• 검색 결과가 없습니다.

Synthesis and Characterization of SnO2 Thin Films Deposited by Plasma Enhanced Atomic Layer Deposition Using SnCl4 Precursor and Oxygen Plasma

N/A
N/A
Protected

Academic year: 2021

Share "Synthesis and Characterization of SnO2 Thin Films Deposited by Plasma Enhanced Atomic Layer Deposition Using SnCl4 Precursor and Oxygen Plasma"

Copied!
1
0
0

로드 중.... (전체 텍스트 보기)

전체 글

(1)

254 한국진공학회

TW-P004

Synthesis and Characterization of SnO2 Thin Films Deposited

by Plasma Enhanced Atomic Layer Deposition

Using SnCl4 Precursor and Oxygen Plasma

이동권, 김다영, 권세훈

부산대학교 재료공학과

Tin dioxide (SnO2) thin film is one of the most important n-type semiconducting materials having a high transparency and chemical stability. Due to their favorable properties, it has been widely used as a base materials in the transparent conducting substrates, gas sensors, and other various electronic applications. Up to now, SnO2 thin film has been extensively studied by a various deposition techniques such as RF magnetron sputtering, sol-gel process, a solution process, pulsed laser deposition (PLD), chemical vapor deposition (CVD), and atomic layer deposition (ALD) [1-6]. Among them, ALD or plasma-enhanced ALD (PEALD) has recently been focused in diverse applications due to its inherent capability for nanotechnologies. SnO2 thin films can be prepared by ALD or PEALD using halide precursors or using various metal-organic (MO) precursors. In the literature, there are many reports on the ALD and PEALD processes for depositing SnO2 thin films using MO precursors [7-8]. However, only ALD-SnO2 processes has been reported for halide precursors and PEALD-SnO2 process has not been reported yet.

Herein, therefore, we report the first PEALD process of SnO2 thin films using SnCl4 and oxygen plasma. In this work, the growth kinetics of PEALD-SnO2 as well as their physical and chemical properties were systemically investigated. Moreover, some promising applications of this process will be shown at the end of presentation.

참조

관련 문서

In this paper, iCVD (Initiated Chemical Vapor Deposition), which can deposition in low temperature and low vacuum environments and has high step coverage, is used as a

mould with rapid and uniform cooling characteristics using the deposition of the multi-materials based on the direct metal rapid tooling process.. In order

Directed Energy Deposition (DED) processes selectively dissolve and solidify the material using a high density energy source to produce a desired product. In

The sublimation purification method is similar to the vapor deposition process ,in which crystallization occurs after evaporation from a solid state to a

A direct energy deposition (DED) process, which is one of the additive manufacturing processes, is advantageous in remanufacturing because a molten-pool

Lee, “Effective Ag Doping by He-Ne Laser Exposure to Improve the Electrical and the Optical Properties of CdTe Thin Films for Heterostructured Thin Film

Surface characteristics of hydroxyapatite coated Ti-40Ta-xNb alloys by plasma electrolytic oxidation and sputtering

Improvement of the Performance and Stability of Oxide Semiconductor Thin-Film Transistors Using Double-Stacked Active Layers.. Metal oxide semiconductor