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Stress mode proposal for an efficient ESD test

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Fig.  1  Failure  Damage  Mechanism          (a)  Oxide  rupture (b)  Thin  film  burn-out (c)  filamentation (d)  Junction  spiking다.2
Fig.  5  Typical  I/V  characteristic  used  for  ESD  protection  design
Fig.  6  Normal/failure  characteristic  curve  (a)  short      (b)functional  degradation

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