain
Solid grain Solid grain
Distribution of dihedral angles where grain boundaries meet the surface
A range of dihedral angles will exist:
b (ss) varies with grain misorientation
sv and sl vary with crystal orientation
For ceramics, can be < 120 i.e. s (sv)< b May be due to:
bond distortion at grain boundaries;
differences in impurity adsorption.
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3.2 Single-Phase Microstructures
Microstructure is determined by grain boundary energy b.
For an equilibrium grain shape (i.e. all grains have same shape, size and b is constant), the microstructure must:
1. Minimize total interfacial area under interfacial tension equilibrium 2. Completely fill space without voids (holes)
For constant b, = 120.
In 2D, equilibrium grain shape is a hexagon.
In 3D, no equilibrium grain shape exists.
Closest shape is a tetrakaidecahedron (truncated octahedron)
When packed in bcc lattice, space is completely filled but interfacial tension equilibrium is not met.
d
d
Grain Boundary as Dislocation Array:
Small (Low)-angle grain boundary
sin (θ/2) = b/(2d)
θ/2 b/2d θ b/d
sin x x for small x e.g. Tilt (: misorientation) boundary with edge dislocations
at intervals of d
b changes with crystallographic orientation between grains.
b is not constant and microstructure can vary locally.
However, in reality:
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e.g.) Tetrahedron C = 4
E = 6 P = 4 B = 1
4 - 6 + 4 - 1 = 1
All microstructures satisfy Euler's law
C - E + P - B = 1
C = corner E = edge P = polygon
B = body (i.e. 3D shape)
For a 2D figure, C - E + P = 1
e.g.) Hexagon C = 6
E = 6 P = 1
6 - 6 + 1 = 1
Schematic 2D microstructure 3 polygons meet at each point:
nP
nE
CC
3
Pn = no. of polygons with n edges
EC = no. of partially shared corners at edge of figure
2 polygons meet at each edge:
nP
nE
BE
2
EB = no. of unshared edges at edge of figure
If we put these equations into Euler's law:
( 6 n ) P
n E
B 6
If P = total no. of polygons and pn = fraction of n-sided polygons, then:
( 6 n ) p
n ( 6 E
B) / P
If P is large, then:
( 6 n ) p
n 0
The average grain is a hexagon and polygons are distributed to satisfy this e.g. if a 3-sided grain is present, there must also be a 9-sided grain or two grains with 7 and 8 sides. 8
Polygons with > 6 sides have concave boundaries Polygons with 6 sides have flat boundaries
Polygons with < 6 sides have convex boundaries
Concave boundaries migrate outwards grain grows
Convex boundaries migrate inwards grain shrinks
3.3 Multiphase Microstructures
= 150? = 90? = 60?
= 30? = 0?
More than one phase e.g. solid + liquid, solid + gas (pore), solid + liquid + gas Microstructure determined by
equilibrium among interfacial tensions.
Shape of second phase at 3-grain junction (triple junction) depends on dihedral angle .
Distribution of 2nd phase in a 2D microstructure
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In a 3D microstructure:
> 60: isolated second phase.
60: continuous network along
grain edges. > 60 60
As , grain boundary (i.e. solid/solid) area
W-Ni-Fe heavy alloy
W(Ni, Fe) grains
Ni-Fe-W 2nd phase
Matrix network after sintering
If = 0:
liquid phase at all grain boundaries:
all grains are separated.
Some (low energy) grain boundaries remain.
Wet and dry boundaries can coexist.
anisotropy in gb & sl
W-Ni-Fe heavy alloy
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Thickness of liquid films 1-2 nm.
Liquid films can form at dry grain boundaries and thicken during grain growth.
1350C, 5 hrs
1350C, 20 hrs
1350C, 50 hrs
BaTiO
3Causes: accumulation of segregated impurities penetration of liquid phase at triple junctions into grain boundaries.
BaTiO3
For given values of and 2nd phase volume fraction, the grains change shape to obtain minimum interfacial energy.
E = total interfacial energy per grain Ag = grain boundary area
Am = grain-matrix interface area
g = grain boundary energy
m = grain/matrix interfacial energy
m m g
g
A A
E 2
1
Park and Yoon* calculated E as a function of matrix volume fraction Vm and .
Vm For > 90, m >> g and E as Vm
For = 0, m << g and E as Vm
For 0 < < 90, E vs. Vm curve has a minimum.
As E , grain shape becomes more rounded.
*H.H. Park and D. Y. Yoon, Metall. Trans. A, 16, 923-28 (1985)
Minimum
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If is > 90, the 2nd phase will exude from (come out of) the sample. All boundaries will be solid/solid grain boundaries.
For 0 < < 90, the sample will contain solid/solid grain boundaries and solid/matrix interfaces. Any excess liquid (beyond the minimum point of the E vs.
Vm curve) will remain outside the sample during and after sintering.
For = 0, all boundaries will be solid/matrix interfaces.
Exuded liquid phase after liquid phase sintering a system with
high
N.b. matrix phase can be liquid or vapour
Vm
If E vs. V
mcurve isn't at minimum point:
• there will be a driving force to reach the minimum point
• the grains will try to change shape to reduce E.
Vg
m g
m
e
V
E V
P V
1
2P
e= effective pressure
V
m= volume fraction of matrix V
g= volume of grain
E = total interfacial energy of grain For const. V
gand variable V
m:
P
epushes grains to achieve minimum E by changing shape.
If is small, there is a limiting porosity in solid state systems.
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